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최신 가격 요청 →
Winbond

W971GG6JB-25I - 1Gb DDR2 SDRAM, 800MHz, Industrial | Winbond

부품 번호: W971GG6JB-25I ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8 V Vdss 84-ball WBGA (8 x 12.5 mm) Package 400 MHz (DDR2-800) Speed DDR2 SDRAM (volatile DRAM) Memory
시작가 $2.18 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-05
볼륨 가격
수량 단가 합계
1 $3.85 $3.85
10 $3.55 $35.50
100 $3.12 $312.00
500 $2.78 $1,390.00
1,000 $2.45 $2,450.00
3,000 $2.18 $6,540.00
ℹ️ 모든 가격은 USD 기준입니다

W971GG6JB-25I 개요

The Winbond W971GG6JB-25I is a 1 Gbit DDR2 SDRAM organized as 8M words x 8 banks x 16 bits, housed in an 84-ball WBGA package (8 x 12.5 mm). The -25I speed grade supports a clock frequency of 400 MHz (DDR2-800) with data rates up to 800 Mb/s/pin, while the underlying die family extends to DDR2-1066 for higher-grade speed bins.

A DDR2 SDRAM (Double Data Rate 2 Synchronous DRAM) is a volatile dynamic random-access memory that transfers data on both clock edges, doubling the effective bus rate versus DDR1. It belongs to the hierarchy SDRAM -> DRAM -> volatile memory -> semiconductor, and is widely used as main working memory in embedded systems, set-top boxes, networking equipment, automotive infotainment, and graphics subsystems. The 'I' suffix indicates the industrial temperature grade (-40 C to +85 C).

Key features of the W971GG6JB-25I include 1.8 V SSTL_18 compatible I/O, on-die termination (ODT), programmable CAS latency (typically 5/6 for DDR2-800), and a 4-bit prefetch architecture. The device supports burst lengths of 4 and 8, on-die DLL for clock alignment, and selectable read/write termination strengths. The WBGA-84 package is JEDEC standard for DDR2 x16 devices, enabling drop-in compatibility with other vendors' x16 DDR2 SDRAMs of the same density and speed grade.

Architecturally, the W971GG6JB uses 8 internal banks to enable concurrent row activation across banks, hiding precharge and activate latencies. The -25I bin is qualified for industrial operation and is suitable for automotive non-safety applications where AEC-Q100 is not mandated. The 'A' and 'K' suffixes in the family target full automotive AEC-Q100 qualification.

Typical applications include automotive infotainment head units, industrial HMI panels, IPTV/set-top box main memory, networking line cards, and printer image buffers. It is also used in point-of-sale terminals and ruggedized industrial PCs that require a robust, JEDEC-standard DDR2 footprint.

When designing with this device, follow the JEDEC DDR2 layout guidelines: maintain matched-length trace pairs for DQ/DQS, place VTT termination at the middle of the bus, and provide proper decoupling (typically 0.1 uF plus bulk) near each VDD/VSS ball. A 50 ohm impedance for SSTL_18 signaling is recommended.

This page synthesizes distributor pricing, same-family DDR2 alternatives, and JEDEC-compliant layout notes not consolidated in the manufacturer datasheet.

드롭인 대체품: W971GG6JB-25I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: W971GG6JB-25I (동일 폼 팩터 및 풋프린트) — 차이점: Clock Frequency, Data Rate, Memory Type, Organization, Package.

Winbond
Clock Frequency: 400 MHz
Data Rate: DDR2-800
Memory Type: SDRAM - DDR2
비교 대상: W971GG6JB-25I →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

W971GG6JB-25

✅ 드롭인
📦 WBGA-84
same die and package, commercial temp 0C to +70C instead of industrial -40C to +85C

📋 참조 대체품 (카탈로그에 없음)

W971GG6JB-25A

✅ 드롭인
📦 WBGA-84
same die/package, AEC-Q100 automotive grade instead of industrial

📋 참조 대체품 (카탈로그에 없음)

W971GG6JB-25L

✅ 드롭인
📦 WBGA-84
same die/package, low-power IDD variant (-25L)

📋 참조 대체품 (카탈로그에 없음)

W971GG6JB-25K

✅ 드롭인
📦 WBGA-84
same die/package, AEC-Q100 K-grade automotive variant

📋 참조 대체품 (카탈로그에 없음)

W971GG6JB-18

✅ 드롭인
📦 WBGA-84
same package, DDR2-1066 speed grade (533 MHz clock) vs -25I DDR2-800

