10AX115U3F45E2LG vs 10AX115U2F45E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115U3F45E2LG disebabkan oleh Intel dan 10AX115U2F45E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115U3F45E2LG | 10AX115U2F45E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,560 |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | 2 |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 (variable-precision, hardened FP) |
| PCIe Hard IP | Gen3 x8/x16 | Gen3 x8 |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | DDR4, QDR-IV, RLDRAM3 |
| Suhu Operasi | 0C to +100C (Industrial, E2 grade) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| Process Node | — | 20 nm |
| Temperature Grade | — | E2 (industrial) |
| Kemasan | — | 1932-ball FCBGA (45 mm) |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |