STMicroelectronics

STM32H753XIH6TR - 480MHz Cortex-M7 MCU 2MB Flash | STMicroelectronics

부품 번호: STM32H753XIH6TR ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.62 V to 3.6 V Vdss 240+25-ball TFBGA 14x14 mm Package 480 MHz Speed 2 MB dual-bank, read-while-write Memory
시작가 $16.1 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-10
볼륨 가격
수량 단가 합계
1 $28.5 $28.50
10 $25.2 $252.00
100 $22.1 $2,210.00
500 $19.45 $9,725.00
1,000 $17.8 $17,800.00
2,500 $16.1 $40,250.00
ℹ️ 모든 가격은 USD 기준입니다

STM32H753XIH6TR 개요

The STMicroelectronics STM32H753XIH6TR is a high-performance 32-bit ARM Cortex-M7 microcontroller with double-precision FPU and L1 cache (16 Kbytes data + 16 Kbytes instruction cache), operating at up to 480 MHz and delivering 1027 DMIPS / 2.14 DMIPS/MHz (Dhrystone 2.1). It integrates 2 MB of on-chip Flash and 1 MB of SRAM, packaged in a 240+25-ball TFBGA (14x14 mm) that is supplied on 7-inch Tape & Reel (the TR suffix denotes the tape-and-reel packaging option of the STM32H753XIH6 bare-chip version).

What is a Cortex-M7 MCU? An ARM Cortex-M7 microcontroller is the highest-performance core in the Cortex-M family, targeting applications that previously required a Cortex-M4 or even a Cortex-A application processor. It combines an in-order superscalar pipeline with single- and double-precision floating-point, tightly-coupled memory, and an instruction/data cache. Hierarchy: Cortex-M7 -> Cortex-M -> 32-bit MCU -> microcontroller -> embedded computing. The STM32H7 family extends this with ST's smart peripheral architecture for motor control and high-speed data acquisition.

Key features include 480 MHz core speed, 2 MB dual-bank Flash with read-while-write support for live firmware updates, 1 MB SRAM split into DTCM, AXI-SRAM, SRAM1-4, and Backup domains, an 8- to 14-bit ADC up to 3.6 MSPS, USB 2.0 OTG full-speed/high-speed, two CAN 2.0B interfaces, an Ethernet MAC with 10/100-Mbit/s MII/RMII, two SAIs for audio, an SDMMC interface for SD-cards, and integrated crypto/hash accelerators (AES-256, SHA-1/SHA-2, True Random Number Generator). The TFBGA-240+25 provides 168+ flexible I/O pins configurable as GPIO, communication, analog, or timer channels.

The architecture pairs a Cortex-M7 with an optional Cortex-M4 in dual-core STM32H745/H755 parts, but the STM32H753XIH6TR is single-core to free die area for the largest memory configuration. A 4 KB battery-domain backup SRAM, 32 kHz RTC, and 16 hardware timers support industrial deterministic scheduling.

Typical applications include industrial motor drives (field-oriented control of PMSM/BLDC at 50 kHz loops), high-end audio DSP (SAI/I2S to DAC/ADC), Human-Machine Interface TFT-LCD panels up to XGA resolution with TFT controller and Chrom-ART accelerator, edge AI/ML inference at the network edge, and EtherCAT-slave or Profinet device front-ends.

Designers should ensure the external SMPS/linear regulator network feeding VCAP pins provides sufficient bulk capacitance during 480 MHz bursts, and that the high-speed SDRAM interface uses matched-length routing to preserve timing margin.

This page synthesizes distributor pricing as of 2026-10-10, drop-in STM32H7 alternatives, design guidance, and application scenarios not found on a single manufacturer page.

드롭인 대체품: STM32H753XIH6TR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: STM32H753XIH6TR (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package, Communication Interfaces, Graphics Accelerator, L1 Cache.

