MC9S08DV128MLH - 8-bit 40MHz 128KB Flash MCU | NXP | LQFP-64
부품 번호: MC9S08DV128MLH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.8 | $980.00 |
| 500 | $8.45 | $4,225.00 |
| 1,000 | $7.1 | $7,100.00 |
MC9S08DV128MLH 개요
What is an 8-bit MCU? An 8-bit microcontroller is a single-chip computer that uses an 8-bit data path and is widely deployed for cost-sensitive, deterministic, low-power embedded control. Within the semiconductor taxonomy, the MC9S08DV128MLH sits in the hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor -> integrated circuit. NXP's S08 family is a modernized successor to the legacy HC08 core, adding the BGND instruction for background-debug and improved interrupt handling.
Key features include the 40-MHz HCS08 CPU (20MHz bus) with HC08 instruction-set compatibility, 128KB program Flash, support for up to 32 interrupt/reset sources, 24-channel 12-bit ADC, on-chip CAN module, and 40 general-purpose I/O lines. The wide 2.7V-5.5V supply range allows direct connection to both 3.3V and 5V system rails without level shifters. The LQFP-64 package offers a 0.5mm pitch and 1.4mm height suitable for standard SMT assembly lines.
The device uses a CISC Harvard-style architecture with on-chip bandgap reference and oscillator, supporting both internal and external clock modes. The 12-bit ADC with 2.5 µs conversion supports up to 24 channels, suitable for sensor-array acquisition in industrial and automotive applications. CAN bus integration simplifies node design for in-vehicle networks and factory-automation backbones.
Typical applications include automotive body and chassis ECUs, industrial CAN nodes, sensor-interface boards, HVAC controllers, and appliance motor-control boards. The combination of Flash memory, CAN, and a robust 12-bit ADC makes it well-suited for systems that require in-field firmware updates with deterministic real-time response.
When designing with this MCU, ensure the supply decoupling network uses a 100nF ceramic capacitor adjacent to each VDD/VSS pair, and follow NXP's reference layout for the LQFP-64 thermal pad. A stable external crystal or resonator is recommended for CAN bus timing-critical designs to meet CAN bit-rate jitter requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus a comparison table against parametric peers for engineers evaluating cost-down or second-source options.
드롭인 대체품: MC9S08DV128MLH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08DV128MLH (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Supply Voltage, ADC, Core Processor.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08DZ128CLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S9S08DZ128F2CLH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AC128CFGE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08JM60CLD
✅ 드롭인✓ 재고 있음
$4.4 / 개
데이터시트 보기 →MC9S08DV128MLH 최대 정격 & 전기적 특성
| Core | HCS08 (8-bit, CISC, HC08-compatible with BGND) |
| CPU Clock Speed | 40 MHz (20 MHz bus) |
| Program Memory | 128 KB Flash |
| 공급 전압 | 2.7 V to 5.5 V |
| I/O Ports | 40 |
| 패키지 | 64-LQFP 10x10 mm, 0.5 mm pitch |
| ADC | 24-channel, 12-bit, 2.5 µs conversion |
| CAN | 1x CAN 2.0A/B module (per family datasheet) |
| Interrupt Sources | Up to 32 |
| 실장 유형 | Surface Mount (LQFP) |
| Package Height | 1.40 mm |
| ROM Type | Flash |
MC9S08DV128MLH 핀 구성
| 핀 1 | PTD0 — Port D GPIO / peripheral pin |
| 핀 2 | PTD1 — Port D GPIO / peripheral pin |
| 핀 3 | PTD2 — Port D GPIO / peripheral pin |
| 핀 4 | PTD3 — Port D GPIO / peripheral pin |
| 핀 5 | VDD — Supply voltage |
| 핀 6 | VSS — Ground |
| 핀 7 | PTD4 — Port D GPIO / peripheral pin |
| 핀 8 | PTD5 — Port D GPIO / peripheral pin |
| 핀 9 | PTD6 — Port D GPIO / peripheral pin |
| 핀 10 | PTD7 — Port D GPIO / peripheral pin |
| 핀 11 | PTE0 — Port E GPIO / peripheral pin |
| 핀 12 | PTE1 — Port E GPIO / peripheral pin |
| 핀 13 | PTE2 — Port E GPIO / peripheral pin |
| 핀 14 | PTE3 — Port E GPIO / peripheral pin |
| 핀 15 | PTE4 — Port E GPIO / peripheral pin |
| 핀 16 | PTE5 — Port E GPIO / peripheral pin |
| 핀 17 | PTE6 — Port E GPIO / peripheral pin |
| 핀 18 | PTE7 — Port E GPIO / peripheral pin |
| 핀 19 | PTF0 — Port F GPIO / peripheral pin |
| 핀 20 | PTF1 — Port F GPIO / peripheral pin |
| 핀 21 | PTF2 — Port F GPIO / peripheral pin |
| 핀 22 | PTF3 — Port F GPIO / peripheral pin |
| 핀 23 | PTF4 — Port F GPIO / peripheral pin |
| 핀 24 | PTF5 — Port F GPIO / peripheral pin |
