MT40A1G16KH-062E - 16Gb DDR4 x16 Automotive SDRAM | Micron
부품 번호: MT40A1G16KH-062E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $24.03 | $24.03 |
| 10 | $22.83 | $228.30 |
| 100 | $21.63 | $2,163.00 |
| 500 | $20.43 | $10,215.00 |
| 1,000 | $19.22 | $19,220.00 |
MT40A1G16KH-062E 개요
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is a volatile DRAM technology in the broader memory hierarchy of memory ICs, succeeding DDR3 and preceding DDR5. DDR4 SDRAMs transfer data on both clock edges, use a low-voltage 1.2V core supply, and rely on a memory controller for refresh and timing management in embedded and computing systems.
Key features include the x16 I/O organization suited to memory systems with limited ball count, the -062E speed grade, POD (pseudo-open drain) I/O signaling for reduced power, and automotive screening. The FBGA code D8BHR identifies this die within Micron's part numbering. The 'AUT:E' order code denotes automotive temperature range (-40C to +125C) with the E-edge metallization option, per the 16Gb x8/x16 Automotive DDR4 SDRAM (Z32D) datasheet.
Architecturally, the device uses an 8n prefetch, bank-group architecture with internal banks accessible concurrently, and supports standard DDR4 features such as CA parity, DBI (data bus inversion), and programmable refresh modes. At 1.2V VDD operation and POD12 termination, active and standby power are reduced relative to DDR3 equivalents at the same density, which matters for thermally constrained automotive modules.
Typical applications include automotive ADAS sensor fusion and domain controllers, infotainment and cluster SoC memory, industrial gateways, and network appliances that require 16Gb density in a single x16 component with extended temperature capability. High pin-count FPGA or SoC memory controllers with x16 DDR4 interfaces pair naturally with this part.
A key design consideration is signal integrity: DDR4-3200-class x16 interfaces require careful fly-by or point-to-point topology, ODT calibration, and reference voltage layout discipline. Confirm your memory controller supports the -062E speed bin timings before layout lock.
This page synthesizes distributor pricing, verified drop-in alternatives (including Alliance Memory equivalents), and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: MT40A1G16KH-062E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MT40A1G16KH-062E (동일 폼 팩터 및 풋프린트) — 차이점: Interface, Package, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT40A1G16KD-062E IT:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT40A1G16KNR-062E:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT40A1G16TD-062E AIT:F
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT40A1G16KH-062E:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AS4C1G16D4A-62BCN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT40A1G16KH-062E 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| Density | 16 Gbit |
| 메모리 구성 | 1G x 16 |
| Clock Frequency | 1.6 GHz |
| Access Time (Row Cycle) | 19 ns |
| Speed Grade | -062E |
| 인터페이스 | Parallel, POD12 |
| Core Supply Voltage | 1.2 V |
| 동작 온도 | -40C to +125C (Automotive) |
| 패키지 | 96-FBGA (9 x 13 mm) |
| FBGA Code | D8BHR |
| Qualification | Automotive (AUT) |
| 실장 유형 | Surface Mount |
| Prefetch | 8n |
MT40A1G16KH-062E 96-fbga (9 x 13 mm) 핀 구성 가이드
MT40A1G16KH-062E(96-fbga (9 x 13 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT40A1G16KH-062E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT40A1G16KH-062E 적합 용도: 6 애플리케이션s: Automotive ADAS Domain Controllers, Automotive Infotainment and Cluster, Industrial Gateways and Edge AI, Networking and Telecom Equipment, FPGA-Based Test and Measurement, Medical Imaging and Diagnostics.
Automotive ADAS Domain Controllers
The MT40A1G16KH-062E AUT:E is a strong fit for ADAS domain and zonal controllers because it combines 16Gb density in a single x16 component with -40C to +125C automotive screening. Modern ADAS SoCs executing neural-network inference for camera, radar, and lidar fusion require multi-gigabit working memory; one 1G x 16 DDR4 supplies 2 GB of frame-buffer and model-storage capacity while the 96-FBGA (9 x 13 mm) footprint keeps the memory subsystem compact. The POD12 1.2V interface reduces termination power in thermally constrained enclosures. Circuit role: connect to the SoC DDR4 x16 controller with fly-by routing, ZQ calibration, and ODT tuning; the -062E bin supports DDR4-3200 class throughput. Trade-off: single-rank x16 means burst granularity is coarser than two x8 parts, so verify controller scheduling efficiency.
추천
Automotive Infotainment and Cluster
Digital cockpit systems - instrument clusters, center displays, and infotainment SoCs - demand high-bandwidth volatile memory for graphics compositing and multi-display rendering. The MT40A1G16KH-062E AUT:E provides 16Gb per component at a 1.6 GHz clock (19 ns tRC), and its automotive qualification with -40C to +125C operation meets AEC-oriented environmental requirements for cockpit electronics mounted near heat sources. The x16 organization matches common infotainment SoC DDR4 PHYs, reducing trace count versus x32 aggregations. In circuit, the DDR4 sits between the SoC memory controller and the display pipeline, with VTT termination and CA parity enabled for reliability. Performance consideration: the 8n prefetch bank-group architecture sustains the sequential bandwidth that multi-stream video decode requires, while self-refresh minimizes power during standby.
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Industrial Gateways and Edge AI
Industrial edge gateways running containerized workloads and lightweight AI inference benefit from the MT40A1G16KH-062E's 16Gb single-component density and DDR4-3200-class bandwidth. The 1.2V POD12 interface lowers standby power for fanless DIN-rail or wall-mounted enclosures, and the extended -40C to +125C temperature headroom provides margin for conduction-cooled industrial designs even when using the commercial or industrial temperature variants (AAT:E / AIT:E). Circuit role: pair one or two components with an industrial SoC or x16-capable FPGA memory controller; the 96-FBGA footprint supports standard DDR4 DIMM-free layout rules with 40-ohm controlled-impedance traces. Design consideration: implement periodic ZQ calibration and temperature-compensated refresh to maintain data integrity across wide ambient swings typical of unconditioned industrial cabinets.
