EP2AGZ225FF35C4G vs EP2AGZ300FF35C4N Karşılaştırma

Ayrıntılı yan yana karşılaştırma EP2AGZ225FF35C4G tarafından Intel ve EP2AGZ300FF35C4N tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Özellik Karşılaştırması

Parametre EP2AGZ225FF35C4G EP2AGZ300FF35C4N
Marka Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Obsolete
Device Type Field Programmable Gate Array (FPGA) —
Manufacturer Intel —
Product Family FPGA —
User I/O 554 I/O —
Paket 1152FBGA —
Package Type Fine-pitch ball grid array 1152-BBGA, FCBGA (flip-chip)
Logic Elements [DATA_NEEDED: logic element count] 298,000
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
DSP Blocks [DATA_NEEDED: DSP block count] [DATA_NEEDED: number of DSP blocks]
Transceivers [DATA_NEEDED: transceiver count] Multi-gigabit transceivers integrated
İşletim Sıcaklığı [DATA_NEEDED: operating temperature range] —
Besleme Gerilimi [DATA_NEEDED: supply voltage] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Configuration Method [DATA_NEEDED: configuration method] —
RoHS Durumu unknown Compliant (per Besenchips / DigiKey listing)
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Lead-Free Status unknown Lead free (per Besenchips listing)
Halogen-Free Status unknown —
Series — Arria II GZ
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Process Technology — 40 nm
Core Voltage — 0.9 V
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
PLLs — [DATA_NEEDED: PLL count]
Montaj Türü — Surface Mount
Maximum Operating Frequency — 500 MHz

Dökümanlar & Kaynaklar

Tüm Ürünleri Gözden Geçir BOM Oluştur Teklif İsteyin