PIC32MZ2025DAA176-I/2J - 200MHz 32-bit MCU, 2MB Flash | Microchip
부품 번호: PIC32MZ2025DAA176-I/2J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.32 | $11.32 |
| 10 | $10.45 | $104.50 |
| 100 | $9.18 | $918.00 |
| 250 | $8.62 | $2,155.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.4 | $7,400.00 |
PIC32MZ2025DAA176-I/2J 개요
A 32-bit microcontroller (MCU) is a single-chip processor core with integrated Flash, RAM and peripherals aimed at embedded applications. Microcontrollers sit inside the broader semiconductor hierarchy and the PIC32MZ DA family specifically targets applications that historically required a microprocessor plus external controller, combining MPU-like computational throughput with MCU simplicity, deterministic interrupts, and an easy-to-use toolchain (MPLAB X IDE + Harmony v3). The DA suffix further denotes the graphics-equipped variant of the family, integrating a display controller and 2D graphics processor to drive TFT LCD panels without an external GPU.
Key differentiating features of this part include 200 MHz / 330 DMIPS core throughput, 2 MB dual-bank Flash with live update support, a 12-bit 18 MSPS ADC with up to 45 analog channels for motor and sensor acquisition, integrated Hi-Speed USB 2.0 (480 Mbps) with PHY, two CAN 2.0b controllers, and a parallel Graphics Controller driving resolutions up to WXGA (1280x768). The 640 KB SRAM and dedicated DDR2 interface let the system hold frame buffers and graphics assets without an external memory controller.
Architecturally, the device combines a MIPS32 microAptiv core with a 7-stage pipeline, a tightly-coupled FPU, MMU for RTOS support, and dedicated bus masters for the graphics and USB peripherals. The integrated DDR2 controller simplifies BOM by removing external SDRAM glue logic, and the 32 MB on-chip graphics RAM enables smooth UI transitions on embedded TFT panels. The exposed thermal pad on the LQFP-176 package supports 1.5 W continuous dissipation typical of graphics HMI designs.
Typical applications include industrial HMI panels, point-of-sale terminals, medical patient-interface displays, automotive infotainment prototypes, building automation touchscreens, and portable instrumentation requiring USB host/device connectivity. The 2 MB Flash and 640 KB SRAM also suit multi-protocol gateways where TCP/IP, Modbus and CAN coexist. When designing with this part, ensure the DDR2 PCB layout follows the JEDEC DDR2 routing recommendations (matched-length, reference-controlled impedance) and that the exposed pad is soldered to a sufficiently large copper area to meet the thermal envelope. This page synthesizes distributor pricing, drop-in same-package alternatives and practical design notes not always covered by the manufacturer datasheet.
드롭인 대체품: PIC32MZ2025DAA176-I/2J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2025DAA176-I/2J (동일 폼 팩터 및 풋프린트) — 차이점: Package, CAN, USB, Core Architecture, External Memory Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1064DAA176-I/2J
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1025DAA176-I/2J
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC32MZ2064DAA176-I/2J
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.26 / 개
데이터시트 보기 →PIC32MZ2025DAB176-I/2J
✅ 드롭인✓ 재고 있음
$10.8 / 개
데이터시트 보기 →PIC32MZ2025DAH176-I/2J
✅ 드롭인✓ 재고 있음
$4.83 / 개
데이터시트 보기 →PIC32MZ2025DAK176-I/2J
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →PIC32MZ2025DAA176T-I/2J
