EP2A25F672C8N vs EP2A25F672I6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C8N disebabkan oleh Intel dan EP2A25F672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C8N | EP2A25F672I6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | — |
| User I/Os | 492 | — |
| Kemasan | 672-ball FC-FBGA (FineLine BGA) | 672-ball FineLine BGA (FBGA-672) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | 6 |
| Suhu Operasi | 0 C to 85 C (commercial) | — |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Process Technology | — | 0.18 µm CMOS |
| Core Voltage | — | 1.5 V |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| Embedded Memory | — | Embedded System Blocks (ESB), dual-port RAM / CAM |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |