M2GL005-FG484 - 6K LEs, 209 I/O IGLOO2 FPGA | Microchip
부품 번호: M2GL005-FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.0277 | $11.03 |
| 10 | $16.5 | $165.00 |
| 100 | $16.5 | $1,650.00 |
| 500 | $16.5 | $8,250.00 |
| 1,000 | $16.5 | $16,500.00 |
M2GL005-FG484 개요
An FPGA is a programmable semiconductor containing configurable logic, memory, and programmable I/O. Within the product hierarchy, the M2GL005-FG484 is a field-programmable gate array, a low-density FPGA, and a member of Microchip's IGLOO2 family. Its flash-based configuration allows the device to retain its programmed logic after power is removed, reducing the need for external configuration memories in standalone control or bridging systems.
The verified data identifies 209 user I/O and 6,060 logic elements, providing substantial interface density for conversion, bridging, control, and system-management functions. The FG484 package supports high-pin-count board layouts while keeping the component compact at 23 mm × 23 mm. Compared with a smaller FPGA package, the principal advantage is I/O accessibility; compared with a larger FPGA, the M2GL005 provides a lower logic capacity and a simpler implementation target.
Microchip positions IGLOO2 devices for bridging functions, I/O expansion and conversion, system management, secure connectivity, Gigabit Ethernet or dual PCI Express control planes, and video or image processing. These applications benefit from deterministic hardware logic, parallel interface handling, and reconfigurable hardware that can be updated without replacing the assembled board.
The 1.2 V core supply makes board-level power design sensitive to ripple, sequencing, and decoupling. A 484-BGA device also demands careful escape routing, multilayer PCB construction, and thermal-aware via distribution. The M2GL005-FG484 is therefore appropriate for engineers who need a large, configurable I/O surface in a low-density, nonvolatile FPGA rather than the larger programmable resources of a high-end FPGA.
This page combines verified distributor availability, manufacturer application positioning, same-package alternatives, and practical design considerations for evaluating the Microchip M2GL005-FG484 in communications, industrial, medical, defense, and aviation systems.
드롭인 대체품: M2GL005-FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M2GL005-FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2GL005S-FG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2GL005-1FG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2GL005S-1FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2GL005-FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2GL005-FG484 최대 정격 & 전기적 특성
| Device Type | IGLOO2 Low Density Flash FPGA |
| Logic Elements | 6,060 logic elements |
| User I/O Count | 209 I/O |
| Core Supply Voltage | 1.2 V |
| 패키지 | 484-BGA |
| Package Family | FBGA-484 |
| Package Body Size | 23 mm × 23 mm |
| Package Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| Configuration Memory | Flash |
| Logic Family | IGLOO2 |
| Product Category | Field Programmable Gate Array |
| Programmable Function | General-purpose logic, bridging, I/O expansion and conversion |
| Application Market | Communications, Industrial, Medical, Defense, Aviation |
| RoHS 상태 | Compliant |
M2GL005-FG484 1.0 mm 핀 구성 가이드
M2GL005-FG484(1.0 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M2GL005-FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M2GL005-FG484 적합 용도: 6 애플리케이션s: Industrial Protocol Bridging, Medical-System Management, Communications Control Plane, Video and Image Processing, Secure Connectivity and Encryption, I/O Expansion and Conversion.
Industrial Protocol Bridging
The M2GL005-FG484 fits industrial bridge designs because its 209 user I/O provide parallel resources for joining dissimilar interfaces, while 6,060 logic elements can hold protocol converters, registers, and control logic. The device is especially useful where deterministic hardware timing is preferable to a software-mediated conversion path. Placing the FPGA beside the bridged interfaces can shorten data paths and reduce host processing load. The engineering trade-off is a demanding 484-BGA PCB requirement: the 23 mm × 23 mm, 1.0 mm-pitch package needs multilayer escape routing, disciplined return paths, and adequate thermal spreading. Timing closure should also account for the selected IGLOO2 speed grade and industrial temperature requirements.
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Medical-System Management
The M2GL005-FG484 is suitable for medical-system supervisory logic where monitoring, alarm handling, and peripheral control must operate predictably. Its 209 I/O provide substantial connectivity to sensors, status indicators, and control signals, while the 6,060 logic elements can implement finite-state control and data routing. Because this is an FPGA rather than a fixed microcontroller, the design can update logic as system requirements evolve while retaining its flash configuration. Engineering validation must still confirm the exact device temperature grade, regulatory evidence applicable to the finished product, and failure-mode requirements. The 484-BGA footprint also demands assembly capability suitable for fine-pitch BGA soldering.
