RTAX1000S-1CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip
부품 번호: RTAX1000S-1CGS624V ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX1000S-1CGS624V 개요
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environments encountered in orbital and deep-space missions. Within the power-management hierarchy of spacecraft avionics, the FPGA sits between the radiation-hardened processor and the payload interfaces, implementing glue logic, bus interfaces, telemetry encoding, and payload data-path functions. The RTAX-S family is the flight-proven backbone of this category, descended from the commercial Axcelerator architecture.
Key differentiating features include the non-volatile antifuse programming technology, which delivers true live-at-power-up operation with no configuration device required, single-chip form factor that eliminates external boot flash (a common failure point in space systems), embedded SRAM blocks with built-in FIFO control logic, segmentable clock circuitry, and chip-wide highway routing resources for predictable high-fanout timing.
Architecturally, the RTAX1000S is built on a CMOS process with a 1.5V nominal core supply. The logic fabric comprises registered logic cells organized into Cluster Logic Blocks (CLBs), supported by embedded SRAM modules and clock-management resources. Radiation tolerance is achieved through a combination of design hardening and the inherently SEU-immune antifuse routing, which cannot be reprogrammed by ionizing particle strikes.
Typical applications include satellite command and data handling, payload processing and telemetry formatting, spacecraft bus interface bridging (MIL-STD-1553, SpaceWire front-ends), launch-vehicle avionics, and instrumentation for scientific probes where live-at-power-up operation is a mission requirement.
Designers should note that RTAX-S devices are one-time programmable: logic must be fully verified via the Microchip (Microsemi) Libero IDE flow and, ideally, prototyped on a reprogrammable ProASIC3E-based Aldec adaptor before committing flight hardware.
This page synthesizes distributor pricing signals, drop-in alternatives within the RTAX-S/SL family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: RTAX1000S-1CGS624V — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX1000S-1CGS624V (동일 폼 팩터 및 풋프린트) — 차이점: Package, Radiation Tolerance, System Gates, Configuration, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX1000S-1CGS624B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
RTAX1000S-CGS624E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
RTAX1000SL-1CGS624V
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX1000SL-CGS624V
✅ 드롭인✓ 재고 있음
$3400 / 개
데이터시트 보기 →RTAX2000S-1CGS624EV
✅ 드롭인✓ 재고 있음
$3600 / 개
데이터시트 보기 →RTAX1000S-1CGS624V 최대 정격 & 전기적 특성
| Equivalent System Gates | 1,000,000 |
| Dedicated Logic Cells | 18144 |
| Cluster Logic Blocks (CLBs) | 12096 |
| Technology | CMOS, antifuse-based |
| Core Supply Voltage | 1.5 V |
| Family | RTAX-S (Radiation-Tolerant) |
| Programming Type | One-Time Programmable (antifuse) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| 패키지 | CGS624 (624-ball ceramic column grid array) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -55C to +125C |
| Radiation Tolerance | Designed for space-flight radiation environments |
| Live at Power-Up | Yes (no external configuration device) |
| System Features | Segmentable clocks, chip-wide highway routing |
| Application Domain | Space-flight systems |
RTAX1000S-1CGS624V cgs624 (624-ball ceramic column grid array) 핀 구성 가이드
RTAX1000S-1CGS624V(cgs624 (624-ball ceramic column grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX1000S-1CGS624V.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX1000S-1CGS624V 적합 용도: 6 애플리케이션s: Satellite Command and Data Handling, Payload Data Processing, Spacecraft Bus Interface Bridging, Launch Vehicle Avionics, Deep-Space Science Probes, Radiation Test and Engineering Model Boards.
Satellite Command and Data Handling
The RTAX1000S-1CGS624V fits spacecraft C&DH systems because its 1M-gate fabric, 18144 logic cells, and antifuse routing deliver configuration-immune logic for telemetry encoding, telecommand decoding, and housekeeping aggregation. Live-at-power-up operation means the FPGA is functional the instant spacecraft power is applied, with no boot sequencer or configuration flash that could fail in orbit. The embedded SRAM blocks with built-in FIFO control handle buffering between the processor bus and downlink formatter without external memory. The -55C to +125C ceramic-packaged device tolerates eclipse thermal cycling in vacuum. Designers typically bridge MIL-STD-1553 or SpaceWire front-ends to an internal bus in this fabric, taking advantage of segmentable clock resources for deterministic timing across the C&DH datapath.
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Payload Data Processing
Instrument payloads such as imagers and spectrometers require deterministic, radiation-tolerant preprocessing of high-rate data streams. The RTAX1000S-1CGS624V provides 1,000,000 gates and chip-wide highway routing that supports wide datapaths with predictable timing, while embedded FIFO-enabled SRAM absorbs rate mismatch between detector interfaces and mass-memory or downlink chains. Because the antifuse interconnect is immune to configuration upsets, no scrubbing controller is required, freeing system resources and simplifying the single-event-effects analysis. The 1.5V core CMOS process keeps dynamic power manageable within typical payload power budgets of tens of watts. Prototyping on the Aldec ACT-H3Ki-CG624 adaptor (ProASIC3E-based) lets teams validate algorithms on the flight PCB footprint before committing one-time-programmable flight units.
