XCZU2EG-L1SBVA484I - Zynq UltraScale+ MPSoC SoC FPGA | AMD
MPN: XCZU2EG-L1SBVA484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $392 | $3,920.00 |
| 100 | $361 | $36,100.00 |
| 500 | $339 | $169,500.00 |
| 1,000 | $310 | $310,000.00 |
Drop-in alternatives for XCZU2EG-L1SBVA484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU2EG-1SBVA484E
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-2SBVA484I
β Drop-Inπ Reference alternative (not in catalog)
XCZU2CG-L1SBVA484I
β Drop-Inπ Reference alternative (not in catalog)
XCZU1EG-L1SBVA484I
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-L1SBVA484E
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-L1SBVA484I Maximum Ratings & Electrical Characteristics
| Product Type | System On Chip (SoC) |
| Series | Zynq UltraScale+ MPSoC EG |
| Architecture | MCU + FPGA |
| Application Processor | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Logic Cells | 103K+ |
| Operating Frequencies | 500 MHz, 600 MHz, 1.2 GHz |
| Package | 484-FCBGA (19x19) |
| Number of Pins | 484 |
| Mounting Type | Surface Mount |
| Speed Grade | L1 |
| Temperature Grade | Industrial (-I) |
| Operating Temperature | [DATA_NEEDED: operating temperature] |
| Supply Voltage | [DATA_NEEDED: supply voltage] |
| RoHS Status | [DATA_NEEDED: RoHS status] |
| Product Status | Active |
XCZU2EG-L1SBVA484I 484-fcbga (19x19) Pin Configuration Guide
Complete pinout information for XCZU2EG-L1SBVA484I (484-fcbga (19x19) package) with 484 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XCZU2EG-L1SBVA484I.
Refer to the datasheet for full pin configuration.
Estimated pin count: 484 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU2EG-L1SBVA484I is suitable for 6 applications: Embedded Vision and Machine Vision, Edge AI Inference, Industrial Automation and Motion Control, Software Defined Radio, ADAS and Autonomous Machines, Video Processing and Display Systems.
Embedded Vision and Machine Vision
The XCZU2EG-L1SBVA484I's 103K+ FPGA logic cells allow deploying real-time image pre-processing, sensor fusion, and color-space conversion directly in programmable fabric. Quad A53 cores run Linux-based vision algorithms while the Mali-400 GPU accelerates 2D overlays. Pairing with high-speed DDR4 such as MT40A512M16JY-075E provides sufficient frame buffering for 1080p cameras. The industrial temperature grade supports cameras installed in factory floors and outdoor environments.
Recommended
Edge AI Inference
For edge AI, the Zynq UltraScale+ architecture implements CNN accelerators in programmable logic, achieving higher TOPS/W than a GPU-only approach. The Mali-400 MP2 and A53 cluster handle post-processing and host communication. The device's 1.2 GHz A53 cores and 103K+ logic cells are sufficient for object detection, audio keyword spotting, and predictive maintenance. Using low-power DDR4 such as K4A8G085WB-BIWE reduces standby energy in battery-powered field devices.
Recommended
Industrial Automation and Motion Control
The dual Cortex-R5 processors provide deterministic real-time control for EtherCAT or PROFINET stacks, while FPGA logic implements high-speed PWM, quadrature encoder decoding, and safety interlocks. The XCZU2EG-L1SBVA484I can integrate motor-control loops and HMI graphics on one SoC, simplifying board design in PLCs and robotics. Industrial temperature operation and a 19x19 mm BGA package make it suitable for DIN-rail controllers. Companion STM32 MCUs handle safety monitoring and communication redundancy.
Recommended
Software Defined Radio
With 103K+ logic cells and high-speed transceivers, the XCZU2EG-L1SBVA484I implements DDC/DUC, FFT, and waveform filtering in fabric while A53 cores run protocol stacks. The Mali-400 GPU assists with spectral display and user interfaces. Its 1.2 GHz A53 cluster supports flexibility for cognitive radio algorithms. DDR4 such as MT40A512M16TD-062E buffers IQ samples at high throughput, and QNX or Linux RT can be deployed for deterministic PHY control.
