EP2AGZ300FH29I3N vs EP2AGZ300FH29I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FH29I3N disebabkan oleh Intel dan EP2AGZ300FH29I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FH29I3N | EP2AGZ300FH29I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory | 18,854,912 bits | — |
| User I/O Pins | 281 | — |
| Transceivers | 12 | Embedded multi-gigabit transceivers (per family) |
| Max Transceiver Speed | 6.375 Gbps | — |
| Process Node | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | — |
| Kemasan | 780-FCBGA (H-BGA, 29x29 mm) | — |
| Speed Grade | I3 | I4 |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| PLLs | 8 (4 general-purpose + 4 transceiver) | — |
| Global Clock Networks | 16 | — |
| Status RoHS | Compliant | Compliant |
| Status Lingkungan Hidup | End of Life (EOL) | — |
| Logic Elements (LE) | — | 300,000 (approx., per family member) |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Gambaran Suhu Operasi | — | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes (per RoHS) |