W971GG6JB-25I - 1Gb DDR2 SDRAM, 800MHz, Industrial | Winbond
MPN: W971GG6JB-25I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.55 | $35.50 |
| 100 | $3.12 | $312.00 |
| 500 | $2.78 | $1,390.00 |
| 1,000 | $2.45 | $2,450.00 |
| 3,000 | $2.18 | $6,540.00 |
W971GG6JB-25I Overview
A DDR2 SDRAM (Double Data Rate 2 Synchronous DRAM) is a volatile dynamic random-access memory that transfers data on both clock edges, doubling the effective bus rate versus DDR1. It belongs to the hierarchy SDRAM -> DRAM -> volatile memory -> semiconductor, and is widely used as main working memory in embedded systems, set-top boxes, networking equipment, automotive infotainment, and graphics subsystems. The 'I' suffix indicates the industrial temperature grade (-40 C to +85 C).
Key features of the W971GG6JB-25I include 1.8 V SSTL_18 compatible I/O, on-die termination (ODT), programmable CAS latency (typically 5/6 for DDR2-800), and a 4-bit prefetch architecture. The device supports burst lengths of 4 and 8, on-die DLL for clock alignment, and selectable read/write termination strengths. The WBGA-84 package is JEDEC standard for DDR2 x16 devices, enabling drop-in compatibility with other vendors' x16 DDR2 SDRAMs of the same density and speed grade.
Architecturally, the W971GG6JB uses 8 internal banks to enable concurrent row activation across banks, hiding precharge and activate latencies. The -25I bin is qualified for industrial operation and is suitable for automotive non-safety applications where AEC-Q100 is not mandated. The 'A' and 'K' suffixes in the family target full automotive AEC-Q100 qualification.
Typical applications include automotive infotainment head units, industrial HMI panels, IPTV/set-top box main memory, networking line cards, and printer image buffers. It is also used in point-of-sale terminals and ruggedized industrial PCs that require a robust, JEDEC-standard DDR2 footprint.
When designing with this device, follow the JEDEC DDR2 layout guidelines: maintain matched-length trace pairs for DQ/DQS, place VTT termination at the middle of the bus, and provide proper decoupling (typically 0.1 uF plus bulk) near each VDD/VSS ball. A 50 ohm impedance for SSTL_18 signaling is recommended.
This page synthesizes distributor pricing, same-family DDR2 alternatives, and JEDEC-compliant layout notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for W971GG6JB-25I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with W971GG6JB-25I (same form factor and footprint) — differing in Clock Frequency, Data Rate, Memory Type, Organization, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W971GG6JB-25
✅ Drop-In📋 Reference alternative (not in catalog)
W971GG6JB-25A
✅ Drop-In📋 Reference alternative (not in catalog)
W971GG6JB-25L
✅ Drop-In📋 Reference alternative (not in catalog)
W971GG6JB-25K
✅ Drop-In📋 Reference alternative (not in catalog)
W971GG6JB-18
✅ Drop-In📋 Reference alternative (not in catalog)
W971GG6NB-25 TR
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →W971GG6JB-25I Maximum Ratings & Electrical Characteristics
| Memory Type | DDR2 SDRAM (volatile DRAM) |
| Density | 1 Gbit (128 MB) |
| Organization | 8M x 8 banks x 16 bits (64M x 16) |
| Clock Frequency | 400 MHz (DDR2-800) |
| Data Rate | 800 Mb/s/pin |
| Max Transfer Rate | 1066 Mb/s/pin (family max) |
| Supply Voltage (VDD/VDDQ) | 1.8 V |
| Interface Level | SSTL_18 |
| Number of Banks | 8 |
| Burst Length | 4 / 8 |
| On-Die Termination | Yes (ODT, programmable) |
| On-Die DLL | Yes |
| Package | 84-ball WBGA (8 x 12.5 mm) |
| Operating Temperature | -40 C to +85 C (industrial) |
| RoHS Status | Compliant |
| Speed Grade Suffix | -25I (industrial) |
| Mounting Type | Surface Mount |
W971GG6JB-25I 84-ball wbga (8 x 12.5 mm) Pin Configuration Guide
Pin configuration for W971GG6JB-25I (84-ball wbga (8 x 12.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for W971GG6JB-25I.
Refer to the datasheet for full pin configuration.
Typical Applications
W971GG6JB-25I is suitable for 6 applications: Automotive Infotainment Head Unit, Industrial HMI Panel, IPTV / Set-Top Box Main Memory, Networking Line Card / Router, Printer / MFP Image Buffer, Point-of-Sale (POS) Terminal.
Automotive Infotainment Head Unit
The W971GG6JB-25I provides 128 MB of DDR2-800 working memory for automotive infotainment main processors. Its 1.8 V SSTL_18 interface matches common SoC memory controllers (e.g., NXP i.MX6, Renesas R-Car), and the 84-ball WBGA outline routes cleanly on a 4-layer PCB. With 64M x 16 organization and 800 MT/s bandwidth, it supplies sufficient throughput for HMI rendering, navigation map caching, and audio codec buffers. Industrial -40 C to +85 C temperature supports in-cabin environments. For AEC-Q100 fuel, choose the -25A variant.
