MPC8547VTAQGB - PowerPC e500 MPU 1GHz 783-FCBGA | NXP
부품 번호: MPC8547VTAQGB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $110.78 | $110.78 |
| 10 | $102.5 | $1,025.00 |
| 100 | $91.2 | $9,120.00 |
| 500 | $79.85 | $39,925.00 |
| 1,000 | $72.4 | $72,400.00 |
MPC8547VTAQGB 개요
An embedded microprocessor (MPU) is a CPU integrated into a system-on-chip (SoC) that combines processor cores, memory subsystems, and peripheral interfaces into a single device. MPC85xx MPUs occupy the tier of 32-bit embedded processors -> the sub-family of Power Architecture/POWER integrated processors -> the broader category of microprocessors (MPU) -> integrated circuits (IC) -> semiconductors. They are widely deployed as control-plane processors in networking and telecommunications equipment, where deterministic performance, multi-protocol I/O, and long product lifecycles are mandatory.
Key features include a PowerPC e500 core with dual-issue superscalar pipeline, integrated DDR memory controller, multiple Gigabit Ethernet MACs, PCI Express and RapidIO interfaces, and hardware encryption accelerators on selected variants. The 783-pin FCBGA (29x29 mm) package supports high-bandwidth parallel buses and multiple serial interfaces, with a thermal envelope suitable for industrial-temperature operation with proper PCB thermal design.
Architecturally, the e500 core uses a 7-stage pipeline with out-of-order execution capability, BookE-compliant virtualization extensions, and integrated L1/L2 caches. The device integrates a system interface unit (SIU), DMA controllers, and a local bus controller, eliminating the need for an external bridge chip and reducing BOM cost in dense networking designs.
Typical applications include enterprise routers and switches, edge and access network equipment, industrial control processors, military/aerospace secure routers, and telecom base-station controllers. The PowerQUICC III family is especially common in legacy and long-lifecycle systems where software stability and Freescale/NXP toolchain maturity outweigh raw GHz performance.
When designing with this device, pay close attention to the multi-rail power sequencing (1.1 V core must precede 1.8 V/2.5 V/3.3 V I/O), DDR signal-integrity routing on the BGA breakout, and thermal management - the 783-ball FCBGA has a non-trivial theta_JA that requires a multilayer PCB with thermal vias under the package.
This page synthesizes distributor pricing, package-compatible MPC85xx drop-in alternatives, and practical design notes not collected in any single manufacturer datasheet, giving engineers a faster path from datasheet to board bring-up.
드롭인 대체품: MPC8547VTAQGB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8547VTAQGB (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Core Architecture, Maximum Core Frequency, RoHS Status, L2 Cache.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8547VTALGB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8545VTAQGB
✅ 드롭인✓ 재고 있음
$115.4 / 개
데이터시트 보기 →MPC8543VTAQGB
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →MPC8547EVTANG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8547VTAQGB 최대 정격 & 전기적 특성
| Processor Type | PowerPC e500 Microprocessor IC, MPC85xx PowerQUICC III |
| Core Architecture | Power Architecture (BookE), 32-bit |
| Core Count | 1 |
| Maximum Core Frequency | 1.0 GHz |
| Core Supply Voltage | 1.1 V |
| I/O Supply Voltages | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.09 um CMOS |
| 패키지 / 케이스 | 783-FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Pb-Free) |
| Integrated Memory Controller | DDR/DDR2 SDRAM (per MPC85xx family) |
| Integrated Ethernet MACs | Multiple Gigabit Ethernet MACs (per MPC85xx family) |
| Serial Interfaces | PCI Express, RapidIO, UART, I2C, SPI (per MPC85xx family) |
| Lead-Free Status | Yes (Pb-Free per datasheet suffix) |
MPC8547VTAQGB 783-fcbga (29x29 mm) 핀 구성 가이드
MPC8547VTAQGB(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8547VTAQGB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8547VTAQGB 적합 용도: 6 애플리케이션s: Enterprise Router Control Plane, Ethernet Switch Management Plane, Telecom Base Station Baseband, Industrial Control Processor, Defense and Aerospace Secure Router, Network Attached Storage Controller.
Enterprise Router Control Plane
The MPC8547VTAQGB's 1.0 GHz PowerPC e500 core and integrated multi-Gigabit Ethernet MACs make it a strong control-plane processor for enterprise routers. Deployed on the routing-engine board to run routing daemons (OSPF, BGP, IS-IS) and management plane (SNMP, NETCONF) on Linux or VxWorks. The integrated DDR/DDR2 controller sustains the routing table lookups; the four SGMII MACs connect to PHY interfaces for management and fabric uplinks. With 1.0 GHz core speed, the part handles full Internet route tables (800k+ IPv4 routes) at line-rate for control-plane updates. The 783-FCBGA package is industry-standard for this tier, ensuring reference designs are widely available.
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Ethernet Switch Management Plane
In Layer 2/3 managed Ethernet switches, the MPC8547VTAQGB acts as the management-plane CPU running the switching ASIC's control software, CLI, SNMP agent, and spanning-tree protocols. The 1.0 GHz e500 core provides deterministic interrupt latency required for protocol timers (STP, LLDP, LACP). The integrated PCI Express or local bus connects to the switching ASIC for register access, while a dedicated Gigabit Ethernet MAC serves the out-of-band management port. Power sequencing across the four rails (1.1 V core, 1.8 V/2.5 V/3.3 V I/O) is critical and must follow the NXP MPC8547 datasheet timing diagram.
