W971GG6JB-25I - 1Gb DDR2 SDRAM, 800MHz, Industrial | Winbond
N.º de pieza: W971GG6JB-25I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.55 | $35,50 |
| 100 | $3.12 | $312,00 |
| 500 | $2.78 | $1.390,00 |
| 1.000 | $2.45 | $2.450,00 |
| 3.000 | $2.18 | $6.540,00 |
W971GG6JB-25I Descripción general
A DDR2 SDRAM (Double Data Rate 2 Synchronous DRAM) is a volatile dynamic random-access memory that transfers data on both clock edges, doubling the effective bus rate versus DDR1. It belongs to the hierarchy SDRAM -> DRAM -> volatile memory -> semiconductor, and is widely used as main working memory in embedded systems, set-top boxes, networking equipment, automotive infotainment, and graphics subsystems. The 'I' suffix indicates the industrial temperature grade (-40 C to +85 C).
Key features of the W971GG6JB-25I include 1.8 V SSTL_18 compatible I/O, on-die termination (ODT), programmable CAS latency (typically 5/6 for DDR2-800), and a 4-bit prefetch architecture. The device supports burst lengths of 4 and 8, on-die DLL for clock alignment, and selectable read/write termination strengths. The WBGA-84 package is JEDEC standard for DDR2 x16 devices, enabling drop-in compatibility with other vendors' x16 DDR2 SDRAMs of the same density and speed grade.
Architecturally, the W971GG6JB uses 8 internal banks to enable concurrent row activation across banks, hiding precharge and activate latencies. The -25I bin is qualified for industrial operation and is suitable for automotive non-safety applications where AEC-Q100 is not mandated. The 'A' and 'K' suffixes in the family target full automotive AEC-Q100 qualification.
Typical applications include automotive infotainment head units, industrial HMI panels, IPTV/set-top box main memory, networking line cards, and printer image buffers. It is also used in point-of-sale terminals and ruggedized industrial PCs that require a robust, JEDEC-standard DDR2 footprint.
When designing with this device, follow the JEDEC DDR2 layout guidelines: maintain matched-length trace pairs for DQ/DQS, place VTT termination at the middle of the bus, and provide proper decoupling (typically 0.1 uF plus bulk) near each VDD/VSS ball. A 50 ohm impedance for SSTL_18 signaling is recommended.
This page synthesizes distributor pricing, same-family DDR2 alternatives, and JEDEC-compliant layout notes not consolidated in the manufacturer datasheet.
Alternativas directas para W971GG6JB-25I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con W971GG6JB-25I (mismo factor de forma y huella) — difiere en Clock Frequency, Data Rate, Memory Type, Organization, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
W971GG6JB-25
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W971GG6JB-25A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W971GG6JB-25L
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W971GG6JB-25K
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W971GG6JB-18
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W971GG6NB-25 TR
✅ Sustitución directa✓ En stock
$5.62 / unidad
Ver hoja de datos →W971GG6JB-25I Valores máximos y características eléctricas
| Tipo de memoria | DDR2 SDRAM (volatile DRAM) |
| Density | 1 Gbit (128 MB) |
| Organización de memoria | 8M x 8 banks x 16 bits (64M x 16) |
| Clock Frequency | 400 MHz (DDR2-800) |
| Velocidad de datos | 800 Mb/s/pin |
| Max Transfer Rate | 1066 Mb/s/pin (family max) |
| Supply Voltage (VDD/VDDQ) | 1.8 V |
| Interface Level | SSTL_18 |
| Number of Banks | 8 |
| Burst Length | 4 / 8 |
| On-Die Termination | Yes (ODT, programmable) |
| On-Die DLL | Yes |
| Encapsulado | 84-ball WBGA (8 x 12.5 mm) |
| Temperatura de funcionamiento | -40 C to +85 C (industrial) |
| Estado RoHS | Compliant |
| Speed Grade Suffix | -25I (industrial) |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de W971GG6JB-25I 84-ball wbga (8 x 12.5 mm)
Configuración de pines para W971GG6JB-25I (encapsulado 84-ball wbga (8 x 12.5 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para W971GG6JB-25I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
W971GG6JB-25I es adecuado para 6 aplicacións: Automotive Infotainment Head Unit, Industrial HMI Panel, IPTV / Set-Top Box Main Memory, Networking Line Card / Router, Printer / MFP Image Buffer, Point-of-Sale (POS) Terminal.
Automotive Infotainment Head Unit
The W971GG6JB-25I provides 128 MB of DDR2-800 working memory for automotive infotainment main processors. Its 1.8 V SSTL_18 interface matches common SoC memory controllers (e.g., NXP i.MX6, Renesas R-Car), and the 84-ball WBGA outline routes cleanly on a 4-layer PCB. With 64M x 16 organization and 800 MT/s bandwidth, it supplies sufficient throughput for HMI rendering, navigation map caching, and audio codec buffers. Industrial -40 C to +85 C temperature supports in-cabin environments. For AEC-Q100 fuel, choose the -25A variant.
