MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
부품 번호: MPC8360ECVVAGDGA ✓ 활성MPC8360ECVVAGDGA 개요
A microprocessor (MPU) is a single-chip processing unit that integrates the CPU core, cache, memory controller and a wide range of peripheral interfaces on a single die, sitting at the top of the embedded-system hierarchy: MPU -> processor SoC -> system-on-chip -> integrated circuit. The PowerQUICC II Pro family extends the classic PowerQUICC II line by adding gigabit Ethernet, DDR1/DDR2 memory support, USB, TDM/ATM and security accelerators, while maintaining software compatibility with prior PowerQUICC designs.
Key features include an integrated security engine (SEC) for IPsec and SSL acceleration, dual DDR1/DDR2 memory controllers with ECC, PCI interface for legacy expansion, gigabit Ethernet MAC, USB 2.0 full-speed, TDM and ATM serial interfaces, and an extended industrial temperature range of -40C to +105C. The device targets communications infrastructure where deterministic networking and crypto offload are required.
The MPC8360E implements a classic single-issue e300 superscalar core with separate 32 KB instruction and 32 KB data L1 caches, plus a unified 256 KB L2 cache. The QUICC Engine communication block handles ATM, HDLC, TDM and POS functions in hardware, freeing the core for control-plane processing. Silicon revision 2.x (denoted by the 'E' suffix) adds the gigabit Ethernet MAC and integrated SEC.
Typical applications include SMB/SME routers, DSLAMs, IP-PBX systems, industrial gateways and line cards where the QUICC Engine handles wire-speed TDM/ATM while the e300 core runs Linux or VxWorks control-plane software. The industrial -40C to +105C operating range and lead-free TBGA package make it suitable for outdoor or ruggedized CPE equipment.
Designers should note that lead-free TBGA assembly requires peak reflow temperatures of 245C to 260C, and the 37.5 x 37.5 mm package demands a 4-layer or higher PCB with controlled-impedance routing for DDR2, PCI and gigabit Ethernet signals. DDR2 termination and length matching must follow the JEDEC JESD79-2 specification.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives and pin-compatibility notes that go beyond the manufacturer datasheet summary, helping engineers select the right PowerQUICC II Pro variant for their communications design.
드롭인 대체품: MPC8360ECVVAGDGA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8360ECVVAGDGA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Package, Core Frequency, Ethernet.
MPC8360ECVVAJDGA
✅ 드롭인가격 문의
데이터시트 보기 →MPC8358ECVVAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8360CVVAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8360VVAGDGA
✅ 드롭인가격 문의
데이터시트 보기 →MPC8360ECVVAGDGA 최대 정격 & 전기적 특성
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx |
| Core Architecture | Power Architecture (PowerPC), 32-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 400 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Unified Cache | 256 KB |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) |
| PCI Interface | Yes (PCI 2.2) |
| USB Interface | USB 2.0 Full-Speed |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC |
| Operating Voltage (Core) | 1.2 V |
| 동작 온도 범위 | -40C to +105C |
| 패키지 | 740-TBGA (37.5 x 37.5 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free Status | Lead-Free / RoHS compliant |
| Silicon Revision | 2.x (denoted by 'E' suffix) |
MPC8360ECVVAGDGA 740-tbga (37.5 x 37.5 mm) 핀 구성 가이드
MPC8360ECVVAGDGA(740-tbga (37.5 x 37.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8360ECVVAGDGA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8360ECVVAGDGA 적합 용도: 6 애플리케이션s: SME/SMB Router, Low-End DSLAM Line Card, IP-PBX / Unified Communications Gateway, Industrial Communication Gateway, Wireless Base Station Controller, Network-Attached Storage Controller.
SME/SMB Router
The MPC8360ECVVAGDGA's 400 MHz e300 core plus integrated gigabit Ethernet MAC and IPsec/SSL hardware acceleration make it ideal for small-to-medium enterprise routers that must terminate VPN tunnels at wire speed while routing gigabit WAN/LAN traffic. Place it on a 4-layer PCB with the DDR2 controller running two 16-bit DDR2-667 devices with ECC for control-plane scratch memory; unlike pure software routers, the SEC engine offloads AES-256 and SHA-1, leaving the e300 core free for routing and firewall processing. The QUICC Engine simultaneously handles TDM/ATM for legacy E1/T1 uplinks in branch-office deployments where VoIP and data share the same CPE.
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Low-End DSLAM Line Card
In DSLAM line-card designs the MPC8360ECVVAGDGA's QUICC Engine handles ATM AAL2/AAL5 segmentation and reassembly while the e300 core runs control-plane OAM and provisioning stacks. The integrated DDR1/DDR2 controller with ECC maintains cell-payload integrity under heavy interrupt load, and the industrial -40C to +105C temperature range supports outdoor cabinet deployments. Place the device with controlled-impedance routing to the line-card SERDES and use 245C peak-reflow lead-free assembly for the 740-TBGA to meet telecom reliability targets.