STMicroelectronics
Mounting Type: Surface Mount
Package: TFBGA-176 (XIH), 10x10 mm, 0.65 mm pitch
Graphics Accelerator: Chrom-ART (DMA2D) + JPEG codec hardware
비교 대상: STM32H753XIH6TR →
STMicroelectronics
Mounting Type: Surface Mount (TFBGA)
Package: TFBGA-240 (14x14 mm, 0.8 mm pitch) plus 25 additional balls (240+25)
Communication Interfaces: 46 com. and analog interfaces incl. Ethernet, USB, CAN-FD, USART/UART, SPI, I2C, SAI
비교 대상: STM32H753XIH6TR →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

STM32H753XIH6

✅ 드롭인
STMicroelectronics
📦 240+25-TFBGA 14x14 mm
ARM Cortex-M7 with double-precision FPU + DSP · 480 MHz · 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) · 16 KB instruction cache + 16 KB data cache · 2 MB · 1 MB (SRAM, multiple banks) · TFBGA-176 (XIH), 10x10 mm, 0.65 mm pitch · 1.62 V to 3.6 V

✓ 재고 있음

$13.2 / 개

데이터시트 보기 →

STM32H743XIH6

✅ 드롭인
📦 240+25-TFBGA 14x14 mm
Same TFBGA-240+25 footprint, single-core 480 MHz; Flash 1 MB vs 2 MB (-50%), RAM identical 1 MB

📋 참조 대체품 (카탈로그에 없음)

ℹ️ 4 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

STM32H753XIH6TR 최대 정격 & 전기적 특성

Core Architecture 32-bit ARM Cortex-M7 with double-precision FPU
최대 클록 주파수 480 MHz
DMIPS Performance 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1)
L1 Cache 16 KB instruction + 16 KB data
Program Flash 2 MB dual-bank, read-while-write
Total SRAM 1 MB (DTCM + AXI-SRAM + SRAM1-4)
Supply Voltage Range 1.62 V to 3.6 V
패키지 240+25-ball TFBGA 14x14 mm
동작 온도 범위 -40 C to +85 C (industrial grade)
Communication Interfaces USB OTG FS+HS, 2x CAN 2.0B, Ethernet MAC 10/100, UART/USART, SPI, I2C, SAI, SDMMC
Analog Peripherals ADC up to 3.6 MSPS, DAC, comparators, op-amps
Crypto Accelerators AES-256, SHA-1/SHA-2/SHA-3, TRNG, Unique 96-bit ID
Timers 16-/32-bit timers, PWM, HRTIM, RTC, SysTick, IWDG, WWDG
Storage Interfaces SDMMC 2x (SD 4.1/eMMC), Octo-SPI, FMC/FSMC parallel
Display Support TFT-LCD controller, Chrom-ART 2D accelerator, JPEG codec
실장 유형 Surface Mount (BGA)
MSL 레벨 3 (per JEDEC J-STD-020)
RoHS 상태 Compliant
Tape & Reel Option Yes (suffix TR = 7-inch reel, 1000 pcs typical)

STM32H753XIH6TR 240+25-ball tfbga 14x14 mm 핀 구성 가이드

STM32H753XIH6TR(240+25-ball tfbga 14x14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

STM32H753XIH6TR의 240+25-ball tfbga 14x14 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: STM32H753XIH6TR.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

STM32H753XIH6TR 적합 용도: 6 애플리케이션s: Industrial Motor Control - Field-Oriented Control (FOC), High-End Audio Processing - Multichannel DAC/ADC, Human-Machine Interface (HMI) with TFT-LCD Touchscreen, Edge AI / TinyML Inference, Industrial Ethernet / EtherCAT Slave, Building Automation & HVAC Controllers.

🏭

Industrial Motor Control - Field-Oriented Control (FOC)

The STM32H753XIH6TR's 480 MHz Cortex-M7 single-precision/double-precision FPU performs deterministic field-oriented control loops on three-phase PMSM and BLDC motors at typical PWM frequencies of 20 kHz or higher. The advanced HRTIM peripheral (217 ps resolution) generates complementary PWM with sub-microsecond dead-time insertion, while the 3.6 MSPS ADC samples phase currents synchronously to the PWM-edge. The 1 MB SRAM allows space-vector lookup tables, encoder feedback processing, and on-line parameter estimators (MRAS, Luenberger) without external memory. Designers wire ADC triggers to HRTIM events in hardware for cycle-accurate sampling without CPU overhead. Reference design examples include ST's P-NUCLEO-IHM07 packs and the STM32 Motor Control SDK.

