STM32H753XIH6TR - 480MHz Cortex-M7 MCU 2MB Flash | STMicroelectronics
MPN: STM32H753XIH6TR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.45 | $9,725.00 |
| 1,000 | $17.8 | $17,800.00 |
| 2,500 | $16.1 | $40,250.00 |
STM32H753XIH6TR Overview
What is a Cortex-M7 MCU? An ARM Cortex-M7 microcontroller is the highest-performance core in the Cortex-M family, targeting applications that previously required a Cortex-M4 or even a Cortex-A application processor. It combines an in-order superscalar pipeline with single- and double-precision floating-point, tightly-coupled memory, and an instruction/data cache. Hierarchy: Cortex-M7 -> Cortex-M -> 32-bit MCU -> microcontroller -> embedded computing. The STM32H7 family extends this with ST's smart peripheral architecture for motor control and high-speed data acquisition.
Key features include 480 MHz core speed, 2 MB dual-bank Flash with read-while-write support for live firmware updates, 1 MB SRAM split into DTCM, AXI-SRAM, SRAM1-4, and Backup domains, an 8- to 14-bit ADC up to 3.6 MSPS, USB 2.0 OTG full-speed/high-speed, two CAN 2.0B interfaces, an Ethernet MAC with 10/100-Mbit/s MII/RMII, two SAIs for audio, an SDMMC interface for SD-cards, and integrated crypto/hash accelerators (AES-256, SHA-1/SHA-2, True Random Number Generator). The TFBGA-240+25 provides 168+ flexible I/O pins configurable as GPIO, communication, analog, or timer channels.
The architecture pairs a Cortex-M7 with an optional Cortex-M4 in dual-core STM32H745/H755 parts, but the STM32H753XIH6TR is single-core to free die area for the largest memory configuration. A 4 KB battery-domain backup SRAM, 32 kHz RTC, and 16 hardware timers support industrial deterministic scheduling.
Typical applications include industrial motor drives (field-oriented control of PMSM/BLDC at 50 kHz loops), high-end audio DSP (SAI/I2S to DAC/ADC), Human-Machine Interface TFT-LCD panels up to XGA resolution with TFT controller and Chrom-ART accelerator, edge AI/ML inference at the network edge, and EtherCAT-slave or Profinet device front-ends.
Designers should ensure the external SMPS/linear regulator network feeding VCAP pins provides sufficient bulk capacitance during 480 MHz bursts, and that the high-speed SDRAM interface uses matched-length routing to preserve timing margin.
This page synthesizes distributor pricing as of 2026-10-10, drop-in STM32H7 alternatives, design guidance, and application scenarios not found on a single manufacturer page.
Drop-in alternatives for STM32H753XIH6TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32H753XIH6TR (same form factor and footprint) — differing in Mounting Type, Package, Communication Interfaces, Graphics Accelerator, L1 Cache.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32H753XIH6
✅ Drop-In✓ In Stock
$13.2 / Unit
View Datasheet →STM32H743XIH6
✅ Drop-In📋 Reference alternative (not in catalog)
STM32H753XIH6TR Maximum Ratings & Electrical Characteristics
| Core Architecture | 32-bit ARM Cortex-M7 with double-precision FPU |
| Maximum Clock Frequency | 480 MHz |
| DMIPS Performance | 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) |
| L1 Cache | 16 KB instruction + 16 KB data |
| Program Flash | 2 MB dual-bank, read-while-write |
| Total SRAM | 1 MB (DTCM + AXI-SRAM + SRAM1-4) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Package | 240+25-ball TFBGA 14x14 mm |
| Operating Temperature Range | -40 C to +85 C (industrial grade) |
| Communication Interfaces | USB OTG FS+HS, 2x CAN 2.0B, Ethernet MAC 10/100, UART/USART, SPI, I2C, SAI, SDMMC |
| Analog Peripherals | ADC up to 3.6 MSPS, DAC, comparators, op-amps |
| Crypto Accelerators | AES-256, SHA-1/SHA-2/SHA-3, TRNG, Unique 96-bit ID |
| Timers | 16-/32-bit timers, PWM, HRTIM, RTC, SysTick, IWDG, WWDG |
| Storage Interfaces | SDMMC 2x (SD 4.1/eMMC), Octo-SPI, FMC/FSMC parallel |
| Display Support | TFT-LCD controller, Chrom-ART 2D accelerator, JPEG codec |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Tape & Reel Option | Yes (suffix TR = 7-inch reel, 1000 pcs typical) |
STM32H753XIH6TR 240+25-ball tfbga 14x14 mm Pin Configuration Guide
Pin configuration for STM32H753XIH6TR (240+25-ball tfbga 14x14 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for STM32H753XIH6TR.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32H753XIH6TR is suitable for 6 applications: Industrial Motor Control - Field-Oriented Control (FOC), High-End Audio Processing - Multichannel DAC/ADC, Human-Machine Interface (HMI) with TFT-LCD Touchscreen, Edge AI / TinyML Inference, Industrial Ethernet / EtherCAT Slave, Building Automation & HVAC Controllers.