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Telecom Base Station Baseband
The MPC8547VTAQGB serves as the baseband control processor in small-cell and picocell base stations, where its deterministic real-time performance and integrated multi-protocol I/O (PCI Express, RapidIO, Ethernet) handle the MAC-layer scheduling and backhaul. The e500 BookE extensions enable hardware-assisted virtualization for partitioning baseband and management workloads. The 0.09 um CMOS process and industrial temperature support make it suitable for outdoor telecom enclosures with proper thermal design. Pin compatibility with other MPC85xx parts enables product-line scaling from small-cell to macro-cell with PCB reuse.
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Industrial Control Processor
For industrial automation controllers, the MPC8547VTAQGB's Power Architecture ecosystem provides long-lifecycle software stability - a critical requirement for industrial customers running the same controller for 10-15 years. The integrated DDR controller, multiple UARTs, and PCI Express interface support motion-control, PLC, and SCADA workloads. The 783-FCBGA package with extended temperature options suits factory-floor deployment. Industrial-control software stacks (VxWorks, Green Hills INTEGRITY, Linux with PREEMPT_RT) are mature and well-supported on this silicon, reducing integration risk versus newer ARM-based SoCs.
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Defense and Aerospace Secure Router
In defense applications, the MPC8547VTAQGB (or its 'E' security-enabled sibling MPC8547EVTANG) provides the routing and encryption control plane for tactical network equipment. The PowerQUICC III family is widely used in defense programs due to its long product lifecycle, US-domestic supply chain options, and certification artifacts available through NXP's aerospace and defense program. Hardware SEC 2.0+ accelerators on the 'EV' suffix variants offload IPSec and SSL/TLS, freeing the 1.0 GHz core for routing decisions and policy enforcement. Conduction-cooled chassis designs leverage the FCBGA's thermal via interface.
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Network Attached Storage Controller
The MPC8547VTAQGB's integrated Gigabit Ethernet MACs and PCI Express make it suitable as the main controller in entry-level to mid-range Network Attached Storage (NAS) appliances. The e500 core runs the storage stack (SMB, NFS, iSCSI) and file-system (ext4, ZFS, Btrfs), while PCI Express connects to SATA or SAS controller ASICs for disk attachment. The 1.0 GHz core delivers sufficient throughput for SMB/NFS serving at Gigabit line-rate, and the integrated DDR2 controller supports the large page-cache memory required for streaming workloads. Reference designs from NXP simplify the NAS appliance development.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8547VTAQGB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8547VTALGB | MPC8545VTAQGB | MPC8543VTAQGB | MPC8547EVTANG |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Frequency | 1.0 GHz | ~833 MHz | 1.0 GHz | 1.0 GHz | ~800 MHz (security variant) |
| Core Count | 1 | 1 | 1 | 1 | 1 |
| Architecture | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) + SEC 2.0+ |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| I/O Voltages | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Hardware Encryption | No | No | No | No | Yes (SEC 2.0+) |
| Lifecycle Status | NRNDR | NRNDR | NRNDR | NRNDR | NRNDR |
주요 차별점
- Highest peripheral integration with hardware encryption option (vs MPC8545VTAQGB)
- Industry-standard 783-FCBGA footprint shared across MPC85xx family (vs TI Sitara AM5728)
- Mature PowerQUICC III toolchain and long-lifecycle software support (vs NXP Layerscape LS1043A)
설계 노트
Power sequencing is critical for the MPC8547VTAQGB: the 1.1 V core supply must reach its threshold before any of the I/O rails (1.8 V / 2.5 V / 3.3 V), and all rails must ramp monotonically per the datasheet power-up diagram. Use a sequencing supervisor such as NXP's PF0100 PMIC or discrete MOSFET OR-ing to enforce the order. Failure to sequence correctly can latch the I/O pins into an indeterminate state and cause permanent device damage.
The 783-FCBGA (29x29 mm) package has a theta_JA that requires a multilayer PCB (minimum 6 layers) with a thermal-via array directly under the package center. Place copper pours on top and inner layers tied to the thermal vias to spread heat. At 1.0 GHz continuous operation, expect junction-to-ambient thermal resistance around 15-20 C/W with a properly designed 1-oz copper thermal pad. For conduction-cooled chassis, expose the thermal pad to the chassis cold wall via a heat-spreader plate.
Escape routing the 783-ball FCBGA at 1.0 mm pitch requires microvia-in-pad (VIP) or via-on-pad PCB technology with stacked or staggered microvias. Outer-layer breakout should fan out over 4-6 routing layers with 0.1 mm trace/space. Maintain 100 ohm differential impedance for PCI Express and Gigabit Ethernet SGMII pairs, and route them over a continuous reference plane with no splits. Use length matching within 150 mils for the SGMII pairs to meet AC timing.
DDR/DDR2 memory routing must follow the JEDEC specification for the chosen data rate - all DQ/DQS byte groups must be length-matched within 25 mils and routed on inner layers with 50 ohm single-ended impedance to a continuous ground reference plane. Reference the Micron or Samsung DDR layout application note for the specific memory part selected. Use IBIS-AMI simulation to validate signal integrity at the target 533 MT/s DDR2 speed.
Three common pitfalls: (1) forgetting the JTAG pinout - the MPC8547 expects the COP/JTAG header per the datasheet, and the absence of a debug port bricks board bring-up; (2) not connecting unused Ethernet MAC pins - per the datasheet, unused MAC pins must be tied off in a defined state, not left floating; (3) ignoring the reset strapping resistors on the LA/LB/LC local bus pins - incorrect strap values put the part in a test mode instead of normal operation.
규정 준수 정보
RoHS compliant per Verified Electronics listing (PB Free suffix). Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable - this is a 32-bit embedded microprocessor, not an automotive analog IC. Conflict minerals statement per NXP's standard RMI report.