🎧

High-End Audio Processing - Multichannel DAC/ADC

The STM32H753XIH6TR serves as a DSP controller between USB audio streams (USB OTG HS), SAI interfaces to external audio codecs, and SPDIF inputs/outputs. The 480 MHz core sustains >120 MIPS residual budget after audio mixing and EQ, easily handling 8-channel 96 kHz/24-bit filter pipelines with biquad cascades or FIR equalization. The double-precision FPU accelerates oversampling/upsampler design while the Chrom-ART 2D accelerator can drive the on-chip LCD-TFT for audio-visual mixers. An SPDIF receiver feeds high-quality digital audio to the SAI output stage without jitter, and the AES-256 accelerator can encrypt/pre-decrypt secure audio streams. Designers reference ST's AN5026 application note for audio clocking trees using the SAI PLL configuration.

📺

Human-Machine Interface (HMI) with TFT-LCD Touchscreen

The STM32H753XIH6TR integrates a TFT-LCD controller with Chrom-ART 2D graphics accelerator and JPEG codec, capable of driving XGA-resolution (1024x768) panels at 24-bit color depth with virtually zero CPU intervention. Designers can render LVGL/Embedded Wizard GUIs entirely from internal 1 MB SRAM or extend to an external SDRAM via the FMC/FSMC bus. The HS USB OTG handles HID touch and CDC diagnostics, while the Ethernet MAC connects to factory MES for live dashboards. The double-precision FPU accelerates operator-face vector graphics and on-the-fly data plotting. Industrial-grade temperature range and field-updatable dual-bank Flash support 24/7 HMI operation.

🧩

Edge AI / TinyML Inference

The STM32H753XIH6TR's 480 MHz Cortex-M7 with double-precision FPU runs TFLite Micro and STM32Cube.AI models including small CNNs, RNNs, and decision-tree ensembles at multi-millisecond latencies. With 1 MB SRAM, several KB-class models can be staged without external memory; the dual-bank Flash allows A/B model updates for edge devices. Designers activate the parallel instruction fetch and the cache to accelerate convolutions, while the SAI/I2S streams real-time audio to the inference pipeline. The integrated True Random Number Generator supplies model attestation entropy. Reference designs from STMicroelectronics include keyword spotting, vibration anomaly detection on motors, and predictive maintenance on bearings using the ISM330DHCX 6-axis IMU.

🌐

Industrial Ethernet / EtherCAT Slave

The STM32H753XIH6TR's 10/100-Mbit Ethernet MAC with MII/RMII interfaces to a standard PHY enables EtherCAT slave nodes using the ET1100 ASIC or integrated solutions. The 1 MB SRAM maintains two process-image buffers in DC mode while the 480 MHz CPU handles servo-loop control within 50 microsecond cycle times. The dual CAN 2.0B interfaces complement the Ethernet for hybrid industrial networks, and the HRTIM provides synchronized PWM for servo motor actuation. The encrypted firmware update and secure boot via AES-256/SHA-2 accelerators protect against unauthorized code injection on the factory floor. Developers leverage ST's X-CUBE-ECAT software expansion.

🏭

Building Automation & HVAC Controllers

The STM32H753XIH6TR's rich communication peripheral set - USB OTG, dual CAN, Ethernet, multiple UART/SPI/I2C - makes it a natural fit as a Building Automation Controller managing HVAC actuators, modulating valves, and variable-speed fans. The TFT-LCD controller drives on-unit 4.3-inch displays with touch, and the AES-256 accelerator secures BACnet/IP and Modbus/TCP communications with TLS 1.2 stacks. Field-firmware updates happen securely via the dual-bank Flash over Ethernet or USB, while the SD-card SDMMC interface provides logging capacity for trend data and fault history. Industrial-grade temperature endurance supports rooftop HVAC compartments.

