EP2AGZ225FF35C4G vs EP2AGZ300FF35C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225FF35C4G disebabkan oleh Intel dan EP2AGZ300FF35C4N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ225FF35C4G EP2AGZ300FF35C4N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Device Type Field Programmable Gate Array (FPGA) —
Manufacturer Intel —
Product Family FPGA —
User I/O 554 I/O —
Kemasan 1152FBGA —
Package Type Fine-pitch ball grid array 1152-BBGA, FCBGA (flip-chip)
Logic Elements [DATA_NEEDED: logic element count] 298,000
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
DSP Blocks [DATA_NEEDED: DSP block count] [DATA_NEEDED: number of DSP blocks]
Transceivers [DATA_NEEDED: transceiver count] Multi-gigabit transceivers integrated
Suhu Operasi [DATA_NEEDED: operating temperature range] —
Tegangan Pemberi Arus [DATA_NEEDED: supply voltage] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Configuration Method [DATA_NEEDED: configuration method] —
Status RoHS unknown Compliant (per Besenchips / DigiKey listing)
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Lead-Free Status unknown Lead free (per Besenchips listing)
Halogen-Free Status unknown —
Series — Arria II GZ
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Process Technology — 40 nm
Core Voltage — 0.9 V
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
PLLs — [DATA_NEEDED: PLL count]
Jenis Pemasangan — Surface Mount
Maximum Operating Frequency — 500 MHz

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