EP2AGX125EF29I3G vs EP2AGX125DF25I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX125EF29I3G disebabkan oleh Intel dan EP2AGX125DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2AGX125EF29I3G | EP2AGX125DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Programmable Logic | 118143 logic elements | — |
| Programmable Bits | 8315904 bits | — |
| User I/O | 372 I/O | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | HBGA | — |
| Terminal Count | 780 terminals | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Tegangan Pemberi Arus | 0.9 V | 0.9 V core |
| Temperature Grade | Industrial | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Technology | FPGA programmable logic | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Kemasan | — | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| DSP Blocks | — | 18x18 multipliers |
| Aras MSL | — | [DATA_NEEDED: MSL Level] |