10AS032E4F27I3LG vs 10AS048E1F29I1HG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032E4F27I3LG sa pamamagitan ng Intel at 10AS048E1F29I1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AS032E4F27I3LG 10AS048E1F29I1HG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 SX SoC FPGA Arria 10 SX SoC FPGA
Logic Elements 320,000 480,000
Hard Processor Subsystem (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Clock Frequency 1.5 GHz Up to 1.5 GHz
Speed Grade E4 (-4, mid-tier) —
Temperature Grade Industrial (-40C to +100C) —
Packhaging 672-pin FCBGA (F27, 27x27 mm) 780-ball FCBGA, 29x29 mm
Uri ng Pagpapasok Surface Mount Surface Mount (Flip-Chip BGA)
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] [DATA_NEEDED: MSL rating]
Process Technology 20 nm —
Transceivers Up to 24 channels, up to 14.1 Gbps (family-level) [DATA_NEEDED: transceiver count and data rate]
DSP Blocks Hardened floating-point DSP (family-level) [DATA_NEEDED: DSP block count]
Memory Interfaces DDR3 / DDR4 with hard controllers (family-level) —
Configuration Method JTAG, ASx4, FPP (family-level) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Process Node — 20 nm
Temperature na Operasyon — -40C to +100C (Industrial)
Number of Terminals — 780
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

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