EP2AGX125DF25I3G vs EP2AGX125DF25C6G 比較
詳細並排比較 EP2AGX125DF25I3G 由 Intel 與 EP2AGX125DF25C6G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ 最後購買機會規格比較
| 參數 | EP2AGX125DF25I3G | EP2AGX125DF25C6G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Series | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | — |
| Embedded Memory | 8,315,904 bits | — |
| Number of I/O | 260 | — |
| 封裝 | 572-BGA, FCBGA (Flip-Chip FineLine BGA) | 572-BGA, FCBGA (HBGA) |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| Transceivers | Up to 12 (3.75 Gbps per channel) | — |
| 工作溫度 | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| 安裝類型 | Surface Mount | Surface Mount |
| 供應電壓 | 0.9 V core | — |
| DSP Blocks | 18x18 multipliers | — |
| MSL 等級 | [DATA_NEEDED: MSL Level] | — |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements (LEs) | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| DSP Blocks (18x18 Multipliers) | — | 260 |
| Number of Logic Elements / Cells | — | 8315904 |
| Total RAM Bits | — | 8315904 |
| Number of Terminals | — | 572 |
| Package Code | — | HBGA |
| Package Shape | — | Square |
| Form of Terminal | — | Ball |
| Speed Grade | — | C6 |