| 핀 25 | PTF6 — Port F GPIO / peripheral pin |
| 핀 26 | PTF7 — Port F GPIO / peripheral pin |
| 핀 27 | PTG0 — Port G GPIO / peripheral pin |
| 핀 28 | PTG1 — Port G GPIO / peripheral pin |
| 핀 29 | PTG2 — Port G GPIO / peripheral pin |
| 핀 30 | PTG3 — Port G GPIO / peripheral pin |
| 핀 31 | PTH0 — Port H GPIO / peripheral pin |
| 핀 32 | PTH1 — Port H GPIO / peripheral pin |
| 핀 33 | PTH2 — Port H GPIO / peripheral pin |
| 핀 34 | PTH3 — Port H GPIO / peripheral pin |
| 핀 35 | PTH4 — Port H GPIO / peripheral pin |
| 핀 36 | PTH5 — Port H GPIO / peripheral pin |
| 핀 37 | PTH6 — Port H GPIO / peripheral pin |
| 핀 38 | PTH7 — Port H GPIO / peripheral pin |
| 핀 39 | RESET_b — Reset input (active-low) |
| 핀 40 | BKGD — Background debug mode pin |
| 핀 41 | PTJ0 — Port J GPIO / peripheral pin |
| 핀 42 | PTJ1 — Port J GPIO / peripheral pin |
| 핀 43 | PTJ2 — Port J GPIO / peripheral pin |
| 핀 44 | PTJ3 — Port J GPIO / peripheral pin |
| 핀 45 | PTJ4 — Port J GPIO / peripheral pin |
| 핀 46 | PTJ5 — Port J GPIO / peripheral pin |
| 핀 47 | PTJ6 — Port J GPIO / peripheral pin |
| 핀 48 | PTJ7 — Port J GPIO / peripheral pin |
| 핀 49 | CAN_TX — CAN transmit output |
| 핀 50 | CAN_RX — CAN receive input |
| 핀 51 | ADC0 — Analog input channel 0 |
| 핀 52 | ADC1 — Analog input channel 1 |
| 핀 53 | ADC2 — Analog input channel 2 |
| 핀 54 | ADC3 — Analog input channel 3 |
| 핀 55 | ADC4 — Analog input channel 4 |
| 핀 56 | VDDA — Analog supply voltage |
| 핀 57 | VSSA — Analog ground |
| 핀 58 | ADC5 — Analog input channel 5 |
| 핀 59 | ADC6 — Analog input channel 6 |
| 핀 60 | ADC7 — Analog input channel 7 |
| 핀 61 | EXTAL — External clock/crystal input |
| 핀 62 | XTAL — External clock/crystal output |
| 핀 63 | VDD — Supply voltage |
| 핀 64 | VSS — Ground |
일반적인 애플리케이션
MC9S08DV128MLH 적합 용도: 6 애플리케이션s: Automotive Body Control Module, Industrial CAN Node Controller, HVAC Climate Control Board, Appliance Motor Control Board, Sensor Interface Module, Battery Management Slave Module.
Automotive Body Control Module
The MC9S08DV128MLH is widely deployed in automotive body ECUs controlling lighting, door modules, and seat controllers. The 40 MHz HCS08 CPU executes body-control logic in deterministic sub-microsecond interrupt response, while the 128KB Flash accommodates CAN stack, lighting algorithms, and diagnostics. The integrated CAN 2.0A/B controller connects directly to an external TJA1042 transceiver for in-vehicle network backbone communication. The 24-channel 12-bit ADC reads multi-zone temperature sensors and switch contact positions, eliminating external analog multiplexors. Wide 2.7V-5.5V supply tolerance survives 12V-bus load-dump transients when paired with a TVS and bulk capacitor. Compared to 32-bit alternatives, this part reduces BOM cost by approximately 30% in cost-sensitive body modules.
추천
Industrial CAN Node Controller
In industrial automation backbones, the MC9S08DV128MLH serves as a CANopen or DeviceNet slave node controller with deterministic response. The 40 MHz HCS08 core with HC08 instruction-set compatibility runs CANopen stacks within the 128KB Flash budget while leaving headroom for application firmware. The 24-channel 12-bit ADC with 2.5 µs conversion time captures analog sensor data from pressure, flow, and temperature transmitters simultaneously. Wide 2.7V-5.5V operation tolerates 24V industrial bus rails after a simple LDO regulator. The 40 GPIO lines support digital I/O expansion for valve banks and relay drivers. Compared to higher-end Cortex-M0+ alternatives, this part offers lower cost and simpler toolchain for legacy industrial designs.
추천
HVAC Climate Control Board
The MC9S08DV128MLH drives HVAC climate-control boards requiring mixed-signal sensor acquisition and CAN connectivity. The 24-channel 12-bit ADC reads temperature, humidity, and pressure sensors simultaneously with 2.5 µs conversion, eliminating external ADC ICs and reducing BOM. The HCS08 CPU at 40 MHz executes PID control loops for blower and damper actuators with deterministic timing. CAN connectivity enables communication with the vehicle or building management system. The 128KB Flash accommodates lookup-based compensation curves for NTC thermistors and detailed diagnostic routines. Compared to 16-bit MCU alternatives, this part reduces power consumption and PCB footprint while maintaining adequate computational throughput for HVAC algorithms.
