10AX115U3F45E2SG vs 10AX115U3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U3F45E2SG sa pamamagitan ng Intel at 10AX115U3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115U3F45E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1932-FCBGA
10AX115U3F45E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115U3F45E2SG | 10AX115U3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 (≈ 52.99 Mbit) | 68,857,856 |
| Number of Transceivers | [DATA_NEEDED: per-die transceiver count, F45 package variant] | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, hardened floating-point | Variable-precision, 1.5 TFLOPs FP32 |
| Hard Memory Controllers | 2 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| Hard PCIe Gen3 IP Blocks | 2 × PCIe Gen3 (x8/x4/x2/x1) | — |
| Packhaging | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Speed Grade | -2 (E2 commercial/extended) | U3 (medium-performance, transceiver-focused) |
| Temperature na Operasyon | Industrial (junction -40 °C to +100 °C) – device grade U | 0C to +100C (Industrial, E2 grade) |
| Supply Voltage Core | [DATA_NEEDED: VCC/VCCP core voltage] | — |
| Configuration Method | FPGA configuration via serial/parallel flash, JTAG | SRAM-based, loaded via JTAG / AS / PS |
| RoHS Compliance | Compliant | — |
| Level ng MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Series | — | Arria 10 GX |
| Logic Elements | — | 1,150,000 |
| User I/O Count | — | 480 |
| Package Code | — | F45 (45 × 45 mm FCBGA) |
| Package Type | — | 1932-ball FCBGA (Flip-Chip BGA) |
| Process Technology | — | 20 nm TSMC |
| Transceiver Data Rate | — | Up to 28.05 Gbps |
| PCIe Hard IP | — | Gen3 x8/x16 |
| Memory Interfaces | — | DDR4, DDR3, QDR IV, RLDRAM 3 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Tindminan RoHS | — | Compliant |
| Lead-Free / Halogen-Free | — | Yes / Yes |