10AX115U3F45E2LG vs 10AX115U2F45E2SG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U3F45E2LG sa pamamagitan ng Intel at 10AX115U2F45E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AX115U3F45E2LG 10AX115U2F45E2SG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Arria 10 GX —
Family Arria 10 Arria 10 GX
Logic Elements 1,150,000 1,150,000
Embedded Memory Bits 68,857,856 68,857,560
User I/O Count 480 —
Speed Grade U3 (medium-performance, transceiver-focused) 2
Package Code F45 (45 × 45 mm FCBGA) —
Package Type 1932-ball FCBGA (Flip-Chip BGA) —
Process Technology 20 nm TSMC —
Transceiver Data Rate Up to 28.05 Gbps —
DSP Blocks Variable-precision, 1.5 TFLOPs FP32 1,518 (variable-precision, hardened FP)
PCIe Hard IP Gen3 x8/x16 Gen3 x8
Memory Interfaces DDR4, DDR3, QDR IV, RLDRAM 3 DDR4, QDR-IV, RLDRAM3
Temperature na Operasyon 0C to +100C (Industrial, E2 grade) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Configuration Method SRAM-based, loaded via JTAG / AS / PS —
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes —
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory Blocks — 2,134 M20K blocks (approx.)
User I/Os — 480
Transceivers — Up to 24 (GX, 12.5 Gbps)
Process Node — 20 nm
Temperature Grade — E2 (industrial)
Packhaging — 1932-ball FCBGA (45 mm)
Configuration Memory — SRAM-based (volatile, requires config device)

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