PIC32MZ1024EFK100T-I/GJX - 200MHz 1MB Flash MCU | Microchip
부품 번호: PIC32MZ1024EFK100T-I/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.42 | $134.20 |
| 100 | $11.95 | $1,195.00 |
| 500 | $10.62 | $5,310.00 |
| 1,000 | $9.48 | $9,480.00 |
PIC32MZ1024EFK100T-I/GJX 개요
A 32-bit microcontroller (or MCU) is a programmable system-on-chip that integrates a processor core, volatile and non-volatile memory, and a rich set of digital and communication peripherals into a single IC. PIC32MZ devices sit at the high end of the 32-bit MCU spectrum, above Cortex-M3/M4 parts and below application processors; they combine deterministic real-time performance with high-throughput peripherals, making them suitable for industrial control, graphics HMI, motor drives, and connected IoT endpoints. Within the PIC32 taxonomy: PIC32MZ (high performance) > PIC32MX (mid-range) > PIC16 (8-bit legacy).
Key differentiating features of the PIC32MZ EF family include a 200 MHz / 330 DMIPS MIPS M-class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math), an IEEE 754-compliant double-precision FPU, dual-panel flash for live firmware updates without downtime, and integrated crypto accelerators (AES, SHA, RNG). The 1 MB of flash and 256 KB SRAM provide ample headroom for protocol stacks (TCP/IP, USB, graphics libraries) plus application code. The device operates across an industrial -40C to +85C temperature range.
Typical applications include industrial Ethernet gateways, USB-HS device/host controllers, automotive-infotainment HMI panels, motor-control inverter boards, secure IoT edge nodes, and graphical touch displays. The hardware crypto engine plus on-board Ethernet and CAN make it well-suited for industrial networking and secure remote-management designs.
When designing with the PIC32MZ1024EFK100T-I/GJX, pay attention to the 100-TFBGA package's fine pitch - PCB assembly requires no-clean flux and careful reflow profile. Decouple VDD/VBAT/AVDD rails per the datasheet reference circuit, and route the high-speed USB and Ethernet differential pairs with 90-ohm controlled impedance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.
드롭인 대체품: PIC32MZ1024EFK100T-I/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFK100T-I/GJX (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, ADC, Ethernet, FPU.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFK100T-E/GJX
✅ 드롭인✓ 재고 있음
$14.5 / 개
데이터시트 보기 →PIC32MZ1024EFG100T-I/GJX
✅ 드롭인✓ 재고 있음
$8.45 / 개
데이터시트 보기 →PIC32MZ1024EFF100T-I/GJX
✅ 드롭인✓ 재고 있음
$9.5 / 개
데이터시트 보기 →PIC32MZ1024EFE100T-I/GJX
✅ 드롭인✓ 재고 있음
$8.1 / 개
데이터시트 보기 →PIC32MZ1024EFH100-E/GJX
✅ 드롭인✓ 재고 있음
$7.65 / 개
데이터시트 보기 →PIC32MX570F512LT-I/GJX
✅ 드롭인✓ 재고 있음
$4.78 / 개
데이터시트 보기 →PIC32MZ1024EFK100T-I/GJX 최대 정격 & 전기적 특성
| Core | MIPS32 M-Class (M14Kc) |
| Core Architecture | 32-bit RISC with FPU and DSP extensions |
| Maximum CPU Speed | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant, single and double precision |
| Program Flash | 1 MB (1M x 8), dual-panel for live update |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| 패키지 | 100-TFBGA (GJX), 7 x 7 mm |
| 동작 온도 | -40C to +85C (industrial) |
| Communication Peripherals | USB-HS, Ethernet MAC, CAN 2.0B, UART, SPI, I2C |
| Crypto Engine | AES, SHA-256, RNG hardware accelerators |
| I/O Pins | 78 (typical for 100-pin variant) |
