SAL-TC277TP-64F200NDC - AURIX TC27xT 200MHz MCU | Infineon
부품 번호: SAL-TC277TP-64F200NDC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $49.95 | $49.95 |
| 10 | $47.45 | $474.50 |
| 100 | $44.96 | $4,496.00 |
| 500 | $42.46 | $21,230.00 |
| 1,000 | $39.96 | $39,960.00 |
SAL-TC277TP-64F200NDC 개요
An AURIX TC2 microcontroller is a multicore automotive-grade MCU built on Infineon's TriCore architecture, which unifies microcontroller, DSP, and RISC capabilities in a single processor core. Within the power management and embedded control hierarchy, it sits at the top of real-time safety MCUs, classified as a 32-bit multicore microcontroller for ISO 26262 ASIL-D systems.
Key features include the innovative multicore architecture with up to three independent 32-bit TriCore CPUs engineered to meet the highest safety standards, a powerful Generic Timer Module (GTM) for precise PWM generation, and an integrated Ethernet controller for high-speed in-vehicle networking. Four CAN nodes support legacy automotive bus communication, and lockstep execution with memory protection units enables safe task isolation.
The TC27xT family is designed to reduce system complexity and power consumption while achieving best-in-class real-time performance. Task partitioning across the three cores allows safety-critical functions to run independently from non-critical application software, improving system reliability and reducing certification effort for ASIL-D software development.
Typical applications include automotive engine control units (ECUs), transmission control, battery management systems (BMS), electric power steering, and advanced driver assistance systems (ADAS). The Ethernet interface supports vehicle-to-everything (V2X) communication and over-the-air (OTA) software updates, while long-term availability makes it a preferred choice for automotive OEMs and tier-1 suppliers.
When designing with this MCU, pay close attention to power supply sequencing between the 3.3V I/O and 1.3V core rails, and use proper decoupling and PCB layout practices to minimize noise on the GTM and Ethernet interfaces.
드롭인 대체품: SAL-TC277TP-64F200NDC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SAL-TC277TP-64F200NDC (동일 폼 팩터 및 풋프린트) — 차이점: CAN Nodes, Ethernet, Max Clock Frequency, Package, SRAM (incl. Cache).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SAK-TC277TP-64F200N DC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TC277TP64F200NDCLXUMA1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC277TP-64F200S DC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAL-TC277TP-64F200S-CA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC297TP-128F300SBCKXUMA1
⚡ 동일 패키지✓ 재고 있음
$29.6 / 개
데이터시트 보기 →SAL-TC277TP-64F200NDC 최대 정격 & 전기적 특성
| Core Architecture | 3x 32-bit TriCore CPUs (multicore) |
| Max Clock Frequency | 200 MHz |
| Program Memory | 4 MB Flash |
| SRAM (incl. Cache) | 472 KB (nominal) |
| CAN Nodes | 4 |
| Ethernet | Yes (integrated Ethernet controller) |
| Timer Module | Generic Timer Module (GTM) |
| Functional Safety | ISO 26262 compliant |
| 패키지 | PG-LFBGA-292-6 (292-ball LFBGA, square) |
| Terminal Form | Ball (BGA) |
| Number of Terminals | 292 |
| 실장 유형 | Surface Mount |
SAL-TC277TP-64F200NDC pg-lfbga-292-6 (292-ball lfbga, square) 핀 구성 가이드
SAL-TC277TP-64F200NDC(pg-lfbga-292-6 (292-ball lfbga, square) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SAL-TC277TP-64F200NDC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SAL-TC277TP-64F200NDC 적합 용도: 6 애플리케이션s: Engine Control Unit (ECU), Battery Management System (BMS), Electric Power Steering (EPS), Transmission Control, ADAS Domain Controller Support, Industrial Motor Control and Robotics.
Engine Control Unit (ECU)
The TC277TP's three 200 MHz TriCore cores and 4 MB Flash handle crank-angle-synchronous combustion control, knock correction, and OBD monitoring in parallel with safety task isolation required for ASIL-D powertrain systems. The Generic Timer Module (GTM) generates high-resolution injection and ignition PWM signals in hardware, offloading CPU load. Four CAN nodes interface with the vehicle network while lockstep monitoring detects faults in real time.