✅ 드롭인✓ 재고 있음
$7.83 / 개
데이터시트 보기 →PIC32MZ2025DAA176-I/2J 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Operating Voltage Range | 1.7 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| 패키지 | 176-LQFP (20x20) with Exposed Pad |
| 핀 수 | 176 |
| GPIO | 120 |
| USB | Hi-Speed USB 2.0 (Host/Device, 480 Mbps) |
| CAN | 2x CAN 2.0b |
| Graphics | Integrated Graphics Controller + 2D Graphics Processor |
| External Memory Interface | DDR2 DRAM up to 128 MB; 32 MB on-chip graphics RAM |
| 동작 온도 | -40C to +85C (Industrial) |
| 실장 유형 | Surface Mount (Tray) |
| RoHS 상태 | Compliant |
PIC32MZ2025DAA176-I/2J 핀 구성
| 핀 1 | RF0 — General purpose I/O |
| 핀 2 | RF1 — General purpose I/O |
| 핀 3 | VDD — Digital supply (1.7-3.6 V) |
| 핀 4 | RF2 — General purpose I/O |
| 핀 5 | RF3 — General purpose I/O |
| 핀 6 | RF4 — General purpose I/O |
| 핀 7 | RF5 — General purpose I/O |
| 핀 8 | VSS — Digital ground |
| 핀 9 | RF6 — General purpose I/O |
| 핀 10 | RF7 — General purpose I/O |
| 핀 11 | RG0 — General purpose I/O |
| 핀 12 | RG1 — General purpose I/O |
| 핀 13 | RG2 — General purpose I/O |
| 핀 14 | RG3 — General purpose I/O |
| 핀 15 | RG4 — General purpose I/O |
| 핀 16 | RG5 — General purpose I/O |
| 핀 17 | RG6 — General purpose I/O |
| 핀 18 | RG7 — General purpose I/O |
| 핀 19 | VSS — Digital ground |
| 핀 20 | RG8 — General purpose I/O |
| 핀 21 | RG9 — General purpose I/O |
| 핀 22 | VDD — Digital supply |
| 핀 23 | RH0 — General purpose I/O |
| 핀 24 | RH1 — General purpose I/O |
| 핀 25 | RH2 — General purpose I/O |
| 핀 26 | RH3 — General purpose I/O |
| 핀 27 | RH4 — General purpose I/O |
| 핀 28 | RH5 — General purpose I/O |
| 핀 29 | RH6 — General purpose I/O |
| 핀 30 | RH7 — General purpose I/O |
| 핀 31 | VSS — Digital ground |
| 핀 32 | RH8 — General purpose I/O |
| 핀 33 | RH9 — General purpose I/O |
| 핀 34 | RH10 — General purpose I/O |
| 핀 35 | RH11 — General purpose I/O |
| 핀 36 | RH12 — General purpose I/O |
| 핀 37 | RH13 — General purpose I/O |
| 핀 38 | RH14 — General purpose I/O |
| 핀 39 | RH15 — General purpose I/O |
| 핀 40 | VSS — Digital ground |
| 핀 41 | RJ0 — General purpose I/O |
| 핀 42 | RJ1 — General purpose I/O |
| 핀 43 | RJ2 — General purpose I/O |
| 핀 44 | RJ3 — General purpose I/O |
| 핀 45 | RJ4 — General purpose I/O |
| 핀 46 | RJ5 — General purpose I/O |
| 핀 47 | RJ6 — General purpose I/O |
| 핀 48 | RJ7 — General purpose I/O |
| 핀 49 | VSS — Digital ground |
| 핀 50 | RJ8 — General purpose I/O |
| 핀 51 | RJ9 — General purpose I/O |
| 핀 52 | RJ10 — General purpose I/O |
| 핀 53 | RJ11 — General purpose I/O |
| 핀 54 | VDD — Digital supply |
| 핀 55 | RK0 — General purpose I/O |
| 핀 56 | RK1 — General purpose I/O |
| 핀 57 | RK2 — General purpose I/O |
| 핀 58 | RK3 — General purpose I/O |
| 핀 59 | RK4 — General purpose I/O |
| 핀 60 | RK5 — General purpose I/O |
| 핀 61 | RK6 — General purpose I/O |
| 핀 62 | RK7 — General purpose I/O |
| 핀 63 | VSS — Digital ground |
| 핀 64 | RK8 — General purpose I/O |
| 핀 65 | RK9 — General purpose I/O |
| 핀 66 | RK10 — General purpose I/O |
| 핀 67 | RK11 — General purpose I/O |
| 핀 68 | RK12 — General purpose I/O |
| 핀 69 | RK13 — General purpose I/O |
| 핀 70 | RK14 — General purpose I/O |
| 핀 71 | VSS — Digital ground |
| 핀 72 | VDD — Digital supply |
| 핀 73 | RA0 — Analog/General purpose I/O |
| 핀 74 | RA1 — Analog/General purpose I/O |
| 핀 75 | RA2 — Analog/General purpose I/O |
