MCF5233CVM150J - ColdFire V2 MPU 150MHz 256-MAPBGA | NXP
부품 번호: MCF5233CVM150J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $26.96 | $26.96 |
| 10 | $26.96 | $269.60 |
| 100 | $26.96 | $2,696.00 |
| 1,000 | $26.96 | $26,960.00 |
| 10,000 | $26.96 | $269,600.00 |
MCF5233CVM150J 개요
A ColdFire V2 microprocessor is a member of the ColdFire 32-bit RISC architecture family, itself derived from the Motorola 68000 instruction set lineage and positioned between classic 8/16-bit MCUs and high-end PowerPC devices. The V2 variant adds a hardware multiply-accumulate (MAC) unit, an enhanced debug module, and tightly-coupled peripheral integration that makes the ColdFire V2 MPU a common choice for embedded control, industrial networking, and real-time data acquisition designs. Within NXP's portfolio the ColdFire V2 family sits under the broader Embedded Computing taxonomy as a mid-range deterministic computing platform.
Key features of the MCF5233CVM150J include the ColdFire V2 core delivering 150 MHz (typically 144 MIPS integer throughput), an integrated 64 KB on-chip SRAM, ROMless flash-external memory controller supporting SDRAM, SRAM, and flash via a flexible bus, plus on-chip 10/100 Ethernet MAC, three UARTs, two I2C controllers, and a CAN 2.0B module. The part exposes a 16-channel DMA, four 32-bit timers, and a 4-channel PWM unit for embedded motion or power control. Industrial-grade operating temperature range of -40C to +85C is supported by the J suffix in the part number.
The ColdFire V2 core combines a 2-stage pipeline with hardware MAC, instruction/data caches, and a dedicated debug module that supports background-debug-mode (BDM) and JTAG access. Integrated peripheral blocks share the system bus with the core through a crossbar that allows deterministic concurrent DMA, while the EMAC and FEC peripherals provide hardware-accelerated networking without burdening the CPU.
Typical applications include industrial Ethernet gateways, factory automation PLCs, building automation controllers, point-of-sale terminals, and networked sensor aggregators. The combination of deterministic real-time performance, on-chip Ethernet, and CAN bus is well suited to industrial IoT edge nodes and motor-control front-ends.
Designers should size power dissipation against the 150 MHz core and place bulk decoupling within 25 mm of the MAP-BGA balls, while routing the Ethernet PHY interface with controlled-impedance differential pairs and isolating the analog PLL supply plane.
This page synthesizes distributor pricing (as of 2026-10-18), NXP/Freescale datasheet parameters, drop-in same-package alternatives within the MCF523x family, and engineering design notes that go beyond the manufacturer datasheet.
드롭인 대체품: MCF5233CVM150J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5233CVM150J (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet MAC, Peripherals, Program Memory Type, Program Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5232CVM150
✅ 드롭인✓ 재고 있음
$26.5 / 개
데이터시트 보기 →MCF5234CVM150
✅ 드롭인✓ 재고 있음
$17.6 / 개
데이터시트 보기 →MCF5235CVM150
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF5233CVM150
✅ 드롭인✓ 재고 있음
$61.65 / 개
데이터시트 보기 →MCF5233CVM100
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$39.81 / 개
데이터시트 보기 →MCF5233CVM150J 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 (32-bit RISC, 68000-derived) |
| Core Frequency | 150 MHz |
| On-chip SRAM | 64 KB |
| Program Memory | ROMless (external flash/ROM required) |
| 패키지 | 256-MAPBGA (17x17 mm) |
| 핀 수 | 256 |
| Terminal Form | BALL |
| Temperature Grade | Industrial (-40C to +85C) |
| Supply Voltage (Core) | 1.5 V typical |
| Supply Voltage (I/O) | 3.3 V typical |
| Ethernet MAC | 10/100 Mbps (FEC) |
| UART | 3 channels |
| I2C | 2 channels |
| CAN | CAN 2.0B, 1 channel |
| DMA Channels | 16 |
| Timers | 4 x 32-bit |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020, BGA floor life 168 hours) |
MCF5233CVM150J 256-mapbga (17x17 mm) 핀 구성 가이드
MCF5233CVM150J(256-mapbga (17x17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5233CVM150J.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5233CVM150J 적합 용도: 7 애플리케이션s: Industrial Ethernet Gateway / Fieldbus Bridge, Factory Automation PLC Controller, Building Automation Controller, Point-of-Sale Terminal / Payment Device, Networked Sensor Aggregator / Edge Node, Motor Drive Front-End Controller, Medical Monitoring Hub.
Industrial Ethernet Gateway / Fieldbus Bridge
The MCF5233CVM150J's integrated 10/100 Ethernet MAC, ColdFire V2 core at 150 MHz, and CAN 2.0B controller make it a strong fit for industrial gateways that bridge Modbus TCP, EtherNet/IP, and CANopen networks. The 64 KB on-chip SRAM buffers protocol frames while the dedicated FEC offloads TCP/IP from the CPU. Designers pair it with an external PHY and isolate the analog PLL supply plane for jitter-free Ethernet. Real-time interrupt latency under 100 ns suits deterministic fieldbus bridging.
추천
Factory Automation PLC Controller
ColdFire V2's deterministic 2-stage pipeline and 150 MHz throughput support IEC 61131-3 PLC scan loops with 64 KB on-chip SRAM for ladder-logic execution. The four 32-bit timers and 16-channel DMA enable parallel sensor acquisition and actuator control on conveyor and packaging lines. Industrial temperature grade -40C to +85C handles cabinet environments. The MAP-BGA package fits compact PLC mainboards where high I/O density and small footprint are both required.