Industrial Motor Control - Field-Oriented Control (FOC)
The STM32H753XIH6TR's 480 MHz Cortex-M7 single-precision/double-precision FPU performs deterministic field-oriented control loops on three-phase PMSM and BLDC motors at typical PWM frequencies of 20 kHz or higher. The advanced HRTIM peripheral (217 ps resolution) generates complementary PWM with sub-microsecond dead-time insertion, while the 3.6 MSPS ADC samples phase currents synchronously to the PWM-edge. The 1 MB SRAM allows space-vector lookup tables, encoder feedback processing, and on-line parameter estimators (MRAS, Luenberger) without external memory. Designers wire ADC triggers to HRTIM events in hardware for cycle-accurate sampling without CPU overhead. Reference design examples include ST's P-NUCLEO-IHM07 packs and the STM32 Motor Control SDK.
Recommended
High-End Audio Processing - Multichannel DAC/ADC
The STM32H753XIH6TR serves as a DSP controller between USB audio streams (USB OTG HS), SAI interfaces to external audio codecs, and SPDIF inputs/outputs. The 480 MHz core sustains >120 MIPS residual budget after audio mixing and EQ, easily handling 8-channel 96 kHz/24-bit filter pipelines with biquad cascades or FIR equalization. The double-precision FPU accelerates oversampling/upsampler design while the Chrom-ART 2D accelerator can drive the on-chip LCD-TFT for audio-visual mixers. An SPDIF receiver feeds high-quality digital audio to the SAI output stage without jitter, and the AES-256 accelerator can encrypt/pre-decrypt secure audio streams. Designers reference ST's AN5026 application note for audio clocking trees using the SAI PLL configuration.
Recommended
Human-Machine Interface (HMI) with TFT-LCD Touchscreen
The STM32H753XIH6TR integrates a TFT-LCD controller with Chrom-ART 2D graphics accelerator and JPEG codec, capable of driving XGA-resolution (1024x768) panels at 24-bit color depth with virtually zero CPU intervention. Designers can render LVGL/Embedded Wizard GUIs entirely from internal 1 MB SRAM or extend to an external SDRAM via the FMC/FSMC bus. The HS USB OTG handles HID touch and CDC diagnostics, while the Ethernet MAC connects to factory MES for live dashboards. The double-precision FPU accelerates operator-face vector graphics and on-the-fly data plotting. Industrial-grade temperature range and field-updatable dual-bank Flash support 24/7 HMI operation.
Recommended
Edge AI / TinyML Inference
The STM32H753XIH6TR's 480 MHz Cortex-M7 with double-precision FPU runs TFLite Micro and STM32Cube.AI models including small CNNs, RNNs, and decision-tree ensembles at multi-millisecond latencies. With 1 MB SRAM, several KB-class models can be staged without external memory; the dual-bank Flash allows A/B model updates for edge devices. Designers activate the parallel instruction fetch and the cache to accelerate convolutions, while the SAI/I2S streams real-time audio to the inference pipeline. The integrated True Random Number Generator supplies model attestation entropy. Reference designs from STMicroelectronics include keyword spotting, vibration anomaly detection on motors, and predictive maintenance on bearings using the ISM330DHCX 6-axis IMU.
Recommended
Industrial Ethernet / EtherCAT Slave
The STM32H753XIH6TR's 10/100-Mbit Ethernet MAC with MII/RMII interfaces to a standard PHY enables EtherCAT slave nodes using the ET1100 ASIC or integrated solutions. The 1 MB SRAM maintains two process-image buffers in DC mode while the 480 MHz CPU handles servo-loop control within 50 microsecond cycle times. The dual CAN 2.0B interfaces complement the Ethernet for hybrid industrial networks, and the HRTIM provides synchronized PWM for servo motor actuation. The encrypted firmware update and secure boot via AES-256/SHA-2 accelerators protect against unauthorized code injection on the factory floor. Developers leverage ST's X-CUBE-ECAT software expansion.
Recommended
Building Automation & HVAC Controllers
The STM32H753XIH6TR's rich communication peripheral set - USB OTG, dual CAN, Ethernet, multiple UART/SPI/I2C - makes it a natural fit as a Building Automation Controller managing HVAC actuators, modulating valves, and variable-speed fans. The TFT-LCD controller drives on-unit 4.3-inch displays with touch, and the AES-256 accelerator secures BACnet/IP and Modbus/TCP communications with TLS 1.2 stacks. Field-firmware updates happen securely via the dual-bank Flash over Ethernet or USB, while the SD-card SDMMC interface provides logging capacity for trend data and fault history. Industrial-grade temperature endurance supports rooftop HVAC compartments.