Recommended
ADAS and Autonomous Machines
The industrial temperature grade of XCZU2EG-L1SBVA484I enables automotive-adjacent deployment in farm robots, drones, and outdoor logistics vehicles. The programmable logic processes camera and LiDAR data with low latency, while the Cortex-R5 cores provide ASIL-B/B+ capable real-time monitoring. A53 cores run perception software such as OpenCL. Use automotive-temperature memory like NT5AD512M16C4-JRI to maintain reliable operation from -40Β°C to +100Β°C.
Recommended
Video Processing and Display Systems
The Mali-400 MP2 GPU and UltraScale+ fabric together handle video scaling, overlay generation, color management, and encoding/decoding. Quad A53 cores run video analytics and streaming protocols. The 103K+ logic cells enable multi-channel capture up to 4K60. For video frame storage, K4A8G165WB-BIWE DDR4 provides ample bandwidth. The 484-FCBGA package permits compact video wall processors and medical display controllers.
Recommended
Recommended Products Summary
Engineering reference data for XCZU2EG-L1SBVA484I β comparison, design guidance, and compliance information.
Comparison with Alternatives
| Parameter | This Product | XCZU2EG-1SBVA484E | XCZU3EG-2SBVA484I | XCZU2CG-L1SBVA484I |
|---|---|---|---|---|
| Package | 484-FCBGA (19x19) | 484-FCBGA (19x19) - same | 484-FCBGA (19x19) - same | 484-FCBGA (19x19) - same |
| Brand | AMD | AMD | AMD | AMD |
| FPGA Logic Cells | 103K+ | 103K+ | [DATA_NEEDED: logic cells] | [DATA_NEEDED: logic cells] |
| Application Processor | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 | Quad ARM Cortex-A53 |
| Real-Time Processor | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 | Dual ARM Cortex-R5 |
| Graphics Processor | ARM Mali-400 MP2 | ARM Mali-400 MP2 | ARM Mali-400 MP2 | [DATA_NEEDED: graphics] |
| Speed / Temperature Grade | L1 / Industrial (-I) | -1 / Extended (-E) | -2 / Industrial (-I) | L1 / Industrial (-I) |
| Max Application Processor Frequency | 1.2 GHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Design Notes
The XCZU2EG-L1SBVA484I can dissipate significant power during heavy FPGA utilization, especially when using transceivers and the Mali-400 GPU. The 484-FCBGA package has a limited thermal dissipation path through the substrate; use a thermal relief pad array, at least 8-12 thermal vias directly under the die area, and an active heat sink if junction temperature approaches the upper limit. Derate clock frequencies on L1 speed grade when operating continuously above 85Β°C ambient.
Zynq UltraScale+ MPSoCs require multiple power rails (VCCINT, VCCINT_IO, VCCAUX, VCCO_PS, VCCO_DDR, and VCCO). Use a PMIC or DC-DC regulators with proper power sequencing: VCCINT first, then VCCAUX, and finally VCCO rails. As per AMD UltraScale+ power guidelines, each rail should be decoupled with 4.7 uF to 10 uF ceramic capacitors per supply pin group, placed within 2 mm of the BGA balls. Verify transient response because L1 speed grade has reduced voltage guardbands.
The 484-FCBGA (19x19) package uses a 0.8 mm pitch, requiring blind/buried vias for fanout on dense designs. Route high-speed transceiver lanes as differential pairs with 100-ohm impedance, and keep DDR4 traces length-matched within +/-10 mils. Use the AMD package pinout files from UG1075 to assign pin locations. An 8-layer or more stackup is recommended for signal integrity and power integrity.
Do not forget to configure boot mode after first power-up; failure to pull the boot-mode pins correctly results in a non-booting device. The PS reference clock frequency must match the selected boot and DDR configurations. Also ensure the JTAG and CoreSight pins are accessible for debugging even in production boards. Boot image stored in QSPI flash should be updated using the AMD Xilinx bootgen tool.
