RTAX1000SL-1CGS624B - Rad-Tolerant FPGA 1M Gates | Microchip
부품 번호: RTAX1000SL-1CGS624B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4200 | $4,200.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3650 | $365,000.00 |
| 500 | $3400 | $1,700,000.00 |
| 1,000 | $3200 | $3,200,000.00 |
RTAX1000SL-1CGS624B 개요
A radiation-tolerant FPGA (Field-Programmable Gate Array) is a programmable logic device engineered to survive the total ionizing dose (TID) and single-event effects present in space-flight radiation environments. Within the semiconductor hierarchy, it sits under programmable logic > FPGA > radiation-tolerant FPGA, and the RTAX-S/SL family is qualified for mission-critical defense and space programs, including DLA Standard Microcircuit Drawing qualification (5962-0422006QUA) per MIL-PRF-38535 Class V.
Key features include live-at-power-up operation thanks to the anti-fuse (flash-free) fabric, a true single-chip form factor that removes the need for external configuration devices, and low static power consumption - all decisive advantages over SRAM-based FPGAs in orbit. The device is built on a digital CMOS process derived from the commercial Axcelerator architecture.
Technically, the RTAX-S/SL fabric provides embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing, enabling high-performance signal processing at densities up to 4 million system gates across the broader family. The SL variant adds enhanced radiation hardness for longer-duration missions.
Typical applications include satellite payload processing, spacecraft command and data handling (C&DH), telemetry encoding/decoding, and space-borne instrumentation where reconfiguration after launch is not required but survival across a 10+ year mission is.
Design consideration: the anti-fuse technology is one-time programmable - thorough pre-flight verification with Microchip (Microsemi) Libero design tooling is essential, and space-grade availability is constrained, so early procurement planning is advised.
This page synthesizes distributor stock data, DLA cross-references, and drop-in alternatives not found on the manufacturer product page alone.
드롭인 대체품: RTAX1000SL-1CGS624B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX1000SL-1CGS624B (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration, Technology, Embedded Memory, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX1000SL-1CGS624E
✅ 드롭인✓ 재고 있음
$3420 / 개
데이터시트 보기 →RTAX1000SL-CGS624B
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →RTAX1000SL-CGS624E
✅ 드롭인✓ 재고 있음
$3970 / 개
데이터시트 보기 →RTAX1000SL-1CGS624V
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX2000SL-1CGS624V
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTAX1000S-1LG624V
✅ 드롭인✓ 재고 있음
$3600 / 개
데이터시트 보기 →RTAX1000SL-1LG624V
✅ 드롭인✓ 재고 있음
$975 / 개
데이터시트 보기 →RTAX1000SL-1CGS624B 최대 정격 & 전기적 특성
| Logic Density | 1,000,000 equivalent system gates |
| ASIC Gates | 125,000 additional ASIC gates |
| Configurable Logic Blocks (CLBs) | 12096 |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Series | RTAX1000SL |
| Speed Grade | -1 |
| Technology | Digital CMOS |
| Programming Technology | Anti-fuse (one-time programmable, live at power-up) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| 패키지 | 624-ball Ceramic CGA (CGS624) |
| 실장 유형 | Surface Mount |
| Radiation Tolerance | Radiation-tolerant (space flight qualified) |
| Qualification | DLA SMD 5962-0422006QUA per MIL-PRF-38535 |
| Architecture Base | Derived from Microsemi commercial Axcelerator family |
RTAX1000SL-1CGS624B 624-ball ceramic cga (cgs624) 핀 구성 가이드
RTAX1000SL-1CGS624B(624-ball ceramic cga (cgs624) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX1000SL-1CGS624B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX1000SL-1CGS624B 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Command and Data Handling (C&DH), Telemetry Encoding and Decoding, Space-borne Instrumentation and Imaging, Launch Vehicle Avionics, Deep Space Probe Electronics.
Satellite Payload Data Processing
The RTAX1000SL-1CGS624B fits payload processing chains in LEO and GEO satellites where 1,000,000 system gates and 12,096 CLBs provide capacity for compression, encryption, and beamforming pipelines. Its embedded SRAM with built-in FIFO control logic buffers high-rate sensor streams, while the anti-fuse fabric runs live at power-up without external configuration memory - eliminating a single point of failure during deployment. Placed downstream of ADCs or receivers, it performs deterministic processing with segmentable clocks supporting multiple independent processing domains. Unlike SRAM FPGAs, no configuration scrubber is required, reducing board complexity and power draw, a decisive benefit on constrained payload power budgets.
추천
Spacecraft Command and Data Handling (C&DH)
For C&DH modules, the RTAX1000SL-1CGS624B implements bus interfaces (MIL-STD-1553-class logic, custom telemetry formats) and housekeeping sequencers that must survive total ionizing dose over a multi-year mission. The radiation-tolerant anti-fuse fabric retains configuration through single-event events, ensuring the command path stays alive after orbital anomalies. With 125,000 additional ASIC gates available, designers can implement glue logic that would otherwise occupy a separate ASIC, reducing part count and qualification burden. The true single-chip form factor simplifies rad-hard board design, and DLA SMD 5962-0422006QUA qualification streamlines flight program acceptance documentation.
