EP2AGX125DF25I3G vs EP2AGX125DF25C6G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX125DF25I3G disebabkan oleh Intel dan EP2AGX125DF25C6G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2AGX125DF25I3G | EP2AGX125DF25C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | — |
| Embedded Memory | 8,315,904 bits | — |
| Number of I/O | 260 | — |
| Kemasan | 572-BGA, FCBGA (Flip-Chip FineLine BGA) | 572-BGA, FCBGA (HBGA) |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| Transceivers | Up to 12 (3.75 Gbps per channel) | — |
| Suhu Operasi | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Tegangan Pemberi Arus | 0.9 V core | — |
| DSP Blocks | 18x18 multipliers | — |
| Aras MSL | [DATA_NEEDED: MSL Level] | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| DSP Blocks (18x18 Multipliers) | — | 260 |
| Number of Logic Elements / Cells | — | 8315904 |
| Total RAM Bits | — | 8315904 |
| Number of Terminals | — | 572 |
| Package Code | — | HBGA |
| Package Shape | — | Square |
| Form of Terminal | — | Ball |
| Speed Grade | — | C6 |