EP2A25F672C8N vs EP2A25F672I6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C8N sa pamamagitan ng Intel at EP2A25F672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672C8N EP2A25F672I6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family APEX II APEX II
Technology Node 0.15 um all-layer copper process —
System Gates 900,000 —
Logic Elements / Cells 24,320 —
Maximum Internal Frequency 333 MHz —
Propagation Delay 1.69 ns —
User I/Os 492 —
Packhaging 672-ball FC-FBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Package Body Size 27 x 27 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage 1.5 V —
Speed Grade C8 6
Temperature na Operasyon 0 C to 85 C (commercial) —
Multi-Gigabit Transceiver Rate Up to 1 Gbps per channel —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Tindminan RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Suffix N (lead-free, Pb-free finish) —
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Process Technology — 0.18 µm CMOS
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Embedded Memory — Embedded System Blocks (ESB), dual-port RAM / CAM
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
Level ng MSL — [DATA_NEEDED: moisture sensitivity level]

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