10AS032E4F27I3LG vs 10AS048E1F29I1HG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032E4F27I3LG disebabkan oleh Intel dan 10AS048E1F29I1HG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10AS032E4F27I3LG 10AS048E1F29I1HG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 SX SoC FPGA Arria 10 SX SoC FPGA
Logic Elements 320,000 480,000
Hard Processor Subsystem (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Clock Frequency 1.5 GHz Up to 1.5 GHz
Speed Grade E4 (-4, mid-tier) —
Temperature Grade Industrial (-40C to +100C) —
Kemasan 672-pin FCBGA (F27, 27x27 mm) 780-ball FCBGA, 29x29 mm
Jenis Pemasangan Surface Mount Surface Mount (Flip-Chip BGA)
Status RoHS Compliant Compliant
Lead-Free Yes —
Aras MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] [DATA_NEEDED: MSL rating]
Process Technology 20 nm —
Transceivers Up to 24 channels, up to 14.1 Gbps (family-level) [DATA_NEEDED: transceiver count and data rate]
DSP Blocks Hardened floating-point DSP (family-level) [DATA_NEEDED: DSP block count]
Memory Interfaces DDR3 / DDR4 with hard controllers (family-level) —
Configuration Method JTAG, ASx4, FPP (family-level) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Process Node — 20 nm
Suhu Operasi — -40C to +100C (Industrial)
Number of Terminals — 780
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

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