10M08DAF484C8G vs 10M25DAF484A7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DAF484C8G disebabkan oleh Intel dan 10M25DAF484A7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DAF484C8G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 8000 | — |
| Embedded Memory | 387,072 bits (378 Kbits) | 1,728 Kbits |
| User Flash | 1,540 Kbits | — |
| Maximum User I/O | 250 | 360 |
| ADC | 8-channel, 12-bit | — |
| PLLs | 2 | 2 (general-purpose) |
| Process Technology | 55 nm | 55 nm non-volatile |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Kemasan | 484-ball FBGA (FineLine BGA) | 484-ball Plastic BGA (S-PBGA-B484) |
| Speed Grade | -C8 | A7 |
| Suhu Hubungan Operasi | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | Internal dual-boot flash (no external PROM) |
| DSP Blocks | Yes | Up to 25 (18x18 MAC) |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements | — | 25,000 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| Tegangan Pemberi Arus | — | 3.3 V or 1.8 V single supply |
| Jenis Pemasangan | — | Surface Mount |