MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP
부품 번호: MC9S08DN32AMLC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.12 | $512.00 |
| 500 | $4.55 | $2,275.00 |
| 1,000 | $3.98 | $3,980.00 |
MC9S08DN32AMLC 개요
An 8-bit microcontroller (MCU) is a microprocessor core, memory, and peripheral set integrated into a single chip. Within the broader hierarchy, the MC9S08DN32AMLC sits under: 8-bit MCU -> HCS08 family -> S08DN sub-family -> microcontroller -> embedded processor -> semiconductor. Compared with 16-bit and 32-bit MCUs, 8-bit devices offer lower unit cost, simpler toolchains, and deterministic interrupt latency, which remains valuable for cost-sensitive automotive body, appliance, and industrial nodes.
Key features of the MC9S08DN32AMLC include a 20 MHz bus (40 MHz CPU), 25 general-purpose I/O pins, a 12-bit ADC with 2.5 us conversion time, an MSCAN (CAN 2.0 A/B) module, an SCI/UART, an SPI, an I2C bus, and an internal clock generator with a watchdog timer. The device operates across an extended -40 C to +125 C automotive temperature range with multiple low-power stop and wait modes to support energy-constrained nodes.
Technically, the HCS08 core implements the HC08 instruction set with the added BGND instruction for background debug mode. The 32 KB program Flash and 1.5 KB RAM are sufficient for typical CAN-based body control protocols such as door modules, seat controllers, lighting drivers, and HVAC flaps. The integrated CAN module eliminates an external transceiver controller, reducing BOM cost.
Typical applications include automotive body controllers, CAN node endpoints, industrial sensor interfaces, appliance control boards, HVAC actuators, and lighting ballast controllers. The combination of CAN, ADC, and EEPROM on one die simplifies in-vehicle networking nodes that previously needed a 16-bit MCU.
When designing, ensure the MSCAN baud rate prescaler matches the oscillator configuration and that the LQFP-32 thermal pad is soldered to a copper pour to keep junction rise acceptable. Decouple each VDD/VSS pair with a 100 nF ceramic placed within 5 mm of the pin.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with content calibrated for engineers selecting a drop-in replacement.
드롭인 대체품: MC9S08DN32AMLC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08DN32AMLC (동일 폼 팩터 및 풋프린트) — 차이점: Package, Debug Interface, Operating Temperature, Core, Instruction Set.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08DN32MLC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08DN48AMLC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08DN48ACLF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08DV48AMLH
✅ 드롭인✓ 재고 있음
$4.31 / 개
데이터시트 보기 →MC9S08DV60AMLF
✅ 드롭인✓ 재고 있음
$4.6 / 개
데이터시트 보기 →MC9S08DZ32AMLH
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S08DN32AMLC 최대 정격 & 전기적 특성
| Core | HCS08 (S08) |
| Instruction Set | HC08 with BGND |
| CPU Frequency | 40 MHz |
| Bus Frequency | 20 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 1.5 KB (1.5K x 8) |
| EEPROM | Embedded |
| Number of I/O | 25 |
| ADC | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | CAN 2.0 A/B |
| Serial Interfaces | SCI (UART), SPI, I2C |
| 패키지 | 32-LQFP (7x7 mm) |
| 동작 온도 | -40 C to +125 C |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | Compliant |
| Oscillator Type | External |
| Debug Interface | Background Debug Mode (BDM) |
MC9S08DN32AMLC 핀 구성
| 핀 1 | PTD1/TXD1 — GPIO / SCI1 transmit |
| 핀 2 | PTD0/RXD1 — GPIO / SCI1 receive |
| 핀 3 | PTC7 — GPIO |
| 핀 4 | PTC6 — GPIO |
| 핀 5 | PTC4 — GPIO |
| 핀 6 | PTC3 — GPIO |
| 핀 7 | PTC2 — GPIO |
| 핀 8 | PTC1 — GPIO |