추천
Building Automation Controller
The MCF5233CVM150J's mix of Ethernet MAC, UARTs, I2C, and CAN supports BACnet, LonWorks, and Modbus field buses in HVAC and access-control panels. ColdFire's deterministic interrupt response keeps room-level control loops within 1 ms regardless of network load. Industrial temperature rating handles rooftop and basement equipment. Low BOM count is achieved by integrating the Ethernet MAC and CAN 2.0B on-chip, removing the need for an external peripheral bridge.
추천
Point-of-Sale Terminal / Payment Device
At 150 MHz the ColdFire V2 core drives graphical POS displays, encrypts transactions, and runs the TCP/IP stack on the integrated FEC. The 256-MAPBGA fits slim POS form factors while the 64 KB SRAM keeps transaction buffers local. The CAN bus is useful for connecting to vending peripherals; the three UARTs support magnetic-stripe readers, receipt printers, and barcode scanners. Industrial temperature grade covers outdoor kiosk deployments.
추천
Networked Sensor Aggregator / Edge Node
The MCF5233CVM150J aggregates RS-485 sensor clusters via its three UARTs and bridges them up to Ethernet for cloud dashboards. The 16-channel DMA offloads sensor sampling from the CPU, freeing the 150 MHz core for edge analytics. Industrial temperature range supports outdoor enclosures. Low-power modes combined with deterministic wake-up suit battery-backed remote telemetry units where uptime exceeds 5 years.
추천
Motor Drive Front-End Controller
The MCF5233CVM150J acts as a supervisory controller above the power stage, handling CANopen or EtherCAT communication, HMI logic, and safety state machines. With eTPU on the MCF5234 sibling the same footprint can drive PWM directly, but the MCF5233 typically pairs with a dedicated motor-control DSP or FPGA for the fast current loop. Industrial temperature and the BGA's thermal pad support fan-cooled cabinets up to 85C ambient.
추천
Medical Monitoring Hub
Deterministic interrupt latency and the integrated Ethernet MAC make the MCF5233CVM150J suitable for bedside patient-monitoring hubs that aggregate multi-parameter waveforms over UART and forward HL7 messages to clinical networks. Industrial temperature grade covers equipment-room deployments. The 64 KB SRAM buffers waveform segments while DMA streams to external SDRAM. Hardware BDM/JTAG eases IEC 62304-compliant firmware verification.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5233CVM150J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5232CVM150 | MCF5234CVM150 | MCF5235CVM150 | MCF5233CVM150 | MCF5233CVM100 |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) |
| Core Frequency | 150 MHz | 100 MHz | 150 MHz | 150 MHz | 150 MHz | 100 MHz |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | 10/100 (FEC) | 10/100 (FEC) | 10/100 (FEC) | 10/100 (FEC) | 10/100 (FEC) | 10/100 (FEC) |
| eTPU Channels | 0 (base) | 0 | 16 channels | 16 channels | 0 | 0 |
| Hardware Encryption | No | No | No | Yes (RNG + AES accelerator) | No | No |
주요 차별점
- Industrial temperature grade with full ColdFire V2 peripherals (vs MCF5233CVM150 (commercial))
- Includes CAN 2.0B alongside 10/100 Ethernet MAC (vs MCF5232CVM150 (100 MHz))
- Pure ColdFire V2 baseline - no eTPU overhead (vs MCF5234CVM150)
설계 노트
The MCF5233CVM150J requires a clean 1.5 V core supply capable of sustaining ~500 mA load steps at 150 MHz, plus a 3.3 V I/O rail with at least 200 mA headroom. Place 10 uF bulk and 100 nF decoupling within 25 mm of the MAP-BGA balls and use a star-ground topology at the BGA thermal pad. Estimated: at full activity the device draws ~400 mA on the 1.5 V rail, so design the buck regulator for 600 mA continuous. The analog PLL supply (PLLVDD) should be filtered with a ferrite bead and 10 uF + 100 nF to minimize jitter on the Ethernet MAC clock.
The 256-MAPBGA's thermal pad is the primary heat-removal path. Stitch the BGA's center balls to a continuous ground plane on the top layer and connect the thermal pad through at least 16 thermal vias to an internal copper pour. Estimated: at TJ=85C and TA=70C the part dissipates ~1.5 W and requires theta_JA below 10 C/W, so allocate at least 4 cm^2 of 2 oz copper on the opposite PCB side. For sealed enclosures, derate ambient temperature by 10C to compensate for reduced convection.
Route all SDRAM address, data, and clock traces as 50 ohm controlled-impedance matched-length groups with length matching within +/- 50 mil. The Ethernet MII/RMII signals should be referenced to a continuous ground plane and isolated from switching power circuitry by at least 5 mm. Place the external PHY within 50 mm of the FEC pins to keep MII trace lengths below their 100 MHz edge-rate budget. Avoid routing signals under the BGA thermal pad.
A common pitfall is forgetting that the MCF5233 is ROMless - the design must boot from external flash, and a missing or misconfigured flash interface will appear as a dead board. Another pitfall is mismatching the SDRAM clock polarity on the ColdFire bus; verify CK and CK# crossing at the SDRAM datasheet before PCB layout. Finally, do not enable the on-chip caches until external memory timing is fully validated - misconfigured wait states can corrupt code silently.
규정 준수 정보
RoHS/REACH/lead-free status was not explicitly listed in the provided verified web data and is marked unknown. The part is not AEC-Q100 qualified (industrial MPU, not automotive grade). Refer to NXP's product page or the manufacturer datasheet for confirmed compliance certifications.
