EP1SGX25DF800I6N vs EP1SGX25DF672C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF800I6N disebabkan oleh Intel dan EP1SGX25DF672C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1SGX25DF672C7N EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1SGX25DF800I6N EP1SGX25DF672C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Family Stratix GX —
Logic Elements [DATA_NEEDED: logic element count] 25,660
Transceiver Channels 4 to 20 channels —
Maximum Transceiver Data Rate 3.1875 Gbps per channel —
CDR / SERDES Embedded clock-data recovery and SERDES —
Memory TriMatrix memory, up to 2 Mbits —
DSP Blocks Up to 22 DSP blocks —
Hard IP PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) —
Source-Synchronous Channels 8 channels —
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Kemasan 800-pin FineLine BGA (DF800) 672-ball FineLine BGA (FBGA-672)
Speed Grade -6 (production grade) C7
Temperature Range Industrial -40C to +100C —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Protocol Support Gigabit Ethernet, SONET/SDH, PCI Express, custom serial —
Series — Stratix GX
Embedded Memory — 1,944,576 bits
Maximum User I/O — 455
Number of Transceivers — 4
Transceiver Data Rate (Max) — 3.125 Gbps
Core Supply Voltage — 1.5 V
Process Technology — 130 nm CMOS
Suhu Operasi — 0 °C to 85 °C (Commercial)
Package Dimensions — 33 × 33 mm, 1 mm pitch
Jenis Pemasangan — Surface Mount (BGA)
Lead-Free / RoHS — Yes (lead-free, per datasheet)

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