M1AFS1500-FG256 - 1.5M Gate Mixed-Signal FPGA, 119 I/O | Microchip
부품 번호: M1AFS1500-FG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $426.82 | $426.82 |
| 10 | $405.48 | $4,054.80 |
| 100 | $384.14 | $38,414.00 |
| 500 | $362.8 | $181,400.00 |
| 1,000 | $341.46 | $341,460.00 |
M1AFS1500-FG256 개요
A mixed-signal FPGA is a field-programmable gate array that combines flash-based programmable logic fabric with configurable analog blocks, memory, and clock management circuitry on a single monolithic die. Within the programmable logic hierarchy (FPGA -> programmable SoC -> programmable logic semiconductor), the Fusion family is unusual in integrating analog peripherals such as ADCs, voltage and current monitors, RTC, and large flash memory blocks alongside the fabric.
Key features of the M1AFS1500 variant include the largest fabric of the standard Fusion lineup, an embedded ARM Cortex-M1 soft processor option, flash-based configuration (no external boot device required), and comprehensive on-chip clock generation and management. The 130nm flash technology gives instant-on, non-volatile operation valued in power-sensitive and security-conscious systems.
The architecture mitigates ASIC migration at higher volumes, making Fusion a cost-effective ASIC replacement for consumer, networking and communications, computing, and avionics markets, according to the manufacturer datasheet.
Typical applications include industrial control with analog monitoring, embedded processing with the Cortex-M1, power-supply supervision, and secure system control.
Design consideration: confirm the FG256 pin map against the 334-page Fusion family datasheet, since only devices sharing the same package are pin compatible (with the PQ208 exception for AFS250/AFS600).
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet. Pricing references are as of 2026-09-02.
드롭인 대체품: M1AFS1500-FG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-FG256 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, System Gates, Configuration, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS1500-2FG256
✅ 드롭인✓ 재고 있음
$280.68 / 개
데이터시트 보기 →M1AFS1500-1FG256
✅ 드롭인✓ 재고 있음
$191.42 / 개
데이터시트 보기 →M1AFS1500-FG256I
✅ 드롭인✓ 재고 있음
$341.46 / 개
데이터시트 보기 →M1AFS1500-1FG256I
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →M1AFS1500-1FGG256K
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS600-1FGG256
✅ 드롭인✓ 재고 있음
$191.1 / 개
데이터시트 보기 →M1AFS250-1FG256
✅ 드롭인✓ 재고 있음
$117.83 / 개
데이터시트 보기 →M1AFS1500-FG256 최대 정격 & 전기적 특성
| Manufacturer Part Number | M1AFS1500-FG256 |
| Family | Fusion Mixed-Signal FPGA (M1 series) |
| System Gates | 1.5 M |
| User I/O | 119 |
| Flash Memory Bits | 276480 |
| Embedded Processor | ARM Cortex-M1 |
| Process Technology | 130 nm flash |
| 동작 공급 전압 | 1.5 V |
| 패키지 | 256-LBGA (FBGA) |
| 장착 스타일 | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Packaging | Tray |
| Analog Peripherals | Configurable analog block (Fusion family) |
| Configuration | Flash-based (non-volatile, instant-on) |
M1AFS1500-FG256 256-lbga (fbga) 핀 구성 가이드
M1AFS1500-FG256(256-lbga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-FG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-FG256 적합 용도: 6 애플리케이션s: Industrial Control and Monitoring, Embedded Processing with ARM Cortex-M1, Power Supply Supervision and Sequencing, Avionics and Secure System Control, Networking and Communications, ASIC Replacement in Volume Production.
Industrial Control and Monitoring
The M1AFS1500-FG256 fits industrial controllers that need both digital sequencing and analog supervision on one chip: its Fusion analog block monitors multiple voltage and temperature channels while the 1.5M-gate flash fabric implements motor sequencing, interlock logic, and communication glue logic, and the 119 user I/Os drive relays and sensors. In a typical build, the FPGA sits between backplane 24V systems and local analog sensors, with the 1.5V core supplied by a point-of-load buck converter; instant-on flash configuration means the interlock logic is active within microseconds of power apply, a quantified safety benefit over SRAM FPGAs that need configuration boot time.
추천
Embedded Processing with ARM Cortex-M1
Designs requiring a hardened-software workflow instantiate the ARM Cortex-M1 soft processor inside the M1AFS1500-FG256 flash fabric, running control firmware next to custom peripherals implemented in the same 1.5M-gate fabric. Because configuration is stored in on-chip flash, the processor begins executing code immediately at power-up - there is no external boot flash fetch delay, which matters in applications with sub-100ms reset-to-operation requirements. The FG256 package provides sufficient I/O for external memory and peripheral expansion around the 119 user I/Os. Firmware developers use standard ARM toolchains while FPGA engineers work in Libero SoC, enabling parallel team workflows on a single die.
