M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
MPN: M1AFS600-1FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $232.75 | $2,327.50 |
| 100 | $215.6 | $21,560.00 |
| 500 | $203.35 | $101,675.00 |
| 1,000 | $191.1 | $191,100.00 |
Drop-in alternatives for M1AFS600-1FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS600-1FGG256I
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M1AFS600-2FGG256
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View Datasheet →M7AFS600-1FGG256
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$92 / Unit
View Datasheet →M7AFS600-FGG256I
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View Datasheet →M1AFS250-1FGG256I
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View Datasheet →M1AFS1500-1FGG256
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$172.23 / Unit
View Datasheet →A3P600-1FG256I
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$41.8 / Unit
View Datasheet →M1AFS600-1FGG256 Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| Processor Core | ARM Cortex-M1 (hard core) |
| System Gates | 600000 |
| Configurable Logic Blocks (CLBs) | 13824 |
| Flip-Flops | 110592 |
| User I/O | 119 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS, flash-based |
| Configuration Memory | Flash (non-volatile, live at power-up) |
| Operating Temperature | 0C to +85C |
| Package | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| Mounting Type | Surface Mount |
| Analog Features | Configurable analog blocks, clock generation and management |
| RoHS Status | Compliant |
| Packaging | Tray |
M1AFS600-1FGG256 256-ball lbga (fgg256), 17x17x1.7 mm Pin Configuration Guide
Complete pinout information for M1AFS600-1FGG256 (256-ball lbga (fgg256), 17x17x1.7 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS600-1FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS600-1FGG256 is suitable for 6 applications: Industrial Control and Automation, Smart Grid and Power Metering, Motor Control and Drives, Medical and Diagnostic Instrumentation, Aerospace and Rugged Embedded Systems, Embedded System Prototyping and Education.
Industrial Control and Automation
The M1AFS600-1FGG256 fits industrial controllers that need deterministic logic, an embedded processor, and analog sensing on one chip. Its 13,824 CLBs implement state machines and interface glue logic while the ARM Cortex-M1 runs the control loop, and the configurable analog blocks monitor voltages and temperatures in situ. Flash-based configuration means the controller is functional the instant 1.5V core power is applied - no boot latency, which matters for safety-related I/O. With 119 user I/O in a 17x17 mm footprint, it can drive relays, RS-485 transceivers, and encoder inputs directly. Designers should budget I/O banks for 3.3V or 2.5V signaling and verify the 0C to +85C commercial grade against enclosure ambient temperatures.
Recommended
Smart Grid and Power Metering
Fusion FPGAs were designed for power monitoring: the M1AFS600-1FGG256's monolithic configurable analog can gate, sample, and digitize sensed signals while flash logic performs accumulation and the Cortex-M1 handles protocol and calibration. Microchip's Fusion datasheet positions these devices specifically for power-management applications where analog supervision and digital computation must be tightly coupled. The non-volatile flash configuration survives brown-outs, and clock management circuitry supports precise timekeeping for tariff metering. In a metering front end, the FPGA conditions ADC streams and computes RMS values in fabric with microsecond determinism that a pure MCU cannot match. Verify the commercial 0C to +85C range suits the meter enclosure or select the -I industrial variant for outdoor installations.
Recommended
Motor Control and Drives
Motor drive systems benefit from the M1AFS600-1FGG256's combination of hard ARM Cortex-M1 processing for the speed/position loop and flash fabric for gate-drive PWM generation with nanosecond-scale timing. The configurable analog blocks provide voltage and current monitoring that can trip protection logic in fabric without software latency - a critical safety path for inverter bridges. At 1.5V core and flash-based low static power, drive electronics run cooler than SRAM FPGA equivalents. The 119 user I/O support encoder feedback, Hall inputs, and gate driver interfacing. Engineers should place the device away from switching nodes, ground its analog balls to a quiet reference plane, and confirm timing closure at the -1 speed grade for the chosen PWM carrier frequency.
Recommended
Medical and Diagnostic Instrumentation
Portable diagnostic instruments use the M1AFS600-1FGG256 to merge sensor acquisition, digital filtering, and system control in a single 17x17 mm device, conserving board space in handheld housings. Flash configuration delivers instant-on operation and eliminates the configuration-flash failure mode that matters in battery-powered medical devices. The Cortex-M1 core runs UI and communication stacks while fabric implements fixed-latency DSP pipelines for signal conditioning, using the on-chip flash memory blocks for coefficient storage. Low static power extends battery life compared to SRAM FPGAs that leak current through configuration cells. Note the commercial 0C to +85C rating covers typical clinical environments; laboratory bench instruments can also use the same footprint's industrial variants for added margin.