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Spacecraft Bus Interface Bridging
Legacy spacecraft buses frequently mix signaling standards; the RTAX1000S-1CGS624V serves as the glue-logic bridge between processor modules, 1553 transceivers, discrete commanding interfaces, and telemetry acquisition chains. With 18144 logic cells and 12096 CLBs, it integrates what previously required dozens of rad-tolerant SSI/MSI devices, improving board reliability and reducing part count - a direct mission-success metric. The true single-chip form factor eliminates external configuration storage, and live-at-power-up behavior ensures command interfaces are available through spacecraft power transitions. Designers exploit the segmentable clock network to isolate interface timing domains from the payload clock domain, and the 624-ball ceramic CGS package provides the I/O count needed for large discrete-monitoring arrays on avionics motherboards.
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Launch Vehicle Avionics
Launch environments combine severe vibration, wide thermal transients, and ionizing-dose exposure during passage through the belts, demanding electronics with both mechanical and radiation robustness. The RTAX1000S-1CGS624V in its hermetic 624-ball ceramic column grid array survives these conditions while providing -55C to +125C operation for booster avionics bays. Its antifuse fabric delivers deterministic timing and instant-on operation critical for flight-critical sequencers, flight-termination interfaces, and telemetry encoders that must function from first power application. One-time programmability is an advantage here: the configuration is physically fixed and cannot be altered by upset or fault, simplifying safety-case arguments for range-safety and flight-termination subsystems. The 1M-gate capacity accommodates complete sequencer plus telemetry chains in one device.
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Deep-Space Science Probes
Deep-space missions face TID accumulation and intense single-event environments for which the RTAX1000S-1CGS624V was explicitly developed as part of the RTAX-S radiation-tolerant family. Its antifuse configuration storage is unaffected by upsets, so instruments continue operating through solar particle events without watchdog resets or reconfiguration delays - essential for missions where an unplanned reset can lose irreplaceable science data. The embedded SRAM with FIFO control buffers instrument telemetry, while 18144 logic cells implement acquisition sequencing, compression pre-processing, and instrument health-monitoring logic. The low static power of CMOS antifuse technology conserves the limited power of radioisotope-powered probes far from the Sun, where every watt of the RTAX1000S budget matters to overall mission margins.
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Radiation Test and Engineering Model Boards
Before flight-unit commitment, programs build engineering-model and radiation-test boards. The RTAX1000S-1CGS624V is one-time programmable, so Microchip and Aldec jointly provide the ACT-H3Ki-CG624 prototyping adaptor, which mimics the CG624 BGA footprint with a flash-based ProASIC3E device. Teams iterate RTL on the actual flight PCB, then port the verified design to the RTAX flow in the Microchip Libero IDE, keeping timing and pinout constraints identical. The 12096-CLB RTAX1000S capacity matches typical test payloads, and segmentable clocks reproduce flight clocking schemes. This reprogrammable-to-OTP workflow reduces schedule risk significantly, since each RTAX1000S-1CGS624V flight unit represents a substantial screening and lead-time investment that cannot absorb design-error respins.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX1000S-1CGS624V — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX1000S-1CGS624B | RTAX1000S-CGS624E | RTAX1000SL-1CGS624V | RTAX2000S-1CGS624EV |
|---|---|---|---|---|---|
| Package | CGS624 (624-ball ceramic column grid array) | CGS624 - same | CGS624 - same | CGS624 - same | CGS624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 2,000,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Screening / Flow Suffix | V suffix flow | B suffix flow | E suffix flow | V suffix flow (SL fabric) | EV suffix flow |
주요 차별점
- Antifuse fabric eliminates configuration SEU risk (vs RTAX2000S-1CGS624EV)
- Lowest risk alternative for qualification-locked programs (vs RTAX1000SL-1CGS624V)
- Honest trade-off: fixed 1M-gate capacity (vs RTAX2000S-1CGS624EV)
설계 노트
RTAX-S devices are one-time programmable. Any logic change after programming requires newly programmed flight parts with full lead time. Always prototype using the Aldec ACT-H3Ki-CG624 reprogrammable adaptor (flash-based ProASIC3E mimicking the CG624 footprint) and complete timing closure in the Microchip Libero IDE before releasing flight units to programming. Budget at least one full EM iteration; attempting to skip prototyping on OTP space devices is the single most expensive mistake in RTAX programs.
The RTAX1000S uses a 1.5V nominal core supply per series data. Follow the RTAX-S/SL datasheet (DS2169) power-supply sequencing and decoupling guidance for the CGS624 package; provide low-impedance 1.5V core rails and adequate bulk capacitance at the ceramic package to handle simultaneous switching of the 18144-cell fabric. Estimated: core current scales with toggle rate, so use Microchip's power estimator in Libero with your actual design before finalizing the spacecraft power budget.
The CGS624 is a ceramic column grid array; column (rather than ball) construction demands careful land-pattern design and reflow profile control to avoid column coplanarity issues. Follow the land pattern in the RTAX-S/SL datasheet and IPC-recommended ceramic BGA practices for your assembler. Hermetic ceramic packages in vacuum require cleanliness control - avoid flux residues under the package since rework under a 624-column array is effectively impossible after flight-unit attachment.
규정 준수 정보
Space-grade hermetic ceramic package; compliance data not stated in provided web data. Qualification follows MIL-PRF-38535 Class V flows per Microchip DLA Cross Reference Guide context; verify exact screening with the manufacturer.