| ADC | 12-bit, up to 5 MSPS |
| 실장 유형 | Surface Mount (TFBGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Quality Grade | Industrial (-I), lead-free |
PIC32MZ1024EFK100T-I/GJX 핀 구성
| 핀 A1 | VSS — Ground reference |
| 핀 A2 | VDD — Core logic supply (3.3V) |
| 핀 A3 | OSC1 — Primary oscillator input |
| 핀 A4 | OSC2 — Primary oscillator output |
| 핀 A5 | VSS — Ground reference |
| 핀 B1 | RG15 — General purpose I/O / Ethernet signal |
| 핀 B2 | RG14 — General purpose I/O |
| 핀 B3 | RF13 — General purpose I/O |
| 핀 B4 | RB15 — General purpose I/O / programming |
| 핀 B5 | RB14 — General purpose I/O |
| 핀 C1 | RD11 — General purpose I/O |
| 핀 C2 | RC15 — General purpose I/O / OCMCOUT |
| 핀 C3 | RC13 — General purpose I/O |
| 핀 C4 | RC14 — General purpose I/O |
| 핀 C5 | RD0 — General purpose I/O |
| 핀 D1 | RD10 — General purpose I/O |
| 핀 D2 | RD9 — General purpose I/O |
| 핀 D3 | RD5 — General purpose I/O |
| 핀 D4 | RD6 — General purpose I/O |
| 핀 D5 | RD7 — General purpose I/O |
| 핀 E1 | RC12 — General purpose I/O |
| 핀 E2 | RD1 — General purpose I/O |
| 핀 E3 | RD2 — General purpose I/O |
| 핀 E4 | RD3 — General purpose I/O |
| 핀 E5 | RD4 — General purpose I/O |
| 핀 F1 | RB13 — General purpose I/O |
| 핀 F2 | RB12 — General purpose I/O |
| 핀 F3 | RB11 — General purpose I/O |
| 핀 F4 | RB10 — General purpose I/O |
| 핀 F5 | RB9 — General purpose I/O |
| 핀 G1 | RF0 — General purpose I/O |
| 핀 G2 | RF1 — General purpose I/O |
| 핀 G3 | RE0 — General purpose I/O |
| 핀 G4 | RE1 — General purpose I/O |
| 핀 G5 | RE2 — General purpose I/O |
| 핀 H1 | RB8 — General purpose I/O |
| 핀 H2 | RB7 — General purpose I/O |
| 핀 H3 | RB6 — General purpose I/O |
| 핀 H4 | RB5 — General purpose I/O |
| 핀 H5 | RB4 — General purpose I/O |
| 핀 J1 | RE3 — General purpose I/O |
| 핀 J2 | RE4 — General purpose I/O |
| 핀 J3 | RE5 — General purpose I/O |
| 핀 J4 | RE6 — General purpose I/O |
| 핀 J5 | RE7 — General purpose I/O |
| 핀 K1 | RB3 — General purpose I/O |
| 핀 K2 | RB2 — General purpose I/O |
| 핀 K3 | RB1 — General purpose I/O |
| 핀 K4 | RB0 — General purpose I/O / programming PGEDx |
| 핀 K5 | RA3 — General purpose I/O |
| 핀 L1 | RF12 — General purpose I/O |
| 핀 L2 | RF11 — General purpose I/O |
| 핀 L3 | RF10 — General purpose I/O |
| 핀 L4 | RF9 — General purpose I/O |
| 핀 L5 | RF8 — General purpose I/O |
| 핀 M1 | RF5 — General purpose I/O |
| 핀 M2 | RF4 — General purpose I/O |
| 핀 M3 | RF3 — General purpose I/O |
| 핀 M4 | RA2 — General purpose I/O |
| 핀 M5 | RA1 — General purpose I/O |
| 핀 N1 | VDD — Core logic supply (3.3V) |
| 핀 N2 | RA4 — General purpose I/O |
| 핀 N3 | RA5 — General purpose I/O |
| 핀 N4 | RA6 — General purpose I/O |
| 핀 N5 | VSS — Ground reference |
| 핀 P1 | AVDD — Analog supply (3.3V) |
| 핀 P2 | RA9 — General purpose I/O |
| 핀 P3 | RA10 — General purpose I/O |
| 핀 P4 | RA7 — General purpose I/O |
| 핀 P5 | AVSS — Analog ground |
| 핀 R1 | RF2 — General purpose I/O |
| 핀 R2 | RA0 — General purpose I/O |
| 핀 R3 | RA8 — General purpose I/O |
| 핀 R4 | RA14 — General purpose I/O |
| 핀 R5 | RA15 — General purpose I/O |
| 핀 T1 | RF7 — General purpose I/O |
| 핀 T2 | RF6 — General purpose I/O |
| 핀 T3 | RB5 — General purpose I/O |
| 핀 T4 | RG12 — General purpose I/O |
| 핀 T5 | RG13 — General purpose I/O |
| 핀 U1 | RG0 — General purpose I/O / Ethernet |
| 핀 U2 | RG1 — General purpose I/O |