Recommended
Aerospace and Rugged Embedded Systems
While this commercial-grade unit targets terrestrial applications, the flash-based Fusion architecture it belongs to was explicitly developed for high-reliability programs: non-volatile flash configuration resists configuration upset, and single-chip integration of analog, memory, and logic reduces part count on weight-critical boards. Avionics and satellite designers frequently select FGG256-packaged Fusion parts to minimize board area and use the Cortex-M1 core for flight software while fabric handles deterministic I/O. Designers should select the appropriate temperature/quality grade variant of the same die and package for the specific environment and consult Microchip's military/aerospace documentation for qualification data. The identical FGG256 footprint allows commercial prototyping boards to migrate to screened parts without PCB respin.
Recommended
Embedded System Prototyping and Education
The M1AFS600-1FGG256 is attractive for advanced prototyping and university courses because one chip exposes FPGA fabric, a real ARM Cortex-M1 processor, and configurable analog - letting students implement SoC concepts without multi-chip boards. Libero SoC tooling supports both HDL design and soft/hard processor software development, so a single project teaches RTL, embedded C, and mixed-signal supervision. Flash programming means designs persist through power cycles on the bench, and the 256-ball package can be hand-assembled on four-layer prototype PCBs with standard BGA rework or factory assembly. At 1.5V core with modest 0C to +85C requirements, no exotic thermal design is needed. Educational budgets benefit from the M1AFS250 derivatives sharing the same footprint and toolchain.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS600-1FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS600-1FGG256I | M1AFS600-2FGG256 | M7AFS600-1FGG256 | M1AFS1500-1FGG256 | A3P600-1FG256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) 17x17x1.7 mm | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-ball FBGA (FG256) - same ball count footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Microsemi legacy) |
| System Gates | 600K | 600K | 600K | 600K | 1.5M | 600K |
| Processor Core | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M7 | ARM Cortex-M1 | None (soft cores only) |
| Configurable Analog | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | [DATA_NEEDED] | 0C to +85C | -40C to +100C (industrial) |
| Speed Grade | -1 | -1 | -2 (slower) | -1 | -1 | -1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Unit Price (qty 1) | $245.00 as of 2026-09-02 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Only Fusion 600K device in the FGG256 footprint combines Cortex-M1 plus configurable analog (vs A3P600-1FG256I)
- Industrial temperature option without respin (vs M1AFS600-1FGG256I)
- Embedded processor performance ceiling (vs M7AFS600-1FGG256)
Design Notes
Estimated: budget the 1.5V core rail using Microchip's power calculator (Libero SmartPower) rather than assuming static values - flash-based Fusion devices draw low static current, but dynamic power scales with fabric utilization and clock frequency. Provide dedicated 1.5V, 2.5V (I/O), and 3.3V (auxiliary) rails with at least 22 uF bulk plus 0.1 uF ceramic decoupling per power ball group. Sequence supplies per the Fusion datasheet power-up requirements to avoid latch-up during ramp.
The 256-ball FGG256 at 17x17 mm with 1.0 mm ball pitch requires at least a four-layer PCB with dedicated ground plane and via fan-out (dog-bone or via-in-pad) for BGA escape. Connect the analog balls' ground references to a quiet analog island, isolating them from switching return currents - the configurable analog blocks' accuracy depends on clean reference grounding. Keep crystal and clock traces short and guarded per the datasheet layout guidance.
Do not confuse the '-1' speed grade suffix with a temperature code: -1 is the commercial speed grade and the base M1AFS600-1FGG256 is rated only 0C to +85C. Selecting the -I (industrial) variant changes only the grade, not the footprint. Also remember flash programming requires the Libero toolchain and programmer hardware; unlike SRAM FPGAs, JTAG configuration behavior differs at power-up since the design is live immediately.
Estimated: at typical mixed-signal utilization (under 50% fabric toggle at moderate clock rates), junction dissipation is usually low enough that a solid ground-plane copper pour under the BGA suffices without heatsink. For high-utilization, high-frequency designs, run Libero SmartPower estimates and verify junction temperature stays within the 0C to +85C commercial envelope with margin; step up to the industrial variant for extra thermal headroom.
Compliance Information
Newark listing explicitly states 'RoHS Compliant: Yes' for M1AFS600-1FGG256. REACH, halogen-free, and conflict-minerals declarations were not found in the provided data.