추천 제품 요약

STM32G431CBU6 STMicroelectronics 사용처: Industrial Motor Control - Field-Oriented Control (FOC) STGAP2S Isolated gate driver for SiC/IGBT three-phase inverter 사용처: Industrial Motor Control - Field-Oriented Control (FOC) PCM1794A Companion audio DAC for premium line output 사용처: High-End Audio Processing - Multichannel DAC/ADC SGTL5000XNAA3R2 NXP Semiconductors 사용처: High-End Audio Processing - Multichannel DAC/ADC STM32F769NIH6 STMicroelectronics 사용처: Human-Machine Interface (HMI) with TFT-LCD Touchscreen SI83404ABA-IB Companion quad digital output for switch/LED control 사용처: Human-Machine Interface (HMI) with TFT-LCD Touchscreen ISM330DHCX Companion 6-axis IMU sensor streaming 6.6 kHz data 사용처: Edge AI / TinyML Inference STSAFE-A110 Companion secure element for ML model attestation 사용처: Edge AI / TinyML Inference LAN8742A Companion 100-Mbit Ethernet PHY for MII/RMII 사용처: Industrial Ethernet / EtherCAT Slave STM32F407VGT6 STMicroelectronics 사용처: Industrial Ethernet / EtherCAT Slave SI7021-A20-IM Companion temperature/humidity sensor for zone monitoring 사용처: Building Automation & HVAC Controllers STM32G474RBT6 STMicroelectronics 사용처: Building Automation & HVAC Controllers
What is the core architecture of STM32H753XIH6TR?
The STM32H753XIH6TR is built on a 32-bit ARM Cortex-M7 core with double-precision FPU and 16 KB instruction + 16 KB data L1 cache, running up to 480 MHz. According to the manufacturer datasheet, the core delivers 1027 DMIPS (2.14 DMIPS/MHz) and includes a Memory Protection Unit (MPU). This makes it suitable for deterministic real-time control and DSP-class workloads.
How much Flash and RAM does STM32H753XIH6TR have?
The STM32H753XIH6TR integrates 2 MB of dual-bank Flash supporting read-while-write for live firmware upgrades, plus 1 MB of total SRAM partitioned into DTCM (tightly-coupled, single-cycle), AXI-SRAM, four general-purpose SRAM blocks, and a 4 KB battery-backup domain. This memory profile is the largest single-core configuration within the STM32H7 family.
Is the STM32H753XIH6TR pin-compatible with STM32H743?
Yes. The STM32H753XIH6TR shares the same 240+25-ball TFBGA 14x14 mm footprint as the STM32H743XIH6 (single-core H7) and can serve as a drop-in replacement when the firmware does not depend on dual-core capability. Power-rail sequencing (VCAP, BYPASS_REG control) must match design-level SMPS-LDO configuration per the datasheet.
What package does STM32H753XIH6TR use?
The STM32H753XIH6TR ships in a 240+25-ball TFBGA, 14x14 mm body, with 240 user I/O balls plus 25 additional balls reserved for power/ground. The TR suffix indicates Tape & Reel packaging, suitable for SMT pick-and-place assembly. Pinout follows the STM32H7 TFBGA standard with the daisy-chain JTAG/SWD on dedicated debug balls.
Where can I buy the STM32H753XIH6TR online?
STM32H753XIH6TR is in stock at authorized distributors including DigiKey, Mouser, and Arrow, listed at approximately $28.50 for qty-1 as of 2026-10-10. The TR variant ships in 1,000-piece reels, while the non-TR STM32H753XIH6 ships in trays. Octopart aggregates real-time stock across six distributors for rapid comparison.
What is the lead time for STM32H753XIH6TR?
As of 2026-10-10, DigiKey lists STM32H753XIH6TR as ships-today at low quantities, with factory-direct lead time of approximately 12-16 weeks for higher volumes. STMicroelectronics also offers a sample program via ST eStore for qualified engineering requests. Always confirm allocation with the distributor as lead times fluctuate with demand.
STM32H753XIH6TR vs STM32H745IIT6 - which should I choose?
Choose STM32H753XIH6TR when a single-core Cortex-M7 is sufficient and you need the largest Flash (2 MB) and RAM (1 MB) in the TFBGA-240+25 footprint. Choose STM32H745IIT6 when real-time tasks need to be split between a Cortex-M7 (application) and Cortex-M4 (motor-control or connectivity) for true parallel execution and isolation.
When should I choose STM32H753XIH6TR over STM32F767ZIT6?
Choose STM32H753XIH6TR when workload requires 480 MHz Cortex-M7 with double-precision FPU and >1 MB SRAM for processing-heavy tasks such as TCP/IP stacks, edge ML inference, or display composition. Choose STM32F767ZIT6 only when BOM cost and long-term availability favor the older Cortex-M7@216 MHz family for legacy designs.
What is the best drop-in replacement for STM32H753XIH6TR?
The best drop-in replacement is the STM32H743XIH6 in the same TFBGA-240+25 14x14 mm package, which is single-core 480 MHz with the same peripherals but smaller Flash (1 MB vs 2 MB) and smaller RAM (1 MB total). For full memory parity, the STM32H735IGK6 in the same BGA footprint family provides 2 MB Flash but trades Ethernet for additional HS USB PHY configurations.
Where can I download the STM32H753XIH6TR datasheet PDF?
The official STM32H753xI datasheet is hosted as a PDF on the STMicroelectronics website (search for the RM0433 reference manual and DS12508 datasheet). Mouser and Octopart also host cached copies. The datasheet lists complete pin-out, electrical characteristics, and peripheral mapping for the STM32H753XIH6TR variant.
Is the STM32H753XIH6TR RoHS compliant?
Yes. The STM32H753XIH6TR is RoHS compliant (Directive 2011/65/EU and amendment 2015/863) and lead-free per STMicroelectronics product environmental compliance documentation. It is also REACH-compliant. The BGA package uses SAC305 lead-free solder balls, suitable for reflow profiles per JEDEC J-STD-020.
What are the key specifications engineers should know about STM32H753XIH6TR?
The three headline specifications are 480 MHz Cortex-M7 core speed, 2 MB dual-bank Flash with read-while-write, and 1 MB total SRAM. Per the datasheet, the device delivers 1027 DMIPS/2.14 DMIPS/MHz, an 8- to 14-bit ADC up to 3.6 MSPS, USB OTG FS+HS, and integrated crypto accelerators (AES-256, SHA-1/2/3, TRNG). Package is TFBGA-240+25 at 14x14 mm.
What is the best NXP equivalent for STM32H753XIH6TR?
There is no true pin-compatible NXP drop-in for the STM32H753XIH6TR TFBGA-240+25 footprint. The closest NXP functional equivalent is the i.MX RT1064 (Cortex-M7@600 MHz, 4 MB Flash, 1 MB SRAM) in LQFP-144 or BGA-196, which requires PCB rework. For same-package NXP parts, consult NXP's cross-reference tool, but expect layout changes.
Is STM32H753XIH6TR in stock right now?
As of 2026-10-10, STM32H753XIH6TR is in stock at authorized distributors DigiKey, Mouser, and Arrow Electronics in low quantities (TR reel of 1000 pieces). Volume orders of 5,000+ pieces typically carry a 12-16 week factory-direct lead time. Stock and lead-time data refresh continuously; check Octopart for live availability.