추천
Battery Management System (BMS)
In EV battery management, the TC277TP executes state-of-charge and state-of-health algorithms across its three cores while dedicating lockstep execution to safety-relevant overvoltage and thermal supervision. Its 4 MB Flash stores extensive calibration data and diagnostic logs, and the Ethernet controller links battery controllers in ring topologies for domain-controlled architectures. ISO 26262 compliance reduces the OEM's safety certification burden at vehicle level.
추천
Electric Power Steering (EPS)
EPS demands sub-millisecond torque-control loop closure with redundant fault detection - precisely what the TC277TP delivers with its GTM-based PWM generation for the three-phase motor bridge and lockstep cores supervising torque sensor processing. The 200 MHz cores run field-oriented control and assist-curve computation concurrently. Four CAN nodes support chassis-domain communication with gateway redundancy required by steering safety goals.
추천
Transmission Control
Automatic and dual-clutch transmissions require simultaneous pressure, clutch, and gear-position control with strong functional safety. The TC277TP's parallel cores separate shift-strategy computation from solenoid PWM generation and diagnostic monitoring, while 4 MB Flash holds multiple shift-map calibration sets for OTA-updatable driving profiles. The 150C-capable N-grade device suits mounting locations near the transmission housing.
추천
ADAS Domain Controller Support
As a chassis-adjacent safety MCU, the TC277TP complements high-performance ADAS SoCs by handling deterministic actuator control, sensor-fusion safety monitoring, and fallback strategies. Its Ethernet controller connects to camera/radar front ends and the domain gateway, while the TriCore cores execute the safety monitor path mandated by ISO 26262 for ADAS functions. The GTM provides hardware-timed sensor triggering with microsecond precision.
추천
Industrial Motor Control and Robotics
Beyond automotive, the TC277TP's DSP-capable TriCore architecture and GTM execute multi-axis servo control with functional-safety stop functions (STO support) required by industrial machinery standards. Three 200 MHz cores run current loops, trajectory planning, and fieldbus stacks concurrently, and the Ethernet controller connects to PROFINET/ EtherCAT-adjacent industrial networks. The 292-ball LFBGA supports high-density, vibration-tolerant industrial drive designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: SAL-TC277TP-64F200NDC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SAK-TC277TP-64F200N DC | SAK-TC277TP-64F200S DC | SAK-TC297TP-128F300SBCKXUMA1 |
|---|---|---|---|---|
| Package | PG-LFBGA-292-6 | PG-LFBGA-292-6 - same | PG-LFBGA-292-6 - same | PG-LFBGA-292 - same footprint |
| Brand | Infineon | Infineon | Infineon | Infineon |
| CPU Cores | 3x 32-bit TriCore | 3x 32-bit TriCore | 3x 32-bit TriCore | 3x 32-bit TriCore |
| Max Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 300 MHz |
| Flash Memory | 4 MB | 4 MB | 4 MB | 16 MB |
| Functional Safety | ISO 26262 compliant | ISO 26262 compliant | ISO 26262 compliant | ISO 26262 compliant (AURIX family) |
주요 차별점
- Extended +150C ambient rating (vs SAK-TC277TP-64F200S DC)
- High memory density in TC2 family (vs SAK-TC277TP-64F200N DC)
- Same-footprint upgrade path (vs SAK-TC297TP-128F300SBCKXUMA1)
설계 노트
The TC277TP requires multiple supply rails (3.3V I/O and approximately 1.3V core). Implement proper power-up sequencing so core and I/O rails satisfy datasheet ramp requirements, and add a supervisor/reset IC on the reset line. Each supply pin pair should be locally decoupled with 100 nF ceramics placed within 2 mm of the ball via, plus bulk capacitance near the package.
The 292-ball LFBGA requires a via-in-pad or dog-bone escape fan-out on 0.8 mm/1.0 mm ball pitch. Follow Infineon's PG-LFBGA-292-6 footprint data exactly: non-solder-mask-defined pads and symmetry to avoid tombstoning during reflow. Inspect with X-ray or AOI after assembly - hidden BGA solder defects are the leading cause of field failures on this class of package.
Do not mix S-grade (+125C) and N-grade (+150C) variants in the same ECU BOM without re-qualifying thermal margins - the temperature difference between SAL-TC277TP-64F200N DC and SAK-TC277TP-64F200S DC is the primary spec divergence. Also verify the ordering-code routing: LXUMA1/CKXUMA1 suffixes denote packaging/routing variants, not different silicon.
규정 준수 정보
Device is ISO 26262 compliant per Infineon and automotive-qualified (AURIX family). RoHS/REACH/lead-free status not stated in provided data - verify on Infineon product page.