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Networking and Telecom Equipment
Routers, switches, and 5G small-cell equipment use x16 DDR4 components for packet buffers, session tables, and control-plane memory. The MT40A1G16KH-062E delivers 16Gb at 1.6 GHz with 19 ns row cycle time, and its 8n prefetch bank-group architecture sustains the random-access rates that deep packet processing requires. The 96-FBGA (9 x 13 mm) package allows four components on a 64-bit bus without excessive board area, and POD12 termination reduces power in always-on network hardware. Circuit role: mount on the network processor or switch ASIC DDR4 controller with fly-by address topology, onboard VTT termination regulator, and CA parity enabled. Performance consideration: the -062E speed bin supports DDR4-3200 operation; confirm your ASIC memory controller's qualified speed bins and die-revision support list before committing to the layout.
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FPGA-Based Test and Measurement
High-end oscilloscopes, logic analyzers, and arbitrary waveform generators use DDR4 SDRAM behind FPGA memory controllers to buffer long acquisition records. The MT40A1G16KH-062E's 1G x 16 organization and 16Gb density provide 2 GB of capture memory per component, and its 1.6 GHz operation with 19 ns tRC delivers the sustained write bandwidth needed at multi-GSa/s acquisition rates when interleaved across multiple devices. The 96-FBGA footprint suits dense FPGA board layouts, and 1.2V POD12 I/O limits power in instruments with sealed thermal designs. Circuit role: connect via the FPGA's hard or soft DDR4 controller (e.g., Xilinx/Intel memory IP) with calibrated read/write leveling. Design consideration: x16 devices simplify the PHY but reduce burst-chop flexibility versus x8, so plan interleaving depth accordingly.
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Medical Imaging and Diagnostics
Ultrasound, digital radiography, and point-of-care diagnostic systems require large, reliable frame buffers with long product lifecycles. The MT40A1G16KH-062E offers 16Gb per component - 2 GB in a single 96-FBGA (9 x 13 mm) package - allowing image-pipeline memory to fit on compact medical module boards. Micron's automotive screening practices and long-term availability commitments translate well to medical platforms that need multi-year component continuity, and the extended -40C to +125C AUT:E option provides thermal margin for sterilizable handheld probes and fanless cart electronics. Circuit role: the DDR4 sits between the imaging SoC and the display/render path, with the 1.2V POD12 interface minimizing heat in sealed enclosures. Consideration: enable DBI (data bus inversion) to cut I/O switching power during continuous high-frame-rate video streaming.
추천
추천 제품 요약
엔지니어링 참조 데이터: MT40A1G16KH-062E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT40A1G16KD-062E IT:E | MT40A1G16KNR-062E:E | MT40A1G16TD-062E AIT:F | MT40A1G16KH-062E:E | AS4C1G16D4A-62BCN |
|---|---|---|---|---|---|---|
| Package | 96-FBGA (9 x 13 mm) | 96-FBGA (9 x 13 mm) - same | 96-FBGA (9 x 13 mm) - same | 96-FBGA (9 x 13 mm) - same | 96-FBGA (9 x 13 mm) - same | 96-FBGA (9 x 13 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Alliance Memory | Alliance Memory |
| Density / Organization | 16 Gbit, 1G x 16 | 16 Gbit, 1G x 16 | 16 Gbit, 1G x 16 | 16 Gbit, 1G x 16 | 16 Gbit, 1G x 16 | 16 Gbit, 1G x 16 |
| Clock Frequency | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.6 GHz (-62 class) |
주요 차별점
- Automotive screening with -40C to +125C (vs MT40A1G16TD-062E AIT:F)
- Second-source availability with identical part number (vs MT40A1G16KH-062E:E)
- x16 organization minimizes trace count (vs MT40A1G8WE-083E)
설계 노트
At DDR4-3200 class rates (1.6 GHz clock), route the x16 data bus as tightly length-matched point-to-point pairs and use fly-by topology for address/command with the calibration scheme your controller supports. Enable write leveling, read training, and VrefDQ training during bring-up; POD12 termination means the bus idles high, so verify termination regulator (VTT) placement near the loads. Estimated: keep trace skew within 10 ps across byte lanes and reference planes unbroken under all DDR4 nets to protect eye margins.
Estimated: with a 1.2V core supply, DDR4 active current for a 16Gb x16 device at full DDR4-3200 bandwidth can reach the ampere class; size the core rail regulator and plane copper for worst-case IDD values listed in the Micron datasheet IDD tables. Provide separate low-impedance planes for VDD, VDDQ, and VPP, and use one bulk capacitor plus multiple 0.1 uF/0.01 uF decoupling capacitors per ball cluster. Simulate with Micron-provided IBIS models rather than estimating current in layout reviews.
Do not treat same-family Micron die revisions (KH vs KD vs TD) as blind substitutes: DDR4 controllers store timing registers and init sequences that can differ between die revisions, and Micron's datasheet explicitly notes the x4 mode is not supported on this x16 part. Confirm your memory controller's qualified-vendor and die-revision list, verify the -062E speed bin timing set, and re-run read/write leveling after any substitution. Automotive designs must use the AUT suffix parts, not AIT/AAT variants.
규정 준수 정보
Micron automotive DDR4 parts are typically RoHS-compliant and AEC-oriented automotive qualified under Micron's AUT program, but explicit compliance declarations were not present in the provided web data; consult Micron's product page or request the material declaration sheet.