Recommended
Industrial HMI Panel
The W971GG6JB-25I serves as main memory in industrial HMI panels (operator interfaces, PLC touchscreens, machine control displays). The 1 Gbit density holds RTOS/Linux workspaces plus graphical framebuffers, while DDR2-800 bandwidth keeps touch response latency under 16 ms. Industrial temperature rating (-40 C to +85 C) handles factory-floor thermal stress, and the 84-ball WBGA supports long-life industrial product cycles (10+ years). The JEDEC standard footprint ensures second-source availability across the DDR2 vendor ecosystem.
Recommended
IPTV / Set-Top Box Main Memory
In IPTV and set-top box designs, the W971GG6JB-25I provides 128 MB of DDR2-800 working memory for the decoder SoC. Its bandwidth (12.8 GB/s peak on a x16 bus) is sufficient for H.264/H.265 stream decode buffers and on-screen display compositing. The 1.8 V operation simplifies power tree design versus DDR3, reducing BOM cost for cost-sensitive consumer STB platforms. The 84-ball WBGA fits typical STB mainboard layouts and is qualified by major decoder SoC vendors.
Recommended
Networking Line Card / Router
The W971GG6JB-25I is well-suited for networking line cards and router control planes requiring reliable DDR2 working memory. Its 64M x 16 organization and 800 MT/s data rate support packet buffer descriptors, routing tables, and forwarding engine memory. The industrial temperature range handles outdoor cabinet and central-office environments. ODT and SSTL_18 signaling maintain signal integrity on long backplane traces typical of modular networking equipment, while the JEDEC WBGA-84 outline is the de facto industry standard for 1 Gbit DDR2.
Recommended
Printer / MFP Image Buffer
Office printers and multifunction peripherals (MFPs) use the W971GG6JB-25I as a high-bandwidth image buffer between the scanner, RIP engine, and print engine. Its 1 Gbit density holds uncompressed A4/Letter raster pages (up to ~32 MB at 600 dpi CMYK), while DDR2-800 bandwidth sustains page rasterization at engine speeds up to 60 ppm. The industrial temperature rating accommodates the elevated ambient inside printer enclosures. The 84-ball WBGA package is easy to assemble on standard SMT lines.
Recommended
Point-of-Sale (POS) Terminal
Retail point-of-sale terminals use the W971GG6JB-25I as main working memory for their application processor. DDR2-800 with 64M x 16 organization runs the POS application stack, transaction queue, and encrypted PIN pad buffer simultaneously. The industrial -40 C to +85 C temperature range handles store environments (cold storage aisles to hot kitchen back-of-house). The 1.8 V supply simplifies battery-backed operation for mobile POS terminals, and the long-life DDR2 supply (vs DDR3/DDR4) protects multi-year POS deployments.
Recommended
Recommended Products Summary
Engineering reference data for W971GG6JB-25I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W971GG6JB-25 | W971GG6JB-25A | W971GG6JB-25L | W971GG6JB-25K | W971GG6JB-18 | W971GG6NB-25 |
|---|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Winbond | Winbond | Winbond | Winbond |
| Package | WBGA-84 (8x12.5 mm) | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 - same | WBGA-84 (8x12.5 mm) - same |
| Density | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Speed Grade | DDR2-800 (400 MHz) | DDR2-800 | DDR2-800 | DDR2-800 | DDR2-800 | DDR2-1066 (533 MHz) | DDR2-800 (400 MHz) |
| Organization | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Automotive AEC-Q100 | Industrial (low-power) | Automotive AEC-Q100 K-grade | Industrial (DDR2-1066) | Industrial |
| AEC-Q100 Qualified | No | No | Yes | No | Yes | No | No |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- Industrial temperature grade (not commercial) (vs W971GG6JB-25)
- Standard industrial speed (not automotive qualified) (vs W971GG6JB-25A)
- DDR2-800 speed grade (not DDR2-1066) (vs W971GG6JB-18)
Design Notes
Follow JEDEC DDR2 layout guidelines: route DQ/DQS as matched-length pairs (within +/-25 mil) with 50 ohm single-ended impedance to VTT (0.9 V). Keep trace lengths short and reference to a solid ground plane. Place VTT termination resistors at the midpoint of the bus, not at the controller. Decouple each VDD/VDDQ/VSSQ ball group with a 0.1 uF X7RCM711 ceramic plus a 10 uF bulk capacitor within 100 mil.
SSTL_18 signaling requires a VTT termination voltage of VDDQ/2 = 0.9 V generated by a high-current LDO or DDR termination regulator (e.g., TPS51200, LP2996). Enable on-die termination (ODT) on the W971GG6JB-25I via the mode register to reduce external component count. Use IBIS simulation to validate signal integrity on your specific stack-up, especially for backplane routing.
Do not assume -25I bin supports DDR2-1066 - the 'I' indicates industrial temperature, not higher speed. For DDR2-1066 operation, use the -18 bin. Also avoid confusing -25I (industrial) with -25A/-25K (AEC-Q100 automotive); they share the same die but differ in qualification. Finally, do not populate DDR2 without VTT - floating VTT causes bus errors and potential device damage.
Compliance Information
RoHS compliant per Winbond product page. Not AEC-Q100 qualified - use W971GG6JB-25A or -25K for automotive. Halogen-free per Winbond datasheet materials declaration.