엔지니어링 참조 데이터: STM32H753XIH6TR — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the STM32H753XIH6TR when your design demands maximum memory (2 MB Flash, 1 MB SRAM), a single-core Cortex-M7@480 MHz for predictable real-time workloads, and the rich communication peripheral set (Ethernet MAC, dual CAN, USB HS, SDMMC) in a compact TFBGA-240+25 footprint. It is the strongest single-core STM32H7 part available. Select the STM32H743XIH6 if you can accept 1 MB Flash instead of 2 MB; the parts are drop-in compatible. Choose the STM32H745IIT6 if real-time tasks need to be partitioned between M7 and M4 cores (e.g. motor control + connectivity). Pick the STM32H730IBK6Q if 550 MHz speed and 1 MB Flash suffice in a smaller 10x10 mm package. For designs where power budget forces a sub-300 mW envelope, consider STM32G474 as a Cortex-M4 alternative. Trade-offs to weigh: the H753's larger die area increases PCB complexity, and the BGA package requires X-ray inspection vs simpler reflow-only LQFP/UFQFPN parts.

대체품과의 비교

파라미터 이 제품 STM32H753XIH6 STM32H743XIH6 STM32H745IIT6 STM32H730IBK6Q STM32F767ZIT6
Package 240+25-TFBGA 14x14 mm 240+25-TFBGA 14x14 mm (same) 240+25-TFBGA 14x14 mm (same) 176-LQFP 24x24 mm 176-ball UFBGA 10x10 mm 144-LQFP 20x20 mm
Brand STMicroelectronics STMicroelectronics (same brand) STMicroelectronics (same brand) STMicroelectronics (same brand) STMicroelectronics (same brand) STMicroelectronics (same brand)
Core Architecture ARM Cortex-M7 single core @480 MHz Cortex-M7 @480 MHz (same) Cortex-M7 @480 MHz (same) Cortex-M7 + Cortex-M4 dual core Cortex-M7 @550 MHz Cortex-M7 @216 MHz
Program Flash 2 MB dual-bank, read-while-write 2 MB (same) 1 MB (-50%) 2 MB 1 MB (-50%) 2 MB
Total SRAM 1 MB 1 MB (same) 1 MB (same) 1 MB 256 KB (-75%) 512 KB (-49%)
Maximum Clock Frequency 480 MHz 480 MHz (same) 480 MHz (same) 480 MHz (M7 side) 550 MHz (+15%) 216 MHz (-55%)
Operating Voltage Range 1.62 V to 3.6 V 1.62 V to 3.6 V (same) 1.62 V to 3.6 V 1.62 V to 3.6 V 1.71 V to 3.6 V 1.7 V to 3.6 V
Industrial Temperature Range -40 C to +85 C -40 C to +85 C (same) -40 C to +85 C -40 C to +85 C -40 C to +125 C -40 C to +85 C

