10AX115U3F45E2SG vs 10AX115U3F45E2LG Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115U3F45E2SG disebabkan oleh Intel dan 10AX115U3F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10AX115U3F45E2SG 10AX115U3F45E2LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 GX Arria 10
Logic Elements (LE) 1,150,000 —
Adaptive Logic Modules (ALM) 427,200 —
Embedded Memory Bits 68,857,856 (≈ 52.99 Mbit) 68,857,856
Number of Transceivers [DATA_NEEDED: per-die transceiver count, F45 package variant] —
Maximum Transceiver Data Rate 17.4 Gbps —
DSP Blocks Variable-precision, hardened floating-point Variable-precision, 1.5 TFLOPs FP32
Hard Memory Controllers 2 (DDR4/DDR3/QDRII+/RLDRAM3) —
Hard PCIe Gen3 IP Blocks 2 × PCIe Gen3 (x8/x4/x2/x1) —
Kemasan 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) —
Process Node 20 nm Tri-Gate (Intel) —
Speed Grade -2 (E2 commercial/extended) U3 (medium-performance, transceiver-focused)
Suhu Operasi Industrial (junction -40 °C to +100 °C) – device grade U 0C to +100C (Industrial, E2 grade)
Supply Voltage Core [DATA_NEEDED: VCC/VCCP core voltage] —
Configuration Method FPGA configuration via serial/parallel flash, JTAG SRAM-based, loaded via JTAG / AS / PS
RoHS Compliance Compliant —
Aras MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Series — Arria 10 GX
Logic Elements — 1,150,000
User I/O Count — 480
Package Code — F45 (45 × 45 mm FCBGA)
Package Type — 1932-ball FCBGA (Flip-Chip BGA)
Process Technology — 20 nm TSMC
Transceiver Data Rate — Up to 28.05 Gbps
PCIe Hard IP — Gen3 x8/x16
Memory Interfaces — DDR4, DDR3, QDR IV, RLDRAM 3
Jenis Pemasangan — Surface Mount (BGA)
Status RoHS — Compliant
Lead-Free / Halogen-Free — Yes / Yes

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