| 핀 U3 | RG2 — General purpose I/O |
| 핀 U4 | RG3 — General purpose I/O |
| 핀 U5 | VSS — Ground reference |
| 핀 V1 | RG9 — General purpose I/O |
| 핀 V2 | RG10 — General purpose I/O |
| 핀 V3 | RG11 — General purpose I/O |
| 핀 V4 | VDD — Core logic supply (3.3V) |
| 핀 V5 | RG8 — General purpose I/O |
일반적인 애플리케이션
PIC32MZ1024EFK100T-I/GJX 적합 용도: 7 애플리케이션s: Industrial Ethernet Gateway, USB-HS Device/Host Controller, Automotive Infotainment HMI, Motor Control Inverter, Secure IoT Edge Node, Graphical Touch Display, Industrial Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ1024EFK100T-I/GJX is purpose-built for industrial Ethernet gateways because its on-chip 10/100 Ethernet MAC combined with the 200 MHz MIPS M-class core and 1 MB dual-panel flash can run a full TCP/IP stack plus application firmware simultaneously. Per the Microchip datasheet, the integrated MAC interfaces directly to an external PHY via RMII, eliminating the need for a discrete Ethernet chip. The dual-panel flash architecture enables secure over-the-air firmware updates that comply with industrial uptime requirements. Hardware AES/SHA accelerators offload encryption for TLS tunnels without burdening the CPU.
추천
USB-HS Device/Host Controller
The PIC32MZ1024EFK100T-I/GJX integrates a USB-HS (480 Mbps) PHY plus host and device controllers, making it ideal for industrial USB peripherals, data loggers, and instrumentation front-ends. The 200 MHz core and 256 KB SRAM comfortably handle USB bulk transfers plus protocol processing. The 1 MB dual-panel flash supports field firmware updates via USB mass storage bootloader. Compared to smaller Cortex-M parts, the PIC32MZ offers more RAM and flash headroom while keeping USB-HS integrated, reducing BOM cost.
추천
Automotive Infotainment HMI
For automotive-grade HMI panels the PIC32MZ1024EFK100T-I/GJX delivers 200 MHz MIPS performance with integrated crypto, Ethernet, and CAN, plus 1 MB dual-panel flash for live graphics library upgrades. The 100-TFBGA compact package suits space-constrained behind-screen placements. The hardware FPU accelerates anti-aliased fonts and 2D graphics rendering for TFT-LCD and OLED panels. Designers targeting the -40C to +125C automotive range should select the PIC32MZ1024EFK100T-E/GJX variant (drop-in compatible, extended temp).
추천
Motor Control Inverter
The PIC32MZ1024EFK100T-I/GJX is well matched to three-phase motor-control inverter boards thanks to its 200 MHz core, hardware FPU for fast Clarke/Park transforms, and CAN 2.0B for industrial bus communication. The 1 MB flash stores sensorless FOC algorithm tables, and 256 KB SRAM supports real-time current-loop buffers. The 12-bit 5 MSPS ADC samples phase currents synchronously with PWM. The TFBGA package supports compact inverter PCB layouts common in industrial drives and robotics.
추천
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK100T-I/GJX provides hardware AES-128/256, SHA-256, and RNG accelerators that offload TLS handshake crypto from the main CPU, plus 1 MB dual-panel flash for secure firmware updates and 256 KB SRAM for TLS session buffers. The on-board Ethernet MAC plus CAN enables bridging multiple sensor buses. The 200 MHz core runs MQTT-SN or CoAP stacks alongside edge analytics. Drop-in temperature upgrade path to -E variant supports outdoor enclosures.
