MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
Référence : MPC8360ECVVAGDGA ✓ ActifMPC8360ECVVAGDGA Présentation
A microprocessor (MPU) is a single-chip processing unit that integrates the CPU core, cache, memory controller and a wide range of peripheral interfaces on a single die, sitting at the top of the embedded-system hierarchy: MPU -> processor SoC -> system-on-chip -> integrated circuit. The PowerQUICC II Pro family extends the classic PowerQUICC II line by adding gigabit Ethernet, DDR1/DDR2 memory support, USB, TDM/ATM and security accelerators, while maintaining software compatibility with prior PowerQUICC designs.
Key features include an integrated security engine (SEC) for IPsec and SSL acceleration, dual DDR1/DDR2 memory controllers with ECC, PCI interface for legacy expansion, gigabit Ethernet MAC, USB 2.0 full-speed, TDM and ATM serial interfaces, and an extended industrial temperature range of -40C to +105C. The device targets communications infrastructure where deterministic networking and crypto offload are required.
The MPC8360E implements a classic single-issue e300 superscalar core with separate 32 KB instruction and 32 KB data L1 caches, plus a unified 256 KB L2 cache. The QUICC Engine communication block handles ATM, HDLC, TDM and POS functions in hardware, freeing the core for control-plane processing. Silicon revision 2.x (denoted by the 'E' suffix) adds the gigabit Ethernet MAC and integrated SEC.
Typical applications include SMB/SME routers, DSLAMs, IP-PBX systems, industrial gateways and line cards where the QUICC Engine handles wire-speed TDM/ATM while the e300 core runs Linux or VxWorks control-plane software. The industrial -40C to +105C operating range and lead-free TBGA package make it suitable for outdoor or ruggedized CPE equipment.
Designers should note that lead-free TBGA assembly requires peak reflow temperatures of 245C to 260C, and the 37.5 x 37.5 mm package demands a 4-layer or higher PCB with controlled-impedance routing for DDR2, PCI and gigabit Ethernet signals. DDR2 termination and length matching must follow the JEDEC JESD79-2 specification.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives and pin-compatibility notes that go beyond the manufacturer datasheet summary, helping engineers select the right PowerQUICC II Pro variant for their communications design.
Alternatives de remplacement direct pour MPC8360ECVVAGDGA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8360ECVVAGDGA (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Memory Interface, PCI Interface, Processor Type.
MPC8360ECVVAJDGA
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MPC8358ECVVAGDGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8360CVVAGDGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8360VVAGDGA
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MPC8360ECVVAGDGA Valeurs maximales et caractéristiques électriques
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx |
| Core Architecture | Power Architecture (PowerPC), 32-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 400 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Unified Cache | 256 KB |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) |
| PCI Interface | Yes (PCI 2.2) |
| USB Interface | USB 2.0 Full-Speed |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC |
| Operating Voltage (Core) | 1.2 V |
| Plage de température de fonctionnement | -40C to +105C |
| Boîtier | 740-TBGA (37.5 x 37.5 mm) |
| Type de montage | Surface Mount (BGA) |
| Lead-Free Status | Lead-Free / RoHS compliant |
| Silicon Revision | 2.x (denoted by 'E' suffix) |
Guide de configuration des broches du MPC8360ECVVAGDGA 740-tbga (37.5 x 37.5 mm)
Configuration des broches du MPC8360ECVVAGDGA (boîtier 740-tbga (37.5 x 37.5 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8360ECVVAGDGA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8360ECVVAGDGA convient pour 6 applications: SME/SMB Router, Low-End DSLAM Line Card, IP-PBX / Unified Communications Gateway, Industrial Communication Gateway, Wireless Base Station Controller, Network-Attached Storage Controller.
SME/SMB Router
The MPC8360ECVVAGDGA's 400 MHz e300 core plus integrated gigabit Ethernet MAC and IPsec/SSL hardware acceleration make it ideal for small-to-medium enterprise routers that must terminate VPN tunnels at wire speed while routing gigabit WAN/LAN traffic. Place it on a 4-layer PCB with the DDR2 controller running two 16-bit DDR2-667 devices with ECC for control-plane scratch memory; unlike pure software routers, the SEC engine offloads AES-256 and SHA-1, leaving the e300 core free for routing and firewall processing. The QUICC Engine simultaneously handles TDM/ATM for legacy E1/T1 uplinks in branch-office deployments where VoIP and data share the same CPE.
Recommandé
Low-End DSLAM Line Card
In DSLAM line-card designs the MPC8360ECVVAGDGA's QUICC Engine handles ATM AAL2/AAL5 segmentation and reassembly while the e300 core runs control-plane OAM and provisioning stacks. The integrated DDR1/DDR2 controller with ECC maintains cell-payload integrity under heavy interrupt load, and the industrial -40C to +105C temperature range supports outdoor cabinet deployments. Place the device with controlled-impedance routing to the line-card SERDES and use 245C peak-reflow lead-free assembly for the 740-TBGA to meet telecom reliability targets.
