M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
부품 번호: M1AFS1500-1FG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425.73 | $425.73 |
| 10 | $404.44 | $4,044.40 |
| 100 | $383.16 | $38,316.00 |
| 500 | $361.87 | $180,935.00 |
| 1,000 | $340.59 | $340,590.00 |
M1AFS1500-1FG676I 개요
A Fusion mixed-signal FPGA is a field-programmable gate array that integrates programmable logic fabric with configurable analog blocks, large flash memory, and clock management circuitry on a single monolithic die. Within the power-management hierarchy of embedded systems, an FPGA sits above discrete logic ICs as a programmable system-on-chip platform, and the Fusion family uniquely extends this with analog peripherals such as ADCs, voltage and current monitors, and temperature sensors implemented in flash-based configurable fabric built on 130nm CMOS process technology.
Key differentiating features include flash-based configuration (live at power-up, no external boot PROM required), integrated configurable analog subsystem, comprehensive clock generation and management circuitry, and large on-chip flash memory blocks. The 252 I/O support multiple signaling standards for board-level integration, and the industrial -40C to +85C rating suits harsh-environment deployments.
Technically, the M1AFS1500 uses a flash-based fabric that is inherently secure and non-volatile, with the M1 prefix denoting Fusion devices; per Microchip product documentation, the family integrates Cortex-M1, Pigeon Point, and MicroBlade soft-processor options across related speed grades and packages. The -1 speed grade defines maximum timing performance, with 676-ball FBGA ball pitch supporting high-density routing.
Typical applications include industrial automation control, power-supply and battery-system monitoring, mil/aero embedded control, and instrumentation requiring both logic and analog sensing in one device.
Design consideration: this RoHS Non-Compliant (lead-containing) part is generally restricted to exempt markets such as military and aerospace; verify compliance scope before commercial use.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: M1AFS1500-1FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-1FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Family, Package, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-2FG676I
✅ 드롭인✓ 재고 있음
$405 / 개
데이터시트 보기 →M1AFS1500-1FGG676I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-FG676I
✅ 드롭인✓ 재고 있음
$425.73 / 개
데이터시트 보기 →M1AFS1500-1FGG676
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS1500-FGG676I
✅ 드롭인✓ 재고 있음
$89.9 / 개
데이터시트 보기 →M1AFS1500-2FGG676I
✅ 드롭인✓ 재고 있음
$59.6 / 개
데이터시트 보기 →M1AFS1500-FG676
✅ 드롭인✓ 재고 있음
$372 / 개
데이터시트 보기 →M1AFS1500-1FG676I 최대 정격 & 전기적 특성
| Manufacturer Part Number | M1AFS1500-1FG676I |
| Manufacturer | Microchip Technology (Microsemi) |
| Product Type | Fusion Mixed-Signal FPGA |
| Number of Gates | 1.5 M |
| Number of I/O | 252 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | -1 |
| 패키지 / 케이스 | 676-Pin FBGA |
| 장착 스타일 | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| 습도 민감도 레벨 (MSL) | 3 (168 Hours) |
| Peak Reflow Time | 30 s |
| Packaging | Tray |
| RoHS 상태 | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
M1AFS1500-1FG676I 676-pin fbga 핀 구성 가이드
M1AFS1500-1FG676I(676-pin fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-1FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-1FG676I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Power Supply and Battery Management Monitoring, Military and Aerospace Embedded Control, Test and Measurement Instrumentation, Medical Diagnostic Equipment Monitoring, Networking and Communication Line Cards.
Industrial Automation Control
The M1AFS1500-1FG676I fits industrial automation because its 1.5M-gate flash fabric and 252 user I/O consolidate PLC I/O logic, sensor aggregation, and supervisory sequencing in one die, while the -40C to +85C industrial grade covers unconditioned factory cabinets. The Fusion integrated analog subsystem reads voltage, current, and temperature channels directly, removing external monitor ADCs from the control board. In use, the non-volatile flash configuration makes the controller live at power-up with no boot PROM delay, and clock management circuitry synchronizes fieldbus and backplane timing. The trade-off is the 130nm fabric clock ceiling, which suits deterministic control rather than high-throughput datapaths.
추천
Power Supply and Battery Management Monitoring
Fusion FPGAs were explicitly designed for intelligent power management: the M1AFS1500-1FG676I integrates configurable analog channels for voltage, current, temperature, and gate-drive monitoring alongside 1.5M gates of sequencing logic, so a single device supervises multi-rail power supplies and battery stacks. The 252 I/O drive fets, alarms, and PMBus-style interfaces, while the -40C to +85C rating suits telecom rectifiers and outdoor energy cabinets. Because configuration is flash-based, protection policies are active the instant power appears - critical for fault response in hot-swap systems. Designers should budget for the leaded-package RoHS exemption scope in commercial power products.