| 핀 9 | PTC0 — GPIO |
| 핀 10 | PTB7/SDA — GPIO / I2C SDA |
| 핀 11 | PTB6/SCL — GPIO / I2C SCL |
| 핀 12 | VDD — Supply voltage |
| 핀 13 | VSS — Ground |
| 핀 14 | PTA7 — GPIO |
| 핀 15 | PTA6 — GPIO |
| 핀 16 | PTA5 — GPIO |
| 핀 17 | PTA4 — GPIO |
| 핀 18 | PTA3 — GPIO |
| 핀 19 | PTA2 — GPIO |
| 핀 20 | PTA1 — GPIO |
| 핀 21 | PTA0 — GPIO |
| 핀 22 | PTG0/CANTX — GPIO / MSCAN transmit |
| 핀 23 | PTG1/CANRX — GPIO / MSCAN receive |
| 핀 24 | RESET — Reset input, active low |
| 핀 25 | BKGD/MS — Background Debug Mode / Mode Select |
| 핀 26 | XTAL — Crystal oscillator input |
| 핀 27 | EXTAL — Crystal oscillator output |
| 핀 28 | VSS — Ground |
| 핀 29 | VDD — Supply voltage |
| 핀 30 | PTE7 — GPIO |
| 핀 31 | PTE6 — GPIO |
| 핀 32 | PTE5 — GPIO |
일반적인 애플리케이션
MC9S08DN32AMLC 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, CAN Node Endpoint (J1939 / CANopen), HVAC and Lighting Actuators, Industrial Sensor Interface Nodes, Appliance Control Boards, Battery Management Slave Nodes.
Automotive Body Control Modules
The MC9S08DN32AMLC's integrated MSCAN module (CAN 2.0 A/B) and 32 KB Flash make it well-suited for body-control nodes such as door modules, seat controllers, and mirror adjusters. The 12-bit ADC with up to 16 channels handles switch and potentiometer inputs while the embedded EEPROM stores calibration data. Compared with discrete CAN controllers, the on-chip MSCAN reduces BOM cost by approximately USD 1.50 per node and frees GPIO for sensor I/O. The -40 C to +125 C operating range covers the automotive under-hood and cabin environment.
추천
CAN Node Endpoint (J1939 / CANopen)
For industrial CANopen and SAE J1939 nodes, the MC9S08DN32AMLC's 40 MHz HCS08 core and 1.5 KB RAM execute typical CANopen stack libraries within the 32 KB Flash budget. The 20 MHz bus rate keeps interrupt latency predictable for time-triggered PDOs. Hardware filtering in the MSCAN module offloads message acceptance from the CPU, allowing more bandwidth for application code. Drop-in alternatives MC9S08DN48AMLC and MC9S08DN60AMLC allow field upgrades to add more CANopen objects without PCB change.
추천
HVAC and Lighting Actuators
In HVAC damper actuators and lighting ballast controllers, the MC9S08DN32AMLC's 12-bit ADC reads temperature or light sensors with 2.5 us conversion while PWM-capable timer channels drive TRIAC or MOSFET gates. The low-power stop and wait modes reduce quiescent draw to single-digit microamps for always-on appliances. The 25 GPIO pins are enough to handle a typical damper's motor direction, end-stop, and feedback signals without external I/O expanders.
추천
Industrial Sensor Interface Nodes
For 4-20 mA loop-powered sensor transmitters, the MC9S08DN32AMLC's 12-bit ADC and SPI/I2C peripherals connect directly to digital sensors and DACs. The HCS08's HC08 instruction set keeps firmware small, leaving room for sensor linearization routines in 32 KB Flash. The exposed thermal pad on the 32-LQFP package sustains full -40 C to +125 C operation in sealed industrial enclosures. AEC-Q100-qualified drop-in alternatives exist for installations that demand automotive-grade certification.
추천
Appliance Control Boards
White-goods control boards (washing machines, dishwashers, ovens) commonly use the MC9S08DN32AMLC because the integrated EEPROM stores user settings and fault logs through power cycles. The 32 KB Flash is sufficient for UI state machines plus motor-control algorithms on a single IC. The MSCAN module enables premium models to participate in the appliance CAN network for diagnostics. Drop-in density upgrades MC9S08DN48AMLC and MC9S08DN60AMLC keep the PCB identical across product tiers.