Recommandé
IP-PBX / Unified Communications Gateway
The MPC8360ECVVAGDGA supports IP-PBX and UC gateway designs by combining the QUICC Engine's TDM/HDLC capability for legacy PRI/BRI trunks with the e300 core running SIP/H.323 stacks. Integrated security engine provides SRTP and TLS offload for encrypted voice paths. Power consumption of approximately 4-6 W under load allows fanless 1U appliance form factors; place the device near the center of a 4-layer PCB with the 740-TBGA thermal pad bonded to an inner ground pour for heat spreading.
Recommandé
Industrial Communication Gateway
Industrial gateways for SCADA, smart-grid and process automation benefit from the MPC8360ECVVAGDGA's -40C to +105C operating range and integrated USB 2.0, PCI and gigabit Ethernet interfaces. The QUICC Engine handles deterministic serial protocols while the e300 runs Linux/RTOS control software. Place the BGA on a 1.6 mm 4-layer FR-4 PCB with matched-length DDR2 traces; lead-free TBGA assembly requires 245-260C peak reflow per JEDEC J-STD-020.
Recommandé
Wireless Base Station Controller
The MPC8360ECVVAGDGA integrates a gigabit Ethernet MAC for backhaul to the BSC and TDM/ATM for Abis interface, while the SEC engine secures IPsec tunnels between Node B and the core network. The 400 MHz e300 core handles RNC signaling stacks and the QUICC Engine processes HDLC frames for Abis at wire speed. Industrial -40C to +105C temperature operation supports outdoor base station cabinets.
Recommandé
Network-Attached Storage Controller
Mid-range NAS controllers use the MPC8360ECVVAGDGA's gigabit Ethernet MAC for client connectivity and PCI interface for SAS/SATA controller expansion. The 400 MHz e300 plus 256 KB L2 cache handles file-system metadata and RAID parity calculations, while the QUICC Engine can be repurposed for hardware-accelerated compression. Place the device with carefully length-matched DDR2 traces and a thermal pad bond to a 1-square-inch copper pour.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8360ECVVAGDGA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8360ECVVAJDGA | MPC8358ECVVAGDGA | MPC8360CVVAGDGA | MPC8360VVAGDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same | 740-TBGA (37.5 x 37.5 mm) - same |
| Core Frequency | 400 MHz | 533 MHz (+33%) | 400 MHz (same) | 400 MHz (same) | 400 MHz (same) |
| Silicon Revision | 2.x ('E' suffix) | 2.x ('E' suffix) | 2.x ('E' suffix) | 1.x (no 'E') | Pre-1.x |
| Gigabit Ethernet MAC | Yes | Yes | No (Fast Ethernet only) | No | No |
| Security Engine (SEC) | Yes (IPsec/SSL) | Yes | No | No | No |
| QUICC Engine | Yes (TDM/ATM/HDLC) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C (commercial variant) | -40C to +85C (commercial variant) |
Principaux différenciateurs
- Integrated security engine (SEC) for IPsec/SSL acceleration (vs MPC8358ECVVAGDGA)
- Gigabit Ethernet MAC integrated on-die (vs MPC8358ECVVAGDGA / MPC8360CVVAGDGA)
- Higher core frequency with same pinout (vs MPC8360ECVVAGDGA (533 MHz))
- Industrial -40C to +105C operating range (vs MPC8360VVAGDGA)
Notes de conception
The 740-TBGA package dissipates approximately 4-6 W under full load. Bond the center thermal pad to an inner ground pour with at least 1 square inch of copper on top and bottom layers, stitched with thermal vias (0.3 mm pitch, 0.5 mm drill) to a 4-layer FR-4 PCB. Without thermal pad bonding, junction temperature can exceed 105C in still air at 25C ambient, especially in enclosed router enclosures. Consider a small clip-on heatsink or forced-air cooling for fanless 1U appliances running near maximum throughput.
DDR2 traces must be length-matched within 50 mils (1.27 mm) for the byte lanes and routed with 50 ohm single-ended impedance to JEDEC JESD79-2. Vias in the DDR2 break-out region should be minimized; use a 4-layer stackup with the second layer as a solid ground plane under the BGA. The 1 mm ball pitch of the 740-TBGA requires microvia or fine-pitch via-in-pad technology for breakout on inner rows - confirm with your PCB fab house for BGA fanout rules before layout.
Do not substitute the MPC8360ECVVAGDGA with the non-'E' MPC8360 if your application uses the integrated security engine or gigabit Ethernet MAC - the older revision lacks both. Also confirm DDR2 termination topology (fly-by vs T-branch) per Micron/Intel DDR2 design guides; the MPC8360E expects fly-by VTT termination for DDR2-667 operation. Power sequencing requires 1.2 V core rail to ramp before 3.3 V I/O - use a power-good supervisor to enforce this.
The gigabit Ethernet GMII/RGMII traces must be length-matched within 100 mils and routed over a continuous ground reference. Keep SERDES reference clocks on a dedicated layer with controlled 50 ohm impedance. For PCI 2.2 at 66 MHz, keep trace lengths under 1500 mils and use source termination. USB 2.0 full-speed requires 90 ohm differential impedance and a common-mode choke near the connector.
Informations de conformité
Lead-free TBGA package per NXP product page. RoHS and REACH compliance inferred from 'Lead Free' and 'RoHS Status: Compliant' in DigiKey listing 1791583. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified part.