추천
Power Supply Supervision and Sequencing
The Fusion analog block in the M1AFS1500-FG256 monitors multiple power rails with on-chip voltage monitors, while the digital fabric implements programmable sequencing and fault-response logic - a combination that replaces discrete supervisors plus a small CPLD. A typical rail-up sequence of 5 to 8 supplies is programmed in the flash fabric; thresholds are adjustable in the analog configuration, and fault logs are retained in the 276480-bit flash. Because the device is non-volatile and instant-on, supervision is active before other rails stabilize. Placing the FG256 device near the power tree keeps analog sense routing short and reduces noise pickup on monitored channels.
추천
Avionics and Secure System Control
Fusion flash FPGAs were designed with avionics and secure-control requirements in mind: flash-based configuration is inherently resistant to bit-stream readback attacks compared to SRAM FPGAs, and the instant-on property suits power-constrained flight modules. The 1.5M-gate M1AFS1500-FG256 implements missile-guidance glue logic, actuator interfaces, or system health monitoring within the 0C to +70C commercial rating (use the FG256I industrial variant for wider ranges). According to the Microsemi datasheet, the family explicitly targets avionics markets as an ASIC replacement, letting designers patch logic in fielded units by reprogramming flash instead of respinning ASICs.
추천
Networking and Communications
The M1AFS1500-FG256 serves line-card management, backplane control, and framing glue logic in networking equipment. The fabric clock management circuitry generates and conditions multiple clock domains from board references, while 119 I/Os handle low-speed management interfaces (MDIO, I2C, UART) alongside the mixed-signal block monitoring card power and temperature. Flash configuration allows a line card to be ready for fabric synchronization immediately on hot-swap insertion, a measurable advantage for carrier-grade systems specifying sub-second service availability. The 130nm fabric comfortably covers 100-200 MHz class logic for Gigabit-scale management datapaths.
추천
ASIC Replacement in Volume Production
For products shipping at volumes that no longer justify ASIC NRE, the M1AFS1500-FG256 provides a cost-effective migration target: the 1.5M-gate fabric absorbs designs originally prototyped on smaller Fusion devices, and the FG256 footprint is shared across the family so PCBs designed for AFS250 or AFS600 can be populated with the AFS1500 without layout change - per the Microsemi datasheet, Fusion devices in the same package are pin compatible. The monolithic integration of analog, flash, clocking, and logic removes several discrete BOM lines, and consumer, computing, and communications products benefit from single-sourcing the mixed-signal control function.
추천
추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-FG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS1500-2FG256 | M1AFS1500-FG256I | M1AFS600-1FGG256 | M1AFS250-1FG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 600 K | 250 K |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | Standard | -2 (fastest) | Standard | -1 | -1 |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
주요 차별점
- Largest standard Fusion fabric in FG256 footprint (vs M1AFS600-1FGG256)
- Cost-optimized entry point available (vs M1AFS250-1FG256)
- Faster timing with -2 grade (vs M1AFS1500-2FG256)
- Industrial temperature option (vs M1AFS1500-FG256I)
설계 노트
The M1AFS1500-FG256 operates from a 1.5V core supply with additional Fusion rail requirements (analog and I/O banks) detailed in the 334-page Fusion family datasheet. Estimated: flash-based Fusion fabrics draw negligible static configuration current, but core dynamic current scales with clock frequency and utilization - budget core current at maximum toggling rate using Libero power analysis before finalizing the point-of-load regulator. Never apply I/O voltages before the core rail in violation of the datasheet power-up ordering, or latch-up risk increases.
The 256-ball LBGA requires a correct footprint land pattern per the FG256 package drawing in the Fusion datasheet. Because the whole Fusion family is pin compatible in FG256 (except the PQ208 exception), lay out decoupling and pin strap circuits to accept any family member - this enables future density changes (AFS250 to AFS1500) without PCB respin. Use a via-in-pad or dog-bone escape strategy for the full 256-ball array, with at least 0.1uF ceramic capacitors at core supply balls.
Do not confuse speed-grade and temperature suffixes when purchasing: M1AFS1500-FG256 (standard grade, 0C to +70C), -1, -2 grades, the I suffix (industrial temperature), and the K suffix are all distinct orderable parts in the same package. Dropping a -2 design onto a standard-grade device will fail static timing. Also confirm the -I variant timing tables, since industrial-grade timing differs from commercial-grade in the datasheet.
규정 준수 정보
Compliance status not stated in retrieved distributor data for this mature Fusion part. Obtain material declarations from the official Microchip product page.
