EP1S25F672C6 vs EP1S25F672C5N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S25F672C6 disebabkan oleh Intel dan EP1S25F672C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1S25F672C6 EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1S25F672C6 EP1S25F672C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family Stratix Stratix
Logic Elements 25,660 —
Configurable Logic Blocks (CLBs) 2,852 —
Total RAM Bits 1,944,576 —
DSP Blocks 14 —
Maximum User I/O 473 —
Kemasan 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) —
Core Voltage 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS
Suhu Operasi 0C to +85C (Commercial) —
Logic Family CMOS —
Speed Grade 6 C5
Configuration Method JTAG, Passive Serial, Fast Passive Parallel, Active Serial SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS Compliant Compliant
PLL Count (Maximum) 12 (including enhanced PLLs) —
Series — EP1S25
Logic Elements (Cells) — 25,660
Number of CLBs — 2,566
Number of Logic Cells / Gates — [DATA_NEEDED: total system gates]
Maximum Internal Frequency — 500 MHz
Core Supply Voltage — 1.5 V (nominal)
Number of I/O Pins — 473 user I/O
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Package Type — FineLine BGA (FBGA)
Package Pin Count — 672
Ball Pitch — 1.00 mm
Gambaran Suhu Operasi — 0 °C to +85 °C (commercial)
Lead-Free (Pb-Free) — Yes (suffix "N")

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga