EDB1332BDBH-1DAUT-F-D vs EDB5432BEBH-1DAUT-F-D Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EDB1332BDBH-1DAUT-F-D disebabkan oleh Micron Technology dan EDB5432BEBH-1DAUT-F-D disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
EDB1332BDBH-1DAUT-F-D - 1Gbit LPDDR2 533MHz | Micron
EDB1332BDBH-1DAUT-F-D ✓ AktifMicron Technology
EDB5432BEBH-1DAUT-F-D - 512Mb LPDDR2 DRAM 533MHz | Micron
EDB5432BEBH-1DAUT-F-D ✓ AktifPengandingan Spesifikasi
| Parametr | EDB1332BDBH-1DAUT-F-D | EDB5432BEBH-1DAUT-F-D |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | $2.16 | — |
| Jenis Ingatan | SDRAM - Mobile LPDDR2 | Mobile LPDDR2 SDRAM |
| Saiz Ingatan | 1 Gbit | 512 Mbit |
| Organisasi | 32M x 32 | 16M x 32 |
| Antaramuka | Parallel | Parallel |
| Clock Frequency | 533 MHz | 533 MHz |
| Core Supply Voltage | 1.2 V | — |
| Supply Voltage Range | 1.14 V to 1.95 V | 1.14 V to 1.95 V |
| Access Mode | Single Bank Page Burst | — |
| Kemasan | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) |
| Number of Terminals | 134 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | Automotive |
| Package Shape | Rectangular | Rectangular |
| Packaging Suffix | -D (Dry Pack) | — |
| Moisture Sensitivity | Dry Pack (per -D suffix) | — |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | — | 1.2 V (typical, LPDDR2) |
| Terminals | — | 134 balls |
| Terminal Form | — | Ball (VFBGA) |
| RoHS Code | — | Yes (D suffix, lead-free) |
| Part Life Cycle Code | — | Active |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| Standard Qty per Reel/Tray | — | [DATA_NEEDED: packaging standard quantity] |