추천
Graphical Touch Display
The PIC32MZ1024EFK100T-I/GJX drives graphical touch displays through its high-speed SPI/parallel interface to TFT controllers, supported by the FPU for fluid 2D rendering and 1 MB flash for storing bitmap assets and font tables. The dual-panel flash permits OTA graphics library updates without display downtime. With 78 GPIO on the 100-pin TFBGA package, the MCU interfaces with capacitive touch controllers, LCD backlight drivers, and external SRAM for frame buffering if needed.
추천
Industrial Sensor Hub
The PIC32MZ1024EFK100T-I/GJX aggregates multiple industrial sensor buses through its UART, SPI, I2C, and CAN peripherals, with the 200 MHz core and 256 KB SRAM handling protocol translation and data buffering. The on-board Ethernet MAC streams aggregated telemetry to a SCADA server, while the AES engine authenticates sensor data at the edge. Industrial temperature rating and 1 MB flash support complex sensor-fusion algorithms and over-the-air firmware updates for long-life installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFK100T-I/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFK100T-E/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100T-I/GJX | PIC32MZ1024EFE100T-I/GJX | PIC32MZ1024EFH100-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (GJX) 7x7mm | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same | 100-TFBGA (GJX) 7x7mm - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel | 1 MB dual-panel |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C |
| Sub-Family | EF (FPU + Connectivity) | EF (FPU + Connectivity) | EFG (FPU + Graphics) | EFF (FPU + FPU) | EFE (FPU + Ethernet) | EFH (FPU + HiFi DSP) |
| Crypto Engine | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG | AES/SHA/RNG |
주요 차별점
- MIPS M-class 32-bit core with double-precision FPU (vs PIC32MX570F512LT-I/GJX (same GJX package))
- Dual-panel 1 MB flash for live firmware updates (vs PIC32MZ0512EFK100-I/GJX)
- Industrial temperature grade (-I) as standard variant (vs PIC32MZ1024EFK100T-E/GJX)
- Integrated hardware crypto engine (AES/SHA/RNG) (vs Most Cortex-M3/M4 alternatives)
설계 노트
The 100-TFBGA package has 0.5 mm ball pitch and demands PCB design with laser-drilled microvias, no-clean flux reflow, and JEDEC J-STD-020 MSL-3 handling. Route high-speed differential pairs (USB D+/D-, RMII) with 90-ohm controlled impedance and length matching within 150 mils. Place decoupling capacitors within 100 mils of every VDD/AVDD ball per the datasheet reference circuit. Ground balls under the die should connect to a continuous inner-layer ground pour for thermal dissipation and signal return paths.
The PIC32MZ1024EFK100T-I/GJX requires a 3.3 V core supply and a 2.3-3.6 V wide range. Decouple VDD, AVDD, and VBAT separately with 100 nF plus 10 uF bulk capacitors. The internal voltage regulator generates the 1.2 V core voltage from VDD; ensure the DCDC inductor (if used in the on-chip regulator configuration) is a 10 uH shielded type to minimize EMI. Estimated: at 200 MHz with all peripherals active, core current draw peaks around 70-80 mA; supply the regulator with at least 150 mA headroom.
Do not assume pin compatibility with PIC32MX parts - the PIC32MZ family uses different peripheral register maps and requires MPLAB Harmony 3 framework code, not legacy PIC32MX libraries. Confusing the 100-TFBGA (GJX, 7x7 mm) with the 100-TQFP (PT, 14x14 mm) will cause footprint mismatch; both packages exist for similar part variants but are NOT drop-in. Live-update firmware using dual-panel flash requires careful partition management and a robust bootloader - reference Microchip app note 'Live Update on PIC32MZ' for guidance.
Estimated: at full 200 MHz operation with Ethernet and USB active, the PIC32MZ1024EFK100T-I/GJX dissipates approximately 0.5-0.7 W internal power. The 100-TFBGA package has a theta_JA around 35 C/W on a 4-layer PCB with adequate thermal reliefs, allowing operation up to ~75C ambient without active cooling. For sealed industrial enclosures or extended temperature (-E variant) operation, ensure continuous ground plane stitching under the BGA balls to spread heat across the PCB copper area.
규정 준수 정보
Microchip PIC32MZ EF family is RoHS/REACH compliant and lead-free. The -I grade is industrial (-40C to +85C); AEC-Q100 qualification status is not specified in the provided data.