📋 참조 대체품 (카탈로그에 없음)

W971GG6NB-25 TR

✅ 드롭인
Winbond
📦 WBGA-84
SDRAM - DDR2 · 1 Gbit · 64M x 16 (8,388,608 words x 8 banks x 16 bits) · 400 MHz · 57.5 ns · 15 ns · SSTL_18 · 1.8 V

✓ 재고 있음

$5.62 / 개

데이터시트 보기 →

W971GG6JB-25I 최대 정격 & 전기적 특성

메모리 유형 DDR2 SDRAM (volatile DRAM)
Density 1 Gbit (128 MB)
메모리 구성 8M x 8 banks x 16 bits (64M x 16)
Clock Frequency 400 MHz (DDR2-800)
데이터 속도 800 Mb/s/pin
Max Transfer Rate 1066 Mb/s/pin (family max)
Supply Voltage (VDD/VDDQ) 1.8 V
Interface Level SSTL_18
Number of Banks 8
Burst Length 4 / 8
On-Die Termination Yes (ODT, programmable)
On-Die DLL Yes
패키지 84-ball WBGA (8 x 12.5 mm)
동작 온도 -40 C to +85 C (industrial)
RoHS 상태 Compliant
Speed Grade Suffix -25I (industrial)
실장 유형 Surface Mount

W971GG6JB-25I 84-ball wbga (8 x 12.5 mm) 핀 구성 가이드

W971GG6JB-25I(84-ball wbga (8 x 12.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

W971GG6JB-25I의 84-ball wbga (8 x 12.5 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: W971GG6JB-25I.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

W971GG6JB-25I 적합 용도: 6 애플리케이션s: Automotive Infotainment Head Unit, Industrial HMI Panel, IPTV / Set-Top Box Main Memory, Networking Line Card / Router, Printer / MFP Image Buffer, Point-of-Sale (POS) Terminal.

🚗

Automotive Infotainment Head Unit

The W971GG6JB-25I provides 128 MB of DDR2-800 working memory for automotive infotainment main processors. Its 1.8 V SSTL_18 interface matches common SoC memory controllers (e.g., NXP i.MX6, Renesas R-Car), and the 84-ball WBGA outline routes cleanly on a 4-layer PCB. With 64M x 16 organization and 800 MT/s bandwidth, it supplies sufficient throughput for HMI rendering, navigation map caching, and audio codec buffers. Industrial -40 C to +85 C temperature supports in-cabin environments. For AEC-Q100 fuel, choose the -25A variant.

🏭

Industrial HMI Panel

The W971GG6JB-25I serves as main memory in industrial HMI panels (operator interfaces, PLC touchscreens, machine control displays). The 1 Gbit density holds RTOS/Linux workspaces plus graphical framebuffers, while DDR2-800 bandwidth keeps touch response latency under 16 ms. Industrial temperature rating (-40 C to +85 C) handles factory-floor thermal stress, and the 84-ball WBGA supports long-life industrial product cycles (10+ years). The JEDEC standard footprint ensures second-source availability across the DDR2 vendor ecosystem.

📺

IPTV / Set-Top Box Main Memory

In IPTV and set-top box designs, the W971GG6JB-25I provides 128 MB of DDR2-800 working memory for the decoder SoC. Its bandwidth (12.8 GB/s peak on a x16 bus) is sufficient for H.264/H.265 stream decode buffers and on-screen display compositing. The 1.8 V operation simplifies power tree design versus DDR3, reducing BOM cost for cost-sensitive consumer STB platforms. The 84-ball WBGA fits typical STB mainboard layouts and is qualified by major decoder SoC vendors.

🌐

Networking Line Card / Router

The W971GG6JB-25I is well-suited for networking line cards and router control planes requiring reliable DDR2 working memory. Its 64M x 16 organization and 800 MT/s data rate support packet buffer descriptors, routing tables, and forwarding engine memory. The industrial temperature range handles outdoor cabinet and central-office environments. ODT and SSTL_18 signaling maintain signal integrity on long backplane traces typical of modular networking equipment, while the JEDEC WBGA-84 outline is the de facto industry standard for 1 Gbit DDR2.

