XCZU2EG-L1SBVA484I - Zynq UltraScale+ MPSoC SoC FPGA | AMD
부품 번호: XCZU2EG-L1SBVA484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $392 | $3,920.00 |
| 100 | $361 | $36,100.00 |
| 500 | $339 | $169,500.00 |
| 1,000 | $310 | $310,000.00 |
XCZU2EG-L1SBVA484I 개요
A System-on-Chip FPGA (SoC FPGA) integrates a processor subsystem and programmable fabric on a single die, enabling hardware acceleration, custom peripherals, and deterministic low-latency I/O alongside general-purpose operating systems. In the power management hierarchy, this SoC replaces multiple discrete components—MCU, DSP, FPGA, and GPU—with one programmable architecture that can adapt to evolving standards.
Key features include 103K+ FPGA logic cells, maximum operating frequencies of 500 MHz for the real-time processors, 600 MHz for the graphics/real-time complex, and 1.2 GHz for the application cores, plus CoreSight debug technology for full multicore trace and profiling. The L1 speed grade optimizes power efficiency, while the industrial temperature suffix (-I) supports -40°C operation.
Built on TSMC 16nm UltraScale+ technology, this SoC provides over 85K LUT equivalents in programmable logic plus high-bandwidth connectivity between ARM processors and fabric. The FCBGA package offers up to 396 user I/O and 4 multi-gigabit transceivers, enabling 10GbE, PCIe, and high-speed ADC interfaces.
Typical applications include advanced driver assistance (ADAS), machine vision cameras, 5G small cells, industrial controllers, and medical imaging. The 103K logic cells allow implementing vision pipelines, FFT engines, and custom motor-control loops. For edge AI, the Mali GPU and DSP engine accelerate typical neural-network kernels.
Designers should plan a power budget for VCCINT, VCCAUX, VCCO, and PS rails; use PMIC sequencing and adequate decoupling. The large BGA footprint requires multi-layer PCB routing and thermal vias to maintain junction temperature within limits.
드롭인 대체품: XCZU2EG-L1SBVA484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU2EG-1SBVA484E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU3EG-2SBVA484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU2CG-L1SBVA484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU1EG-L1SBVA484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU2EG-L1SBVA484E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU2EG-L1SBVA484I 최대 정격 & 전기적 특성
| Product Type | System On Chip (SoC) |
| Series | Zynq UltraScale+ MPSoC EG |
| Architecture | MCU + FPGA |
| Application Processor | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Logic Cells | 103K+ |
| Operating Frequencies | 500 MHz, 600 MHz, 1.2 GHz |
| 패키지 | 484-FCBGA (19x19) |
| 핀 수 | 484 |
| 실장 유형 | Surface Mount |
| Speed Grade | L1 |
| Temperature Grade | Industrial (-I) |
| Product Status | Active |
XCZU2EG-L1SBVA484I 484-fcbga (19x19) 핀 구성 가이드
XCZU2EG-L1SBVA484I(484-fcbga (19x19) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCZU2EG-L1SBVA484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCZU2EG-L1SBVA484I 적합 용도: 6 애플리케이션s: Embedded Vision and Machine Vision, Edge AI Inference, Industrial Automation and Motion Control, Software Defined Radio, ADAS and Autonomous Machines, Video Processing and Display Systems.
Embedded Vision and Machine Vision
The XCZU2EG-L1SBVA484I's 103K+ FPGA logic cells allow deploying real-time image pre-processing, sensor fusion, and color-space conversion directly in programmable fabric. Quad A53 cores run Linux-based vision algorithms while the Mali-400 GPU accelerates 2D overlays. Pairing with high-speed DDR4 such as MT40A512M16JY-075E provides sufficient frame buffering for 1080p cameras. The industrial temperature grade supports cameras installed in factory floors and outdoor environments.
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Edge AI Inference
For edge AI, the Zynq UltraScale+ architecture implements CNN accelerators in programmable logic, achieving higher TOPS/W than a GPU-only approach. The Mali-400 MP2 and A53 cluster handle post-processing and host communication. The device's 1.2 GHz A53 cores and 103K+ logic cells are sufficient for object detection, audio keyword spotting, and predictive maintenance. Using low-power DDR4 such as K4A8G085WB-BIWE reduces standby energy in battery-powered field devices.