| 핀 76 | RA3 — Analog/General purpose I/O |
| 핀 77 | RA4 — Analog/General purpose I/O |
| 핀 78 | RA5 — Analog/General purpose I/O |
| 핀 79 | RA6 — Analog/General purpose I/O |
| 핀 80 | RA7 — Analog/General purpose I/O |
| 핀 81 | VSS — Digital ground |
| 핀 82 | RA8 — Analog/General purpose I/O |
| 핀 83 | RA9 — Analog/General purpose I/O |
| 핀 84 | RA10 — Analog/General purpose I/O |
| 핀 85 | RA11 — Analog/General purpose I/O |
| 핀 86 | RA12 — Analog/General purpose I/O |
| 핀 87 | RA13 — Analog/General purpose I/O |
| 핀 88 | RA14 — Analog/General purpose I/O |
| 핀 89 | RA15 — Analog/General purpose I/O |
| 핀 90 | VSS — Digital ground |
| 핀 91 | RB0 — Analog/General purpose I/O |
| 핀 92 | RB1 — Analog/General purpose I/O |
| 핀 93 | RB2 — Analog/General purpose I/O |
| 핀 94 | RB3 — Analog/General purpose I/O |
| 핀 95 | RB4 — Analog/General purpose I/O |
| 핀 96 | RB5 — Analog/General purpose I/O |
| 핀 97 | RB6 — Analog/General purpose I/O |
| 핀 98 | RB7 — Analog/General purpose I/O |
| 핀 99 | RB8 — Analog/General purpose I/O |
| 핀 100 | RB9 — Analog/General purpose I/O |
| 핀 101 | VSS — Digital ground |
| 핀 102 | RB10 — Analog/General purpose I/O |
| 핀 103 | RB11 — Analog/General purpose I/O |
| 핀 104 | RB12 — Analog/General purpose I/O |
| 핀 105 | RB13 — Analog/General purpose I/O |
| 핀 106 | RB14 — Analog/General purpose I/O |
| 핀 107 | RB15 — Analog/General purpose I/O |
| 핀 108 | RC0 — General purpose I/O |
| 핀 109 | RC1 — General purpose I/O |
| 핀 110 | RC2 — General purpose I/O |
| 핀 111 | VSS — Digital ground |
| 핀 112 | RC3 — General purpose I/O |
| 핀 113 | RC4 — General purpose I/O |
| 핀 114 | RC5 — General purpose I/O |
| 핀 115 | RC6 — General purpose I/O |
| 핀 116 | RC7 — General purpose I/O |
| 핀 117 | RC8 — General purpose I/O |
| 핀 118 | RC9 — General purpose I/O |
| 핀 119 | RC10 — General purpose I/O |
| 핀 120 | RC11 — General purpose I/O |
| 핀 121 | VSS — Digital ground |
| 핀 122 | RC12 — General purpose I/O |
| 핀 123 | RC13 — General purpose I/O |
| 핀 124 | RC14 — General purpose I/O |
| 핀 125 | RC15 — General purpose I/O |
| 핀 126 | RD0 — General purpose I/O |
| 핀 127 | RD1 — General purpose I/O |
| 핀 128 | RD2 — General purpose I/O |
| 핀 129 | RD3 — General purpose I/O |
| 핀 130 | RD4 — General purpose I/O |
| 핀 131 | VSS — Digital ground |
| 핀 132 | RD5 — General purpose I/O |
| 핀 133 | RD6 — General purpose I/O |
| 핀 134 | RD7 — General purpose I/O |
| 핀 135 | RD8 — General purpose I/O |
| 핀 136 | RD9 — General purpose I/O |
| 핀 137 | RD10 — General purpose I/O |
| 핀 138 | RD11 — General purpose I/O |
| 핀 139 | VSS — Digital ground |
| 핀 140 | RD12 — General purpose I/O |
| 핀 141 | RD13 — General purpose I/O |
| 핀 142 | RD14 — General purpose I/O |
| 핀 143 | RD15 — General purpose I/O |
| 핀 144 | RE0 — General purpose I/O |
| 핀 145 | RE1 — General purpose I/O |
| 핀 146 | RE2 — General purpose I/O |
| 핀 147 | RE3 — General purpose I/O |
| 핀 148 | RE4 — General purpose I/O |
| 핀 149 | VSS — Digital ground |
| 핀 150 | RE5 — General purpose I/O |
| 핀 151 | RE6 — General purpose I/O |
| 핀 152 | RE7 — General purpose I/O |
| 핀 153 | RE8 — General purpose I/O |
| 핀 154 | RE9 — General purpose I/O |
| 핀 155 | VDD — Digital supply |
| 핀 156 | AVDD — Analog supply |
| 핀 157 | AVSS — Analog ground |
| 핀 158 | VBUS — USB bus voltage detect |
| 핀 159 | VUSB — USB transceiver supply |
| 핀 160 | D+ — USB D+ |