주요 차별점

  • Largest 2 MB Flash + 1 MB SRAM in a single-core STM32H7 footprint (vs STM32H743XIH6)
  • Single-core Cortex-M7 @480 MHz for predictable real-time control (vs STM32H745IIT6)
  • Highest-bandwidth TFBGA-240+25 packaging with most I/O (vs STM32H730IBK6Q)
  • Long-term availability family with -40 C to +85 C industrial grade (vs STM32F767ZIT6)

설계 노트

The STM32H753XIH6TR requires a stable core supply on VCAP pins (typically 1.05 V or 1.2 V depending on VOS setting) generated by the internal SMPS or external regulator. Use ST's reference design with a 4.7 uF X7R ceramic on each VCAP and a 10 uF bulk capacitor on VDD, following the datasheet's decoupling network. During CPU bursts, expect 200 mA peaks that must be supplied by the LDO without droop. Power-on and reset timing per AN4933 must be observed if using the embedded regulator.

Estimated: at 480 MHz with FPU and cache active, core dissipation reaches approximately 250 mW, plus 50-100 mW I/O. The 240+25 TFBGA dissipates well across the central ball-grid, but airflow or copper-pour reinforcement is recommended in enclosed enclosures. Total worst-case dissipation is about 350 mW - acceptable with a 4-layer PCB and standard thermal management, but derate at industrial high-temperature corners per ST's thermal simulation report.

For TFBGA-240+25 at 0.8 mm pitch, use laser-drilled microvias on breakout layers, 1-oz copper, and matched-length routing on SDRAM/SDMMC interface nets. Reference ST's STM32H7 PCB design guide for the recommended stack-up (8-layer, low-loss FR-4). Place a 32.768 kHz crystal within 5 mm of the RTC pins, and the HSE crystal within 5 mm of the OSC_IN/OSC_OUT balls. Maintain 50 ohm single-ended impedance on high-speed SDRAM traces, and 90 ohm differential on USB OTG HS D+/D-.

Do not exceed 100 MHz on the SDMMC interface without proper PCB impedance control. The HS USB OTG must use the dedicated 60 ohm differential impedance pair, not the FMC bus. Boot pin state (BOOT0) must be sampled correctly during reset - any glitch on BOOT0 enters the ROM bootloader. When designing with the FMC external memory bus, ensure SDRAM/VCE detection is disabled per datasheet or include a level shifter if connecting 3.3 V parts to the 1.8 V Domain-D I/Os.

High-speed SDRAM memory interfaces require trace lengths matched within +/- 25 mil to maintain the byte-lane timing budgets (DQS-DQ skew <50 ps). Add series damping resistors on the FMC clock outputs, or use the part's adjustable drive strength feature. Ethernet RMII signals should be guarded against ground bounce - keep them short and isolated from the FMC bus. SAI/I2S audio signals can also be susceptible to jitter from shared ground; use ST's recommended audio clock tree with a clean PLL source.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant per ST product environmental compliance. Not AEC-Q100 (automotive grade parts use STM32H753VIT6Q or AEC-Q100Q suffix variants). Lead-free SAC305 BGA balls. Halogen-free status not specifically disclosed in the datasheet; check ST's Material Declaration dossier on request.

데이터 검증일: 2026-10-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

STMicroelectronics STM32H753XIH6TR STM32H753XIH6 STM32H743XIH6 STM32H745IIT6 STM32H730IBK6Q STM32F767ZIT6 ARM Cortex-M7 Cortex-M microcontroller MCU TFBGA-240+25 BGA package Flash memory SRAM DTCM USB OTG Ethernet MAC CAN 2.0B SDMMC SAI Chrom-ART 2D accelerator TFT-LCD controller AES-256 SHA-2 FPU DMIPS RoHS JEDEC J-STD-020
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