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Communications Control Plane
The M2GL005-FG484 can implement communications control-plane, backplane, or interface-conversion functions because Microchip identifies bridging, secure connectivity, system management, and Gigabit Ethernet control-plane applications for IGLOO2 devices. With 6,060 logic elements and 209 I/O, it can combine packet filtering, status logic, and multiple low-speed interfaces in one programmable device. The benefit is hardware-deterministic behavior and reduced external logic. A practical implementation should use the available I/O to minimize high-speed routing complexity, constrain interfaces to supported voltage standards, and validate setup and hold timing against the selected speed grade. Final qualification must check the environmental grade and applicable communications standards for the end product.
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Video and Image Processing
The M2GL005-FG484 can support modest video and image-processing functions where parallel pixel capture, preprocessing, and format conversion are needed. Microchip explicitly lists video and image processing among IGLOO2 application areas, and the device's 209 I/O allows multiple data buses to be handled without a separate bridge FPGA. The 6,060 logic elements make it suitable for pipeline control, thresholding, or compact color-format logic rather than processor-class imaging. Design engineers should establish the pixel clock and I/O timing budget early because high fan-out or unregistered video inputs can constrain achievable throughput. The fine-pitch 484-BGA layout also requires careful impedance control and return-path continuity.
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Secure Connectivity and Encryption
The M2GL005-FG484 is appropriate for small secure-connectivity functions where protocol handling, key-path control, or authentication glue logic must be combined with a high I/O count. IGLOO2 flash configuration allows the programmed design to remain resident after power cycling, while programmable logic can implement secure boot helpers, command filtering, and hardware data paths. The 6,060 logic elements constrain the complexity of algorithms that can be implemented, so designers should separate functions that require substantial parallel arithmetic from tasks better handled by a security microcontroller or dedicated accelerator. The exact security claims should be supported by application-specific validation rather than inferred solely from the FPGA family name.
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I/O Expansion and Conversion
The M2GL005-FG484 is a natural fit for I/O expansion and conversion because 209 user I/O can consolidate wide, mixed-width interfaces that would otherwise require several fixed-function devices. Programmable logic can translate voltage domains at the logical level, generate timing-qualified control signals, and route data among multiple buses. This consolidates board area and makes interface behavior easier to revise than a hardwired bridge. Engineering teams must still verify every external I/O's voltage, drive-strength, and input-threshold requirements using the official pin guide. Signal-integrity review is particularly important when combining high-speed and low-speed buses in one 484-BGA package, with return paths and decoupling planned at the schematic stage.
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추천 제품 요약
엔지니어링 참조 데이터: M2GL005-FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M2GL005-FGG484 | M2GL005S-FG484 | M2GL005-1FG484 | M2GL005S-1FGG484I | M2GL005-FGG484I |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-BGA | 484-BGA - same | 484-BGA - same | 484-BGA - same | 484-BGA - same | 484-BGA - same |
| Device Family | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
주요 차별점
- High user-I/O density in a low-density FPGA (vs LFE2-20E-5F484C)
- Flash-based configuration for standalone retention (vs ATF22V10C-10PU)
- Direct same-package family sourcing (vs M2GL005-FGG484)
설계 노트
The verified package is 484-BGA, 23 mm × 23 mm, with 1.0 mm pitch. Treat the footprint, solder mask, and paste as controlled manufacturing data rather than drawing them from visual approximation. Route escape paths through the shortest practical layers, preserve uninterrupted ground references beneath escape routes, and confirm whether the selected board stack-up supports the required BGA escape geometry before schematic sign-off.
The verified core supply is 1.2 V, but the complete power architecture is not present in the supplied data. Place local high-frequency and bulk decoupling at the device supply balls using the Microchip reference design and pin-information guide as the authority. Verify startup, ramp limits, sequencing, and adjacent I/O voltage domains during power-integrity analysis; do not infer permissible ramp rates or capacitor values from the listing alone.
A 484-BGA exposes substantial electrical connectivity but also concentrates heat around the package. Distribute ground and power vias beneath and within the escape field, use thermal-relief patterns consistent with the manufacturer's assembly guidance, and model the board with actual copper and enclosure conditions. Maximum junction temperature and package thermal resistance were not supplied, so thermal qualification must rely on the official device data and measured board performance.
Do not treat every M2GL005 suffix as automatically interchangeable. The verified alternatives share the 484-BGA footprint, but differences in speed grade, temperature grade, or qualification suffix can change timing margins and application acceptability. Before substitution, compare the complete ordering information, confirm the bitstream target and timing report, and review the official pin and package guide for electrical differences.
규정 준수 정보
The verified comparison result labels the M2GL005-FG484 RoHS compliant. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was supplied for this exact ordering code.
