EP1SGX25DF800I6N vs EP1SGX25DF672C7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF800I6N sa pamamagitan ng Intel at EP1SGX25DF672C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP1SGX25DF672C7N EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera

EP1SGX25DF672C7N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP1SGX25DF800I6N EP1SGX25DF672C7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Family Stratix GX —
Logic Elements [DATA_NEEDED: logic element count] 25,660
Transceiver Channels 4 to 20 channels —
Maximum Transceiver Data Rate 3.1875 Gbps per channel —
CDR / SERDES Embedded clock-data recovery and SERDES —
Memory TriMatrix memory, up to 2 Mbits —
DSP Blocks Up to 22 DSP blocks —
Hard IP PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) —
Source-Synchronous Channels 8 channels —
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Packhaging 800-pin FineLine BGA (DF800) 672-ball FineLine BGA (FBGA-672)
Speed Grade -6 (production grade) C7
Temperature Range Industrial -40C to +100C —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Protocol Support Gigabit Ethernet, SONET/SDH, PCI Express, custom serial —
Series — Stratix GX
Embedded Memory — 1,944,576 bits
Maximum User I/O — 455
Number of Transceivers — 4
Transceiver Data Rate (Max) — 3.125 Gbps
Core Supply Voltage — 1.5 V
Process Technology — 130 nm CMOS
Temperature na Operasyon — 0 °C to 85 °C (Commercial)
Package Dimensions — 33 × 33 mm, 1 mm pitch
Uri ng Pagpapasok — Surface Mount (BGA)
Lead-Free / RoHS — Yes (lead-free, per datasheet)

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