추천
Military and Aerospace Embedded Control
The leaded construction of M1AFS1500-1FG676I, typically supplied under defense exemptions, aligns with military and aerospace procurement where RoHS restrictions do not apply. Its non-volatile flash fabric offers inherent bitstream security and instant-on operation valued in avionics and unmanned platforms, and the industrial -40C to +85C range supports unheated compartments. The 1.5M-gate fabric implements sensor interface glue logic, telemetry framing, and safety interlocks, while the Fusion analog subsystem monitors rail health and board temperature in flight. The monolithic integration of analog, flash, and logic reduces piece-part count - a reliability advantage for high-altitude and vibration-prone environments.
추천
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-1FG676I's mix of 1.5M gates for trigger engines, acquisition decoders, and bus interfaces, plus on-chip analog monitors for self-calibration telemetry. The 252 I/O connect to front-panel buttons, display buses, and high-pin-count capture paths, while integrated clock management generates synchronized sample and interface clocks without extra PLL chips. Flash configuration gives instant-on readiness expected in laboratory equipment, and the 676-ball FBGA provides dense routing for high signal-count boards. Designers should note MSL 3 handling - boards must be reflowed within 168 hours of bag opening or re-baked.
추천
Medical Diagnostic Equipment Monitoring
In medical diagnostic platforms such as lab analyzers and imaging support racks, the M1AFS1500-1FG676I supervises system rails, lamp or motor currents, and enclosure temperature using its integrated analog channels, while the 1.5M-gate fabric runs interface glue logic and safety interlock state machines. The -40C to +85C industrial grade covers cold-chain transport and autoclave-adjacent environments, and non-volatile flash configuration ensures monitoring is active from first power. Deterministic single-chip integration of sensing and control shortens IEC 60601 safety-rationale documentation compared to discrete analog-plus-CPLD stacks. Verify lead-free plating requirements for applicable markets.
추천
Networking and Communication Line Cards
The M1AFS1500-1FG676I serves as system-controller fabric on telecom and networking line cards, handling power sequencing across multiple rails, hot-swap supervision, and chassis management interfaces using 252 I/O and the Fusion analog monitors. The 676-ball FBGA offers ample I/O for backplane connectivity and front-panel LEDs, while flash-based configuration provides live-at-insertion behavior demanded by carrier-grade hot-pluggable equipment. Clock management circuitry synchronizes management-channel timing without external PLL devices. The 1.5V core suits card power budgets, though the leaded package should be screened against RoHS scope for commercial telecom products - consider the GGG lead-free variants where required.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-1FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-2FG676I | M1AFS1500-1FGG676I | M1AFS1500-FG676I | M1AFS1500-FGG676I |
|---|---|---|---|---|---|
| Package | 676-Ball FBGA | 676-Ball FBGA - same | 676-Ball FBGA - same | 676-Ball FBGA - same | 676-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | -1 | -2 (faster) | -1 | standard | standard |
| RoHS / Lead Status | RoHS Non-Compliant (contains lead) | leaded construction | lead-free, RoHS compliant | leaded construction | lead-free, RoHS compliant |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Industrial temperature rating with -1 speed grade (vs M1AFS1500-FG676I)
- Leaded construction for defense-exempt programs (vs M1AFS1500-1FGG676I)
- Cost-optimized speed point (vs M1AFS1500-2FG676I)
설계 노트
The 676-ball FBGA requires controlled-impedance multilayer PCB construction; plan microvia or 0.5 mm-pitch-capable fanout under the device. Because the package is MSL 3 (168 hours), boards must be reflowed within 168 hours of moisture-barrier-bag opening or baked per IPC handling practice before reflow - a 30-second peak reflow window applies. Reserve perimeter balls for power/ground star connections and dedicate internal layers to core (1.5V), I/O, and ground planes to manage simultaneous-switching noise across 252 I/O.
The 1.5V core rail must be sequenced and regulated per the Fusion family power-up requirements published in the manufacturer datasheet; follow the datasheet's recommended power-supply sequencing order for core, I/O, and analog rails to avoid latch-up. Because Fusion integrates configurable analog monitoring, use it to observe rail health during prototype bring-up rather than adding external supervision ICs. Estimate core current budget from your design utilization using Libero SoC power analysis tools before selecting the 1.5V regulator.
The most common sourcing pitfall is confusing the -1FG676I (leaded, RoHS Non-Compliant) with the -1FGG676I (lead-free, RoHS compliant) suffixes - they are electrically identical but not interchangeable for compliance purposes, and reflow profiles differ because lead-free BGA balls need higher peak temperatures. Confirm your board's reflow profile matches the chosen plating variant before dual-sourcing. Also verify speed-grade timing closure: migrating from -1 to standard grade requires re-running static timing in Libero SoC.
규정 준수 정보
Per DigChip datasheet records: Lead Free Status 'Contains Lead', RoHS Status 'RoHS Non-Compliant'. Common for defense-exempt Microsemi Fusion parts; lead-free GG suffix variants exist for RoHS markets.