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Telemetry Encoding and Decoding
The RTAX1000SL-1CGS624B suits CCSDS-style telemetry encoders and decoders where deterministic timing and radiation tolerance dominate. The -1 speed grade delivers high fabric performance on CMOS anti-fuse technology, while embedded SRAM blocks implement interleaver and buffer structures with FIFO control included on-chip. Because the fabric is live at power-up, downlink chains begin transmitting immediately after satellite separation events without a configuration sequence - valuable during launch and early operations (LEOP). The 624-ball ceramic CGA package provides hermetic protection and ample user I/O for parallel telemetry interfaces, with chip-wide highway routing easing wide data-path placement across the 1M-gate fabric.
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Space-borne Instrumentation and Imaging
Scientific instruments and imaging payloads use the RTAX1000SL-1CGS624B to time acquisition, format CCD/CMOS sensor data, and pre-process frames near the focal plane. The low static power of the CMOS anti-fuse fabric matters inside thermally constrained instrument enclosures, and radiation tolerance prevents log-periodic image corruption from configuration upsets. Segmentable clock resources let one FPGA drive multiple sensor readout modes, and the 12,096-CLB capacity absorbs detector-specific interfaces that vary between instrument builds. Designers prototype logic on commercial counterparts, then migrate to flight units with Microchip Libero tooling, preserving timing constraints across the design flow.
추천
Launch Vehicle Avionics
Launch vehicle avionics benefit from the RTAX1000SL-1CGS624B's live-at-power-up behavior: flight control and sequencing logic is operational the instant power is applied, with no boot latency that could miss critical event windows. The radiation-tolerant fabric withstands the intense transient radiation belts crossed during ascent, and the hermetic 624-ball ceramic CGA package resists launch vibration and thermal cycling. With 1M system gates, engineers implement redundant two-out-of-three voting logic, fault management, and telemetry formatting in a single device, replacing multiple rad-hard SSI/MSI components and shrinking board area in weight-critical avionics bays.
추천
Deep Space Probe Electronics
Deep-space missions impose the harshest radiation budgets, and the SL variant of the RTAX family adds enhanced radiation hardness for these durations. The RTAX1000SL-1CGS624B hosts spacecraft autonomy logic, fault detection/isolation/recovery (FDIR) state machines, and science data compression that must run unattended for a decade or more. Anti-fuse configuration cannot be upset by galactic cosmic rays, removing scrubber design risk far from Earth. The DLA 5962-0422006QUA QML qualification supports program-level reliability audits, and the 125,000 ASIC gates allow custom protocol engines where off-the-shelf interfaces do not exist, consolidating critical electronics into one qualified, single-chip device.
추천
추천 제품 요약
엔지니어링 참조 데이터: RTAX1000SL-1CGS624B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX1000SL-1CGS624E | RTAX1000SL-CGS624B | RTAX2000SL-1CGS624V | RTAX1000S-1LG624V |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 624-ball Ceramic CGA (CGS624) | CGS624 - same | CGS624 - same | CGS624 - same | LG624 - 624-ball ceramic variant |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | ~2,000,000 | 1,000,000 |
| Speed Grade | -1 | -1 | base | -1 | -1 |
| Radiation Hardness | SL enhanced radiation-tolerant | SL enhanced | SL enhanced | SL enhanced | standard RTAX-S |
| Programming Technology | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up |
주요 차별점
- Enhanced SL radiation hardness (vs RTAX1000S-1LG624V)
- Same-footprint upgrade path (vs RTAX2000SL-1CGS624V)
- DLA SMD-qualified flight pedigree (vs Commercial A3PE3000-1FGG624-class parts)
설계 노트
The RTAX-S/SL anti-fuse fabric is one-time programmable - there is no reconfiguration after programming. Freeze the RTL, complete timing closure in Microchip Libero, and run full simulation before releasing flight-lot silicon. A post-programming logic bug cannot be patched in the field, unlike SRAM FPGAs. Budget one spare device per board build for contingency.
RTAX-S/SL devices are prized for low static power because there is no configuration RAM to hold - but dynamic power still scales with clock frequency and toggle rate. Estimate core current using the Microchip power calculator with your actual design; do not size the spacecraft power bus from datasheet typical values alone. Decouple core and I/O rails with low-ESR ceramics placed at the ball-via fanout.
The 624-ball ceramic CGA (column grid array) requires careful PCB pad geometry - use column-array (CGA) land patterns per the Microchip package drawing, not standard BGA pads, because solder columns change reflow behavior. Support the heavy hermetic package with adequate pad retention and inspect with X-ray for column voids after assembly.
With 624 balls of available I/O, allocate return-path reference planes before assigning signals. Keep clock distribution on segmentable clock resources per the RTAX-S/SL architecture, and reserve chip-wide highway routing for wide synchronous buses. Simulate flight-representative stub lengths on ceramic column packages, as their added height slightly alters impedance versus flip-chip BGA peers.
규정 준수 정보
Space-grade hermetic ceramic package; qualified under DLA SMD 5962-0422006QUA per MIL-PRF-38535 (Class V program context). RoHS/REACH certificates not present in provided data - request certificate of conformance from Microchip.
