5CGXBC9A6U19C7N vs 5CGXBC5C7F27C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CGXBC9A6U19C7N disebabkan oleh Intel dan 5CGXBC5C7F27C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 5CGXBC9A6U19C7N | 5CGXBC5C7F27C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V GX | Cyclone® V GX |
| Logic Elements | 77000 | — |
| Logic Array Blocks (LABs) | 29080 | — |
| Total Registers | 301000 | — |
| Embedded Memory (M9K blocks) | 14251008 bits (4,460 Kbits) | — |
| Kemasan | 484-FBGA (U19, FineLine BGA) | 672-pin FBGA (F27, 27 mm × 27 mm) |
| Number of Terminals | 484 | — |
| Tegangan Pemberi Arus Operasi | 1.1 V (core), per datasheet | — |
| Gambaran Suhu Operasi | 0°C to +85°C (commercial, C7) | — |
| Speed Grade | C7 | — |
| PLLs | 6 | 6 |
| Transceivers | Integrated (per U19 484-FBGA variant) | 6 × 3.125 Gbps (GX) |
| Lead Free | Yes (N suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Process Technology | TSMC 28 nm low-power | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 77,000 |
| Adaptive Logic Modules (ALM) | — | 29,080 |
| Total Embedded Memory | — | 5,001,216 bits (4,884 Kbits usable) |
| Embedded Memory Blocks (M10K + MLAB) | — | 446 × M10K + 231 × MLAB (approx.) |
| 18 × 18 Multipliers | — | 364 |
| Global Clock Networks | — | 16 |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Maximum User I/O | — | [DATA_NEEDED: maximum user I/O count] |
| Core Voltage | — | 1.1 V |
| Process Node | — | 28 nm TSMC low-power |
| Suhu Operasi | — | 0 °C to +85 °C (commercial, C8) |
| Configuration | — | JTAG (IEEE 1149.1) + Active Serial |