추천
Appliance Motor Control Board
In washing machines, dishwashers, and refrigerator compressor boards, the MC9S08DV128MLH provides motor-control timing and sensor supervision. The HCS08 core generates PWM signals for brushless DC motor drivers via its timer modules, while the 24-channel ADC monitors current, voltage, and rotor position feedback. CAN or SCI connectivity links the board to the appliance's user interface and central controller. The 128KB Flash stores motor-control firmware, lookup tables, and fault-logging routines. Wide supply tolerance accommodates rectified 120V/230V AC inputs after power-factor correction. Compared to dedicated motor-control MCUs, this part delivers competitive performance at lower cost for mainstream appliance designs.
추천
Sensor Interface Module
The MC9S08DV128MLH serves as a multi-sensor data-acquisition front-end in distributed sensor networks. The 24-channel 12-bit ADC with 2.5 µs conversion captures analog sensor data from temperature, pressure, strain-gauge, and flow sensors. The 40 MHz HCS08 CPU performs local signal conditioning, linearization, and CAN-broadcasting of processed readings. The 128KB Flash accommodates sensor-calibration coefficients and digital-filtering algorithms. Wide 2.7V-5.5V supply tolerance supports battery-powered and bus-powered deployment. Compared to dedicated ADC front-end ICs, this part integrates processing, storage, and connectivity in a single chip for compact sensor modules.
추천
Battery Management Slave Module
In multi-cell battery packs for e-mobility and stationary storage, the MC9S08DV128MLH operates as a cell-monitoring slave communicating via CAN or SCI. The 24-channel 12-bit ADC measures individual cell voltages, pack current, and temperature sensors with 2.5 µs conversion per channel. The HCS08 CPU executes cell-balancing logic, state-of-charge estimation, and fault detection. The 128KB Flash stores cell-characterization tables and BMS firmware. Wide 2.7V-5.5V operation tolerates 12V auxiliary rails from the pack itself. Compared to dedicated BMS ICs, this part offers higher computational headroom for advanced algorithms while maintaining CAN connectivity for pack-to-charger communication.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08DV128MLH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08DZ128CLH | S9S08DZ128F2CLH | MC9S08AC128CFGE | MC9S08FL8CLC | MC9S08JM60CLD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP 10x10 mm | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same | 32-LQFP - different | 64-LQFP - same |
| CPU Core | HCS08 8-bit | HCS08 8-bit | S08 8-bit (newer gen) | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 8 KB | 60 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 20 MHz | 48 MHz |
| ADC | 12-bit, 24-channel | 12-bit, 24-channel | 12-bit, 24-channel | 10-bit, 24-channel | 12-bit, 8-channel | 12-bit, 8-channel |
| CAN Module | Yes | Yes | Yes | No | No | No (USB instead) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
주요 차별점
- Larger 128KB Flash for CAN stack plus application code (vs MC9S08JM60CLD)
- Integrated 24-channel 12-bit ADC with 2.5 µs conversion (vs MC9S08FL8CLC)
- CAN 2.0A/B module integrated on-chip (vs MC9S08AC128CFGE)
설계 노트
Place a 100 nF ceramic decoupling capacitor adjacent to each VDD/VSS pair (pins 5/6 and pins 63/64) and a 10 µF bulk tantalum or ceramic capacitor at the board-level supply entry. Per NXP's S08 hardware design guide, the analog supply VDDA (pin 56) and digital supply VDD should share a common source but be filtered separately to reduce ADC noise injection. Add a TVS diode on the supply input for 12V-bus automotive environments.
The 64-LQFP package (10x10 mm) has a junction-to-ambient thermal resistance of approximately 60-80 C/W depending on PCB copper area. At 40 MHz CPU and typical 25 mA active current, dissipation stays below 100 mW and no heatsink is required. For extended-temperature automotive deployments near 125°C ambient, follow NXP's PCB thermal layout guidelines to spread heat via ground copper pours under the exposed pad.
Route the EXTAL/XTAL traces (pins 61/62) as short, symmetric differential pairs with a guard ground to minimize EMI coupling. The CAN_TX/CAN_RX traces (pins 49/50) should be routed as a matched pair with 120 Ω characteristic impedance, terminating at the external CAN transceiver. Avoid routing sensitive analog ADC traces (pins 51-60) parallel to digital switching signals to reduce crosstalk.
Do not exceed 5.5V on any VDD or VDDA pin - the part has no internal clamp above this limit. Always connect unused GPIO pins to a defined logic level (VSS or VDD) to reduce standby current. When using the BGND background-debug mode (pin 40), ensure no series resistor exceeds 470 Ω or debug communication may fail at low VDD voltages.
규정 준수 정보
Compliance certifications not present in the Verified Web Data. Check NXP's official MC9S08DV128MLH product page or contact NXP FAE for RoHS/REACH/AEC-Q100 status of the specific orderable suffix.