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Industrial Automation and Motion Control
The dual Cortex-R5 processors provide deterministic real-time control for EtherCAT or PROFINET stacks, while FPGA logic implements high-speed PWM, quadrature encoder decoding, and safety interlocks. The XCZU2EG-L1SBVA484I can integrate motor-control loops and HMI graphics on one SoC, simplifying board design in PLCs and robotics. Industrial temperature operation and a 19x19 mm BGA package make it suitable for DIN-rail controllers. Companion STM32 MCUs handle safety monitoring and communication redundancy.
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Software Defined Radio
With 103K+ logic cells and high-speed transceivers, the XCZU2EG-L1SBVA484I implements DDC/DUC, FFT, and waveform filtering in fabric while A53 cores run protocol stacks. The Mali-400 GPU assists with spectral display and user interfaces. Its 1.2 GHz A53 cluster supports flexibility for cognitive radio algorithms. DDR4 such as MT40A512M16TD-062E buffers IQ samples at high throughput, and QNX or Linux RT can be deployed for deterministic PHY control.
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ADAS and Autonomous Machines
The industrial temperature grade of XCZU2EG-L1SBVA484I enables automotive-adjacent deployment in farm robots, drones, and outdoor logistics vehicles. The programmable logic processes camera and LiDAR data with low latency, while the Cortex-R5 cores provide ASIL-B/B+ capable real-time monitoring. A53 cores run perception software such as OpenCL. Use automotive-temperature memory like NT5AD512M16C4-JRI to maintain reliable operation from -40°C to +100°C.
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Video Processing and Display Systems
The Mali-400 MP2 GPU and UltraScale+ fabric together handle video scaling, overlay generation, color management, and encoding/decoding. Quad A53 cores run video analytics and streaming protocols. The 103K+ logic cells enable multi-channel capture up to 4K60. For video frame storage, K4A8G165WB-BIWE DDR4 provides ample bandwidth. The 484-FCBGA package permits compact video wall processors and medical display controllers.
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추천 제품 요약
엔지니어링 참조 데이터: XCZU2EG-L1SBVA484I — 비교, 설계 지침 및 규정 준수 정보.
대체품과의 비교
| 파라미터 | 이 제품 | XCZU2EG-1SBVA484E | XCZU3EG-2SBVA484I | XCZU2CG-L1SBVA484I |
|---|---|---|---|---|
| Package | 484-FCBGA (19x19) | 484-FCBGA (19x19) - same | 484-FCBGA (19x19) - same | 484-FCBGA (19x19) - same |
| Brand | AMD | AMD | AMD | AMD |
| Application Processor | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 |
| Real-Time Processor | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 |
| Speed / Temperature Grade | L1 / Industrial (-I) | -1 / Extended (-E) | -2 / Industrial (-I) | L1 / Industrial (-I) |
설계 노트
The XCZU2EG-L1SBVA484I can dissipate significant power during heavy FPGA utilization, especially when using transceivers and the Mali-400 GPU. The 484-FCBGA package has a limited thermal dissipation path through the substrate; use a thermal relief pad array, at least 8-12 thermal vias directly under the die area, and an active heat sink if junction temperature approaches the upper limit. Derate clock frequencies on L1 speed grade when operating continuously above 85°C ambient.
Zynq UltraScale+ MPSoCs require multiple power rails (VCCINT, VCCINT_IO, VCCAUX, VCCO_PS, VCCO_DDR, and VCCO). Use a PMIC or DC-DC regulators with proper power sequencing: VCCINT first, then VCCAUX, and finally VCCO rails. As per AMD UltraScale+ power guidelines, each rail should be decoupled with 4.7 uF to 10 uF ceramic capacitors per supply pin group, placed within 2 mm of the BGA balls. Verify transient response because L1 speed grade has reduced voltage guardbands.
The 484-FCBGA (19x19) package uses a 0.8 mm pitch, requiring blind/buried vias for fanout on dense designs. Route high-speed transceiver lanes as differential pairs with 100-ohm impedance, and keep DDR4 traces length-matched within +/-10 mils. Use the AMD package pinout files from UG1075 to assign pin locations. An 8-layer or more stackup is recommended for signal integrity and power integrity.
Do not forget to configure boot mode after first power-up; failure to pull the boot-mode pins correctly results in a non-booting device. The PS reference clock frequency must match the selected boot and DDR configurations. Also ensure the JTAG and CoreSight pins are accessible for debugging even in production boards. Boot image stored in QSPI flash should be updated using the AMD Xilinx bootgen tool.