추천
Battery Management Slave Nodes
In modular battery packs, the MC9S08DN32AMLC acts as a slave monitoring individual cells via its 12-bit ADC and reports state-of-charge over an isolated CAN link using the on-chip MSCAN. The 32 KB Flash holds cell-balancing algorithms, while embedded EEPROM stores lifetime cycle counts. The wide -40 C to +125 C operating range handles proximity to lithium cells without derating. Pin-compatible density upgrades allow pack designers to scale MCU memory without changing the BMS PCB layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08DN32AMLC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08DN32MLC | MC9S08DN48AMLC | MC9S08DN48ACLF | MC9S08DV48AMLH | MC9S08DV60AMLF | MC9S08DZ32AMLH |
|---|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 32 KB | 32 KB | 48 KB (+50%) | 48 KB (+50%) | 48 KB (+50%) | 60 KB (+87%) | 32 KB |
| RAM | 1.5 KB | 1.5 KB | 2 KB (+33%) | 2 KB (+33%) | 2 KB (+33%) | 2 KB (+33%) | 1.5 KB |
| CAN Module | MSCAN (CAN 2.0 A/B) | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN (enhanced) |
| ADC | 12-bit, up to 16 ch | 12-bit, up to 16 ch | 12-bit, up to 16 ch | 12-bit, up to 16 ch | 12-bit, up to 16 ch | 12-bit, up to 16 ch | 12-bit, up to 16 ch |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Lifecycle Status | NRND | NRND | Active (last time buy region) | Active | Active | Active | Active |
주요 차별점
- Pin-compatible higher-Flash upgrade path within the same S08DN family (vs MC9S08DN32MLC)
- Integrated MSCAN module eliminates external CAN controller (vs MC9S08DV60AMLF)
- Embedded EEPROM for non-volatile parameter storage (vs MC9S08LC36LK)
- Wide -40 C to +125 C automotive operating range (vs MC9S08PT16AVWJ)
- On-chip BDM debug without an emulator pod (vs MC9S08AW60CPUE)
설계 노트
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pin pair. For the 32-LQFP, both internal VDD pins (12 and 29) and both VSS pins (13 and 28) must be decoupled, not bypassed. Adding a bulk 4.7 uF tantalum or ceramic close to the MCU suppresses the inrush spike when MSCAN transitions the bus dominant. In battery-powered nodes, route the MCU's VDD through an LDO with 100 mA headroom to keep the internal CAN analog cells stable.
Solder the exposed thermal pad of the 32-LQFP to a copper pour of at least 1 square inch connected to the ground plane. Without the thermal pad soldered, the theta_JA rises significantly and the MCU may exceed its 64-AEC-Q100 thermal envelope under continuous CAN traffic and ADC sampling. For sealed automotive enclosures, vent the pad region through thermal vias to an inner copper plane.
Route the MSCAN TX/RX pair (PTG0/PTG1) as a 100 ohm differential pair with length matching within 5 mm. Place the external CAN transceiver (e.g., TJA1040 or TJA1051) within 25 mm of the MCU pins to keep stub reflections under 5%. Keep the oscillator traces short and surrounded by ground copper to minimize EMI at 40 MHz. Decoupling capacitors should use the shortest possible trace to the VDD/VSS pair, never shared with other ICs.
Do not enable the internal pull-ups on the BKGD/MS pin during reset, otherwise the MCU enters debug mode instead of normal execution. Do not exceed the maximum ADC input (VDD + 0.3 V); the on-chip protection diodes only clamp small transients. When migrating from the 'A' mask revision (AMLC) to the 'M' mask revision (MLC), re-validate the MSCAN baud-rate prescaler because the bit-timing trim changed between revisions.
The MC9S08DN32AMLC's MSCAN module requires the bus to be recessive for at least 11 bit times before transmission; ensure the CAN transceiver is in normal mode at least 1 ms before MCU initialization completes. Add a common-mode choke on the CANH/CANL lines in noisy industrial environments, and verify the dominant-to-recessive edge times meet the CAN 2.0 A/B specification with an oscilloscope probe at the transceiver end of the bus.
규정 준수 정보
RoHS and REACH compliance per NXP product page. AEC-Q100 status not explicitly listed for this commercial-grade part; the -Q1 suffix variants are AEC-Q100 qualified. NRND status per NXP 2026-10 product page.