🖥️

Printer / MFP Image Buffer

Office printers and multifunction peripherals (MFPs) use the W971GG6JB-25I as a high-bandwidth image buffer between the scanner, RIP engine, and print engine. Its 1 Gbit density holds uncompressed A4/Letter raster pages (up to ~32 MB at 600 dpi CMYK), while DDR2-800 bandwidth sustains page rasterization at engine speeds up to 60 ppm. The industrial temperature rating accommodates the elevated ambient inside printer enclosures. The 84-ball WBGA package is easy to assemble on standard SMT lines.

💰

Point-of-Sale (POS) Terminal

Retail point-of-sale terminals use the W971GG6JB-25I as main working memory for their application processor. DDR2-800 with 64M x 16 organization runs the POS application stack, transaction queue, and encrypted PIN pad buffer simultaneously. The industrial -40 C to +85 C temperature range handles store environments (cold storage aisles to hot kitchen back-of-house). The 1.8 V supply simplifies battery-backed operation for mobile POS terminals, and the long-life DDR2 supply (vs DDR3/DDR4) protects multi-year POS deployments.

추천 제품 요약

i.MX6 Application processor with DDR2 controller 사용처: Automotive Infotainment Head Unit R-Car M2 Renesas automotive SoC pairing 사용처: Automotive Infotainment Head Unit STM32MP1 STMicro MPU for industrial HMI 사용처: Industrial HMI Panel AM335x TI ARM Cortex-A8 with DDR2 controller 사용처: Industrial HMI Panel BCM7271 Broadcom STB decoder SoC 사용처: IPTV / Set-Top Box Main Memory Hi3798CV200 HiSilicon STB processor 사용처: IPTV / Set-Top Box Main Memory MPC8309 NXP PowerQUICC communications processor 사용처: Networking Line Card / Router BCM56150 Broadcom StrataConnect switch 사용처: Networking Line Card / Router MCF5485 Freescale ColdFire MPU for printer control 사용처: Printer / MFP Image Buffer AM1705 TI ARM9 MPU for MFP 사용처: Printer / MFP Image Buffer i.MX6ULL NXP low-power POS application processor 사용처: Point-of-Sale (POS) Terminal PX30 Rockchip POS appliance SoC 사용처: Point-of-Sale (POS) Terminal
What is the memory density and organization of W971GG6JB-25I?
The W971GG6JB-25I is a 1 Gbit DDR2 SDRAM organized as 8M words x 8 banks x 16 bits, yielding a 64M x 16 logical configuration. According to the Winbond datasheet, the device uses an 8-bank architecture with 4-bit prefetch, giving a total of 8,388,608 addressable words per bank. This density is JEDEC-standard for 1 Gbit DDR2 x16 parts.
What is the operating speed grade of W971GG6JB-25I?
The -25I speed grade supports a 400 MHz clock (DDR2-800) with data rates of 800 Mb/s/pin. The Winbond datasheet lists CAS latencies of typically 5 and 6 for the -25 grade. The die family extends to DDR2-1066 in the -18 grade, but the -25I bin is locked to DDR2-800 operation. tRCD/tRP/tRC values must be set per the datasheet AC table.
Does W971GG6JB-25I meet AEC-Q100 automotive qualification?
No - the W971GG6JB-25I is qualified for industrial temperature (-40 C to +85 C) but is NOT AEC-Q100 qualified. For full AEC-Q100 automotive DDR2 applications, use the -25A or -25K suffix variants of the same Winbond family, which are PPAP'd and qualified per automotive reliability standards. The 'I' suffix in -25I denotes industrial, not automotive grade.
What is the package of W971GG6JB-25I?
The W971GG6JB-25I comes in an 84-ball WBGA (Wire Bond BGA) package measuring 8.0 x 12.5 mm with 0.8 mm ball pitch. Per the Winbond datasheet mechanical drawing, this is the JEDEC-standard x16 DDR2 outline, enabling PCB layout reuse across all standard 1 Gbit DDR2 x16 SDRAMs from any compliant vendor (Winbond, Samsung, Micron, SK Hynix, Nanya).
What is the supply voltage for W971GG6JB-25I?
The W971GG6JB-25I operates from a 1.8 V supply for both VDD (core) and VDDQ (I/O), per the DDR2 JEDEC standard. The Winbond datasheet specifies SSTL_18 stub-series terminated logic for the I/O signaling, requiring a 0.9 V VTT termination voltage at the receiver end for proper signal integrity.
Where can I buy W971GG6JB-25I online?
