EP2AGX125EF29I3G vs EP2AGX125DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29I3G sa pamamagitan ng Intel at EP2AGX125DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2AGX125EF29I3G | EP2AGX125DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Programmable Logic | 118143 logic elements | — |
| Programmable Bits | 8315904 bits | — |
| User I/O | 372 I/O | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | HBGA | — |
| Terminal Count | 780 terminals | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Volte ng Pagbibigay | 0.9 V | 0.9 V core |
| Temperature Grade | Industrial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Technology | FPGA programmable logic | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Packhaging | — | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| DSP Blocks | — | 18x18 multipliers |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |