10M08DAF484C8G vs 10M25DAF484A7P Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAF484C8G sa pamamagitan ng Intel at 10M25DAF484A7P sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAF484C8G | 10M25DAF484A7P |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements (LE) | 8000 | — |
| Embedded Memory | 387,072 bits (378 Kbits) | 1,728 Kbits |
| User Flash | 1,540 Kbits | — |
| Maximum User I/O | 250 | 360 |
| ADC | 8-channel, 12-bit | — |
| PLLs | 2 | 2 (general-purpose) |
| Process Technology | 55 nm | 55 nm non-volatile |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball Plastic BGA (S-PBGA-B484) |
| Speed Grade | -C8 | A7 |
| Temperature ng Junction na Operasyon | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | Internal dual-boot flash (no external PROM) |
| DSP Blocks | Yes | Up to 25 (18x18 MAC) |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements | — | 25,000 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| Volte ng Pagbibigay | — | 3.3 V or 1.8 V single supply |
| Uri ng Pagpapasok | — | Surface Mount |