Recommended
Recommended Products Summary
Engineering reference data for STM32H753XIH6TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32H753XIH6 | STM32H743XIH6 | STM32H745IIT6 | STM32H730IBK6Q | STM32F767ZIT6 |
|---|---|---|---|---|---|---|
| Package | 240+25-TFBGA 14x14 mm | 240+25-TFBGA 14x14 mm (same) | 240+25-TFBGA 14x14 mm (same) | 176-LQFP 24x24 mm | 176-ball UFBGA 10x10 mm | 144-LQFP 20x20 mm |
| Brand | STMicroelectronics | STMicroelectronics (same brand) | STMicroelectronics (same brand) | STMicroelectronics (same brand) | STMicroelectronics (same brand) | STMicroelectronics (same brand) |
| Core Architecture | ARM Cortex-M7 single core @480 MHz | Cortex-M7 @480 MHz (same) | Cortex-M7 @480 MHz (same) | Cortex-M7 + Cortex-M4 dual core | Cortex-M7 @550 MHz | Cortex-M7 @216 MHz |
| Program Flash | 2 MB dual-bank, read-while-write | 2 MB (same) | 1 MB (-50%) | 2 MB | 1 MB (-50%) | 2 MB |
| Total SRAM | 1 MB | 1 MB (same) | 1 MB (same) | 1 MB | 256 KB (-75%) | 512 KB (-49%) |
| Maximum Clock Frequency | 480 MHz | 480 MHz (same) | 480 MHz (same) | 480 MHz (M7 side) | 550 MHz (+15%) | 216 MHz (-55%) |
| Operating Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V (same) | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.71 V to 3.6 V | 1.7 V to 3.6 V |
| Industrial Temperature Range | -40 C to +85 C | -40 C to +85 C (same) | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
Key Differentiators
- Largest 2 MB Flash + 1 MB SRAM in a single-core STM32H7 footprint (vs STM32H743XIH6)
- Single-core Cortex-M7 @480 MHz for predictable real-time control (vs STM32H745IIT6)
- Highest-bandwidth TFBGA-240+25 packaging with most I/O (vs STM32H730IBK6Q)
- Long-term availability family with -40 C to +85 C industrial grade (vs STM32F767ZIT6)
Design Notes
The STM32H753XIH6TR requires a stable core supply on VCAP pins (typically 1.05 V or 1.2 V depending on VOS setting) generated by the internal SMPS or external regulator. Use ST's reference design with a 4.7 uF X7R ceramic on each VCAP and a 10 uF bulk capacitor on VDD, following the datasheet's decoupling network. During CPU bursts, expect 200 mA peaks that must be supplied by the LDO without droop. Power-on and reset timing per AN4933 must be observed if using the embedded regulator.
Estimated: at 480 MHz with FPU and cache active, core dissipation reaches approximately 250 mW, plus 50-100 mW I/O. The 240+25 TFBGA dissipates well across the central ball-grid, but airflow or copper-pour reinforcement is recommended in enclosed enclosures. Total worst-case dissipation is about 350 mW - acceptable with a 4-layer PCB and standard thermal management, but derate at industrial high-temperature corners per ST's thermal simulation report.
For TFBGA-240+25 at 0.8 mm pitch, use laser-drilled microvias on breakout layers, 1-oz copper, and matched-length routing on SDRAM/SDMMC interface nets. Reference ST's STM32H7 PCB design guide for the recommended stack-up (8-layer, low-loss FR-4). Place a 32.768 kHz crystal within 5 mm of the RTC pins, and the HSE crystal within 5 mm of the OSC_IN/OSC_OUT balls. Maintain 50 ohm single-ended impedance on high-speed SDRAM traces, and 90 ohm differential on USB OTG HS D+/D-.
Do not exceed 100 MHz on the SDMMC interface without proper PCB impedance control. The HS USB OTG must use the dedicated 60 ohm differential impedance pair, not the FMC bus. Boot pin state (BOOT0) must be sampled correctly during reset - any glitch on BOOT0 enters the ROM bootloader. When designing with the FMC external memory bus, ensure SDRAM/VCE detection is disabled per datasheet or include a level shifter if connecting 3.3 V parts to the 1.8 V Domain-D I/Os.
High-speed SDRAM memory interfaces require trace lengths matched within +/- 25 mil to maintain the byte-lane timing budgets (DQS-DQ skew <50 ps). Add series damping resistors on the FMC clock outputs, or use the part's adjustable drive strength feature. Ethernet RMII signals should be guarded against ground bounce - keep them short and isolated from the FMC bus. SAI/I2S audio signals can also be susceptible to jitter from shared ground; use ST's recommended audio clock tree with a clean PLL source.
Compliance Information
RoHS compliant per ST product environmental compliance. Not AEC-Q100 (automotive grade parts use STM32H753VIT6Q or AEC-Q100Q suffix variants). Lead-free SAC305 BGA balls. Halogen-free status not specifically disclosed in the datasheet; check ST's Material Declaration dossier on request.