Recomendado
Industrial HMI Panel
The W971GG6JB-25I serves as main memory in industrial HMI panels (operator interfaces, PLC touchscreens, machine control displays). The 1 Gbit density holds RTOS/Linux workspaces plus graphical framebuffers, while DDR2-800 bandwidth keeps touch response latency under 16 ms. Industrial temperature rating (-40 C to +85 C) handles factory-floor thermal stress, and the 84-ball WBGA supports long-life industrial product cycles (10+ years). The JEDEC standard footprint ensures second-source availability across the DDR2 vendor ecosystem.
Recomendado
IPTV / Set-Top Box Main Memory
In IPTV and set-top box designs, the W971GG6JB-25I provides 128 MB of DDR2-800 working memory for the decoder SoC. Its bandwidth (12.8 GB/s peak on a x16 bus) is sufficient for H.264/H.265 stream decode buffers and on-screen display compositing. The 1.8 V operation simplifies power tree design versus DDR3, reducing BOM cost for cost-sensitive consumer STB platforms. The 84-ball WBGA fits typical STB mainboard layouts and is qualified by major decoder SoC vendors.
Recomendado
Networking Line Card / Router
The W971GG6JB-25I is well-suited for networking line cards and router control planes requiring reliable DDR2 working memory. Its 64M x 16 organization and 800 MT/s data rate support packet buffer descriptors, routing tables, and forwarding engine memory. The industrial temperature range handles outdoor cabinet and central-office environments. ODT and SSTL_18 signaling maintain signal integrity on long backplane traces typical of modular networking equipment, while the JEDEC WBGA-84 outline is the de facto industry standard for 1 Gbit DDR2.
Recomendado
Printer / MFP Image Buffer
Office printers and multifunction peripherals (MFPs) use the W971GG6JB-25I as a high-bandwidth image buffer between the scanner, RIP engine, and print engine. Its 1 Gbit density holds uncompressed A4/Letter raster pages (up to ~32 MB at 600 dpi CMYK), while DDR2-800 bandwidth sustains page rasterization at engine speeds up to 60 ppm. The industrial temperature rating accommodates the elevated ambient inside printer enclosures. The 84-ball WBGA package is easy to assemble on standard SMT lines.
Recomendado
Point-of-Sale (POS) Terminal
Retail point-of-sale terminals use the W971GG6JB-25I as main working memory for their application processor. DDR2-800 with 64M x 16 organization runs the POS application stack, transaction queue, and encrypted PIN pad buffer simultaneously. The industrial -40 C to +85 C temperature range handles store environments (cold storage aisles to hot kitchen back-of-house). The 1.8 V supply simplifies battery-backed operation for mobile POS terminals, and the long-life DDR2 supply (vs DDR3/DDR4) protects multi-year POS deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para W971GG6JB-25I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | W971GG6JB-25 | W971GG6JB-25A | W971GG6JB-25L | W971GG6JB-25K | W971GG6JB-18 | W971GG6NB-25 |
|---|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Winbond | Winbond | Winbond | Winbond |
| Package | WBGA-84 (8x12.5 mm) | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 (8x12.5 mm) - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Speed Grade | DDR2-800 (400 MHz) | DDR2-800 | DDR2-800 | DDR2-800 | DDR2-800 | DDR2-1066 (533 MHz) | DDR2-800 (400 MHz) |
| Organization | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Automotive AEC-Q100 | Industrial (low-power) | Automotive AEC-Q100 K-grade | Industrial (DDR2-1066) | Industrial |
| AEC-Q100 Qualified | No | No | Yes | No | Yes | No | No |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Diferenciadores clave
- Industrial temperature grade (not commercial) (frente a W971GG6JB-25)
- Standard industrial speed (not automotive qualified) (frente a W971GG6JB-25A)
- DDR2-800 speed grade (not DDR2-1066) (frente a W971GG6JB-18)
Notas de diseño
Follow JEDEC DDR2 layout guidelines: route DQ/DQS as matched-length pairs (within +/-25 mil) with 50 ohm single-ended impedance to VTT (0.9 V). Keep trace lengths short and reference to a solid ground plane. Place VTT termination resistors at the midpoint of the bus, not at the controller. Decouple each VDD/VDDQ/VSSQ ball group with a 0.1 uF X7RCM711 ceramic plus a 10 uF bulk capacitor within 100 mil.
SSTL_18 signaling requires a VTT termination voltage of VDDQ/2 = 0.9 V generated by a high-current LDO or DDR termination regulator (e.g., TPS51200, LP2996). Enable on-die termination (ODT) on the W971GG6JB-25I via the mode register to reduce external component count. Use IBIS simulation to validate signal integrity on your specific stack-up, especially for backplane routing.
Do not assume -25I bin supports DDR2-1066 - the 'I' indicates industrial temperature, not higher speed. For DDR2-1066 operation, use the -18 bin. Also avoid confusing -25I (industrial) with -25A/-25K (AEC-Q100 automotive); they share the same die but differ in qualification. Finally, do not populate DDR2 without VTT - floating VTT causes bus errors and potential device damage.
Información de cumplimiento
RoHS compliant per Winbond product page. Not AEC-Q100 qualified - use W971GG6JB-25A or -25K for automotive. Halogen-free per Winbond datasheet materials declaration.