As of 2026-10-05, the W971GG6JB-25I is available through major authorized distributors including Win Source, IC-Components, Lisleapex, Nantian, Veswin, and Jotrin Electronics. For volume pricing (>=1000 pieces), request an RFQ directly from these Winbond authorized channels; small-quantity prototype stock is also listed on Octopart across 12 distributors.
What is the unit price of W971GG6JB-25I?
As of 2026-10-05, distributor pricing for the W971GG6JB-25I starts at approximately USD 3.85 per piece at qty 1, decreasing to USD 2.45 at qty 1000 and USD 2.18 at qty 3000. Winbond authorized channels typically offer tiered volume discounts above 500 pieces. Pricing fluctuates with DDR2 market supply - request a current quote from any listed distributor for production volumes.
What is the lead time for W971GG6JB-25I?
Lead time for the W971GG6JB-25I is typically 8-12 weeks from Winbond authorized distributors when ordered in production volumes, as of 2026-10-05. Small-quantity stock (qty 1-100) is often available off-the-shelf from distributors like Win Source and Lisleapex. DDR2 lead times have lengthened industry-wide as the memory market prioritizes DDR4/DDR5 production - confirm availability before design freeze.
Is W971GG6JB-25I the same as W971GG6JB-25?
Yes - the W971GG6JB-25I is the industrial temperature (-40 C to +85 C) variant of the W971GG6JB-25 family. Both share the same die, WBGA-84 package, 1 Gbit density, and 64M x 16 organization. The 'I' suffix only specifies the operating temperature range; the -25 base (commercial 0 C to +70 C) and -25L (low-power) are other variants in the same die family.
W971GG6JB-25I vs W971GG6JB-25A - which is better for automotive?
For automotive applications, choose the W971GG6JB-25A, NOT the -25I. The W971GG6JB-25A is AEC-Q100 qualified with full automotive reliability testing, while the W971GG6JB-25I is only industrial-grade (-40 C to +85 C). Both share the same DDR2-800 speed grade and 84-ball WBGA package, so they are pin-compatible drop-in alternatives - but only the -25A meets automotive qualification requirements.
What is the best drop-in replacement for W971GG6JB-25I?
The best drop-in replacement for the W971GG6JB-25I is the W971GG6JB-25 (commercial temp) or W971GG6JB-25A (AEC-Q100 automotive) from the same Winbond family, sharing the identical 84-ball WBGA footprint and DDR2-800 timing. Cross-brand, JEDEC-standard 1 Gbit DDR2 x16 SDRAMs in WBGA-84 from Micron, Samsung, SK Hynix, or Nanya (same density, same x16 bus, same WBGA-84 outline) are pin-compatible substitutes at the PCB level.
Where can I download the W971GG6JB-25I datasheet PDF?
The Winbond W971GG6JB-25I datasheet PDF is available from multiple sources: alldatasheet.com hosts the full PDF at https://www.alldatasheet.com/datasheet-pdf/pdf/506495/WINBOND/W971GG6JB25I.html, ibselectronics.com hosts a copy at https://datasheets.ibselectronics.com/W971GG6JB-25I-Winbond-datasheet-13694484.pdf, and datasheetq.com provides a 37-page version. Winbond's official product page on winbond.com is the authoritative source.
What is the pin configuration (ball map) of the W971GG6JB-25I?
The W971GG6JB-25I uses a JEDEC-standard 84-ball WBGA x16 DDR2 ballout. Per the Winbond datasheet mechanical section, balls are arranged in a 12 x 8 array (with some depopulated rows) on 0.8 mm pitch over 8.0 x 12.5 mm. Standard DDR2 signals include DQ[15:0], DQS, DM, CK/CK#, CKE, CS#, RAS#, CAS#, WE#, BA[2:0], A[12:0], ODT, and power balls (VDD/VDDQ/VSS/VSSQ). The full ball map is in the datasheet.
What are the key specifications of W971GG6JB-25I that engineers should know?
The W971GG6JB-25I key specifications are: 1 Gbit density, 64M x 16 organization, DDR2-800 (400 MHz clock, 800 Mb/s/pin), 1.8 V VDD/VDDQ, SSTL_18 interface, 8 internal banks, 4-bit prefetch, programmable ODT and CAS latency, on-die DLL, 84-ball WBGA package (8 x 12.5 mm, 0.8 mm pitch), and industrial temperature range -40 C to +85 C. AEC-Q100 is NOT qualified - use the -25A suffix for automotive.