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IP-PBX / Unified Communications Gateway
The MPC8360ECVVAGDGA supports IP-PBX and UC gateway designs by combining the QUICC Engine's TDM/HDLC capability for legacy PRI/BRI trunks with the e300 core running SIP/H.323 stacks. Integrated security engine provides SRTP and TLS offload for encrypted voice paths. Power consumption of approximately 4-6 W under load allows fanless 1U appliance form factors; place the device near the center of a 4-layer PCB with the 740-TBGA thermal pad bonded to an inner ground pour for heat spreading.
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Industrial Communication Gateway
Industrial gateways for SCADA, smart-grid and process automation benefit from the MPC8360ECVVAGDGA's -40C to +105C operating range and integrated USB 2.0, PCI and gigabit Ethernet interfaces. The QUICC Engine handles deterministic serial protocols while the e300 runs Linux/RTOS control software. Place the BGA on a 1.6 mm 4-layer FR-4 PCB with matched-length DDR2 traces; lead-free TBGA assembly requires 245-260C peak reflow per JEDEC J-STD-020.
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Wireless Base Station Controller
The MPC8360ECVVAGDGA integrates a gigabit Ethernet MAC for backhaul to the BSC and TDM/ATM for Abis interface, while the SEC engine secures IPsec tunnels between Node B and the core network. The 400 MHz e300 core handles RNC signaling stacks and the QUICC Engine processes HDLC frames for Abis at wire speed. Industrial -40C to +105C temperature operation supports outdoor base station cabinets.
추천
Network-Attached Storage Controller
Mid-range NAS controllers use the MPC8360ECVVAGDGA's gigabit Ethernet MAC for client connectivity and PCI interface for SAS/SATA controller expansion. The 400 MHz e300 plus 256 KB L2 cache handles file-system metadata and RAID parity calculations, while the QUICC Engine can be repurposed for hardware-accelerated compression. Place the device with carefully length-matched DDR2 traces and a thermal pad bond to a 1-square-inch copper pour.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8360ECVVAGDGA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8360ECVVAJDGA | MPC8358ECVVAGDGA | MPC8360CVVAGDGA | MPC8360VVAGDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same |
| Core Frequency | 400 MHz | 533 MHz (+33%) | 400 MHz (same) | 400 MHz (same) | 400 MHz (same) |
| Silicon Revision | 2.x ('E' suffix) | 2.x ('E' suffix) | 2.x ('E' suffix) | 1.x (no 'E') | Pre-1.x |
| Gigabit Ethernet MAC | Yes | Yes | No (Fast Ethernet only) | No | No |
| Security Engine (SEC) | Yes (IPsec/SSL) | Yes | No | No | No |
| QUICC Engine | Yes (TDM/ATM/HDLC) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C (commercial variant) | -40C to +85C (commercial variant) |
주요 차별점
- Integrated security engine (SEC) for IPsec/SSL acceleration (vs MPC8358ECVVAGDGA)
- Gigabit Ethernet MAC integrated on-die (vs MPC8358ECVVAGDGA / MPC8360CVVAGDGA)
- Higher core frequency with same pinout (vs MPC8360ECVVAGDGA (533 MHz))
- Industrial -40C to +105C operating range (vs MPC8360VVAGDGA)
설계 노트
The 740-TBGA package dissipates approximately 4-6 W under full load. Bond the center thermal pad to an inner ground pour with at least 1 square inch of copper on top and bottom layers, stitched with thermal vias (0.3 mm pitch, 0.5 mm drill) to a 4-layer FR-4 PCB. Without thermal pad bonding, junction temperature can exceed 105C in still air at 25C ambient, especially in enclosed router enclosures. Consider a small clip-on heatsink or forced-air cooling for fanless 1U appliances running near maximum throughput.
DDR2 traces must be length-matched within 50 mils (1.27 mm) for the byte lanes and routed with 50 ohm single-ended impedance to JEDEC JESD79-2. Vias in the DDR2 break-out region should be minimized; use a 4-layer stackup with the second layer as a solid ground plane under the BGA. The 1 mm ball pitch of the 740-TBGA requires microvia or fine-pitch via-in-pad technology for breakout on inner rows - confirm with your PCB fab house for BGA fanout rules before layout.
Do not substitute the MPC8360ECVVAGDGA with the non-'E' MPC8360 if your application uses the integrated security engine or gigabit Ethernet MAC - the older revision lacks both. Also confirm DDR2 termination topology (fly-by vs T-branch) per Micron/Intel DDR2 design guides; the MPC8360E expects fly-by VTT termination for DDR2-667 operation. Power sequencing requires 1.2 V core rail to ramp before 3.3 V I/O - use a power-good supervisor to enforce this.
The gigabit Ethernet GMII/RGMII traces must be length-matched within 100 mils and routed over a continuous ground reference. Keep SERDES reference clocks on a dedicated layer with controlled 50 ohm impedance. For PCI 2.2 at 66 MHz, keep trace lengths under 1500 mils and use source termination. USB 2.0 full-speed requires 90 ohm differential impedance and a common-mode choke near the connector.
규정 준수 정보
Lead-free TBGA package per NXP product page. RoHS and REACH compliance inferred from 'Lead Free' and 'RoHS Status: Compliant' in DigiKey listing 1791583. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified part.