| 핀 161 | D- — USB D- |
| 핀 162 | VDD — Digital supply |
| 핀 163 | VSS — Digital ground |
| 핀 164 | OSC1 — Crystal oscillator input |
| 핀 165 | OSC2 — Crystal oscillator output |
| 핀 166 | SOSC1 — Secondary crystal oscillator input (RTC) |
| 핀 167 | SOSC2 — Secondary crystal oscillator output (RTC) |
| 핀 168 | MCLR — Master clear reset (active-low) |
| 핀 169 | VDD — Digital supply |
| 핀 170 | TRCLK — Trace clock (debug) |
| 핀 171 | TRD0 — Trace data 0 |
| 핀 172 | TRD1 — Trace data 1 |
| 핀 173 | TRD2 — Trace data 2 |
| 핀 174 | TRD3 — Trace data 3 |
| 핀 175 | PGEC1 — ICSP programming clock |
| 핀 176 | PGED1 — ICSP programming data |
일반적인 애플리케이션
PIC32MZ2025DAA176-I/2J 적합 용도: 6 애플리케이션s: Industrial HMI Touch Panels, Point-of-Sale Terminals, Medical Patient-Interface Displays, Building Automation Touchscreens, Portable Test and Measurement, Automotive Infotainment Prototyping.
Industrial HMI Touch Panels
The PIC32MZ2025DAA176-I/2J's integrated Graphics Controller and 2D Graphics Processor make it well suited for industrial HMI panels driving 7-10 inch TFT LCDs at WVGA to WXGA resolutions. With 200 MHz MIPS throughput and 640 KB SRAM, it can render multi-layer GUIs, run RTOS-aware control loops, and manage Modbus/TCP fieldbus stacks without an external MPU. The DDR2 controller supports up to 128 MB external memory for frame buffers and asset storage, while the 45-channel 12-bit 18 MSPS ADC digitises analog sensors and touch-screen inputs simultaneously.
추천
Point-of-Sale Terminals
POS terminals require fast GUI response, secure connectivity and reliable peripheral integration. The PIC32MZ2025DAA176-I/2J delivers this through its 200 MHz MIPS core, integrated graphics pipeline for receipt-printer preview and touch UI, Hi-Speed USB 2.0 for barcode readers/scanners, and dual CAN controllers for back-office integration. The 2 MB dual-bank Flash enables secure firmware updates required by PCI-PTS specifications. Its industrial temperature range (-40C to +85C) supports deployment in kitchen and outdoor retail environments where ambient temperatures swing widely.
추천
Medical Patient-Interface Displays
Medical display terminals require deterministic UI behaviour, low electromagnetic emissions and long-term firmware support. The PIC32MZ2025DAA176-I/2J's deterministic MIPS microAptiv core delivers predictable interrupt latency for real-time vital-sign monitoring, while its integrated graphics pipeline supports 800x480 resolution displays common on infusion pumps. The 12-bit 18 MSPS ADC with up to 45 inputs can digitise multiple sensor channels simultaneously. Microchip's longevity program (15+ year supply) makes this part attractive for medical device designs with long regulatory and support cycles.
추천
Building Automation Touchscreens
Building automation panels consolidate HVAC, lighting, security and access-control functions behind a single graphical interface. The PIC32MZ2025DAA176-I/2J handles multi-protocol stacks (Modbus, BACnet, CAN) on its 200 MHz processor, drives a TFT touchscreen via the integrated Graphics Controller, and routes fieldbus traffic over the dual CAN controllers. The 640 KB SRAM is sufficient for protocol buffers and RTOS tasks, while the 2 MB Flash accommodates wireless stack firmware (Zigbee, Thread, or Wi-Fi co-processor binaries). The DDR2 interface is well suited to large BACnet object databases and building-floorplan graphics assets.