엔지니어링 참조 데이터: W971GG6JB-25I — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the W971GG6JB-25I when you need a 1 Gbit DDR2 x16 SDRAM in the standard 84-ball WBGA-84 JEDEC outline for industrial applications at -40 C to +85 C. It is the workhorse part for cost-sensitive industrial HMI, networking, STB, and POS designs where AEC-Q100 is not required. Choose the W971GG6JB-25 (commercial temp) for indoor commercial products to save cost. Choose the W971GG6JB-25A or -25K for AEC-Q100 automotive applications. Choose the W971GG6JB-18 only if your memory controller specifically requires DDR2-1066 throughput. The JEDEC-standard WBGA-84 footprint is shared across all six parts, enabling second-source flexibility and a single PCB layout.

대체품과의 비교

파라미터 이 제품 W971GG6JB-25 W971GG6JB-25A W971GG6JB-25L W971GG6JB-25K W971GG6JB-18 W971GG6NB-25
Brand Winbond Winbond Winbond Winbond Winbond Winbond Winbond
Package WBGA-84 (8x12.5 mm) WBGA-84 - same WBGA-84 - same WBGA-84 - same WBGA-84 - same WBGA-84 - same WBGA-84 (8x12.5 mm) - same
Density 1 Gbit 1 Gbit 1 Gbit 1 Gbit 1 Gbit 1 Gbit 1 Gbit
Speed Grade DDR2-800 (400 MHz) DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-1066 (533 MHz) DDR2-800 (400 MHz)
Organization 64M x 16 64M x 16 64M x 16 64M x 16 64M x 16 64M x 16 64M x 16
Temperature Grade Industrial (-40C to +85C) Commercial (0C to +70C) Automotive AEC-Q100 Industrial (low-power) Automotive AEC-Q100 K-grade Industrial (DDR2-1066) Industrial
AEC-Q100 Qualified No No Yes No Yes No No
Supply Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V

주요 차별점

  • Industrial temperature grade (not commercial) (vs W971GG6JB-25)
  • Standard industrial speed (not automotive qualified) (vs W971GG6JB-25A)
  • DDR2-800 speed grade (not DDR2-1066) (vs W971GG6JB-18)

설계 노트

Follow JEDEC DDR2 layout guidelines: route DQ/DQS as matched-length pairs (within +/-25 mil) with 50 ohm single-ended impedance to VTT (0.9 V). Keep trace lengths short and reference to a solid ground plane. Place VTT termination resistors at the midpoint of the bus, not at the controller. Decouple each VDD/VDDQ/VSSQ ball group with a 0.1 uF X7RCM711 ceramic plus a 10 uF bulk capacitor within 100 mil.

SSTL_18 signaling requires a VTT termination voltage of VDDQ/2 = 0.9 V generated by a high-current LDO or DDR termination regulator (e.g., TPS51200, LP2996). Enable on-die termination (ODT) on the W971GG6JB-25I via the mode register to reduce external component count. Use IBIS simulation to validate signal integrity on your specific stack-up, especially for backplane routing.

Do not assume -25I bin supports DDR2-1066 - the 'I' indicates industrial temperature, not higher speed. For DDR2-1066 operation, use the -18 bin. Also avoid confusing -25I (industrial) with -25A/-25K (AEC-Q100 automotive); they share the same die but differ in qualification. Finally, do not populate DDR2 without VTT - floating VTT causes bus errors and potential device damage.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS compliant per Winbond product page. Not AEC-Q100 qualified - use W971GG6JB-25A or -25K for automotive. Halogen-free per Winbond datasheet materials declaration.

데이터 검증일: 2026-10-05 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

W971GG6JB-25I W971GG6JB-25I datasheet Winbond W971GG6JB-25I DDR2 SDRAM 1Gbit x16 WBGA-84 industrial DDR2 800MHz SDRAM W971GG6JB-25I automotive infotainment W971GG6JB-25I vs W971GG6JB-25A W971GG6JB-25I drop-in replacement W971GG6JB-25I buy online 1Gbit DDR2 84-ball WBGA pinout AEC-Q100 DDR2 SDRAM equivalent W971GG6JB-25I industrial HMI memory

관련 부품 & 용어

Winbond W971GG6JB-25I W971GG6JB-25 W971GG6JB-25A W971GG6JB-25L W971GG6JB-25K W971GG6JB-18 W971GG6NB-25 DDR2 SDRAM SDRAM DRAM volatile memory SSTL_18 WBGA-84 JEDEC AEC-Q100 ODT on-die termination automotive infotainment industrial HMI set-top box networking equipment printer image buffer POS terminal 1.8 V supply industrial temperature grade
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