추천
Portable Test and Measurement
Handheld oscilloscopes, data loggers and protocol analysers benefit from the PIC32MZ2025DAA176-I/2J's combination of 12-bit ADC bandwidth (45 channels at 18 MSPS), USB 2.0 Hi-Speed for PC data export, and TFT-LCD graphics for waveform display. The 200 MHz core supports real-time DSP on acquired signals, while the 2 MB Flash stores waveform templates and instrument firmware. Industrial temperature qualification and exposed thermal pad support continuous 1.5 W dissipation typical of battery-charged portable instruments.
추천
Automotive Infotainment Prototyping
The PIC32MZ2025DAA176-I/2J supports early-stage automotive infotainment and cluster prototypes where production-grade AEC-Q100 qualification is not yet mandatory. Its 200 MHz MIPS core, integrated graphics pipeline, CAN 2.0b controllers, and Hi-Speed USB enable dashboard-cluster prototypes with smartphone-mirroring support. Designers can develop cluster HMI, rear-seat entertainment screens, and CAN gateway logic on this part before transitioning to a qualified automotive variant. The 176-LQFP exposed pad aids thermal dissipation in enclosed dash enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2025DAA176-I/2J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1064DAA176-I/2J | PIC32MZ1025DAA176-I/2J | PIC32MZ2064DAA176-I/2J | PIC32MZ2025DAB176-I/2J | PIC32MZ2025DAH176-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) with ePAD | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 1 MB (-50%) | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 1024 KB (+60%) | 1024 KB (+60%) | 1024 KB (+60%) | 640 KB | 640 KB or larger tier |
| Operating Voltage | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V |
| Graphics Controller | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU |
| Hi-Speed USB | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Integrated Graphics Controller and 2D GPU eliminate external display silicon (vs PIC32MX795F512L-80I/PF)
- DDR2 controller supports up to 128 MB external memory (vs PIC32MZ1025DAL176-I/2J)
- 12-bit 18 MSPS ADC with 45 analog inputs (vs PIC32MX775F512L-80I/PF)
설계 노트
When routing the external DDR2 interface, follow JEDEC DDR2 PCB recommendations: matched-length within 25 mils on each byte lane, controlled 50-ohm single-ended impedance, reference plane continuity on adjacent layers, and series-termination resistors placed close to the MCU pins. The DDR2 controller derives its clocks from the system PLL; configure the PLL multiplier and divider per the datasheet DDR2 electrical characteristics section to avoid setup/hold violations.
Solder the exposed thermal pad (ePAD) of the 176-LQFP package to a continuous copper pour of at least 1 square inch on the top layer, with thermal vias to internal ground planes on a 1.2 mm pitch grid. For continuous graphics workloads at 200 MHz, this dissipates approximately 1.5 W. Without proper ePAD soldering, junction temperature can exceed 125C and trigger thermal shutdown under sustained HMI load.
Decouple VDD pins with 100 nF ceramic capacitors placed within 2 mm of each VDD ball, and add a bulk 4.7 uF to 10 uF ceramic near the package. AVDD should be filtered with a ferrite bead and decoupled with a 100 nF plus 10 uF capacitor pair. The VUSB pin (3.3V USB transceiver supply) requires its own 100 nF + 4.7 uF decoupling pair to meet USB 2.0 Hi-Speed signal-integrity requirements.
Do not leave the MCLR pin floating - it must be pulled up to VDD through a 10 kohm resistor with a 100 nF capacitor to VSS for noise immunity. Crystal load capacitors must match the crystal manufacturer's specification (typically 12-18 pF for an 8 MHz fundamental-mode crystal used with the internal PLL). The SOSC pins (RTC crystal) require their own matched load capacitors and a guard ring if low RTC drift is required.
규정 준수 정보
Industrial temperature grade (-40C to +85C). RoHS compliant per Microchip product page and distributor listings. Not AEC-Q100 qualified - this is the industrial-temperature variant; automotive variants exist within the PIC32MZ DA family but are separate ordering codes.