EP2S130F1020C3 vs EP2S130F1020I4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S130F1020C3 disebabkan oleh Intel dan EP2S130F1020I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2S130F1020C3 EP2S130F1020I4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series Stratix II —
Family Stratix II Stratix II
Logic Elements / Cells 132,540 —
Logic Array Blocks (LABs) 6,627 —
User I/Os 742 —
Embedded Memory (TriMatrix) [DATA_NEEDED: total Mbits] —
DSP / Multiplier Blocks [DATA_NEEDED: DSP block count] —
Transceivers Logic-rich SKU (no transceiver; transceiver variants use different suffix) —
Maximum Internal Frequency 778.82 MHz (per family datasheet) —
Process Technology 90 nm —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
Kemasan / Case 1020-BBGA (FC-FBGA), 33x33 mm —
Supplier Device Package 1020-FBGA (33x33) —
Jenis Pemasangan Surface Mount Surface Mount (FC-FBGA)
Suhu Operasi 0C to +85C (commercial, 'C' speed grade) —
Speed Grade C3 (commercial, -3 speed) I (industrial performance)
Status RoHS [DATA_NEEDED: RoHS status] Compliant (per distributor listings)
Aras MSL [DATA_NEEDED: MSL level] —
Logic Elements — 132,540
Equivalent LEs — ~180,000
Adaptive Logic Modules (ALMs) — 53,016
Embedded Memory (bits) — 6,747,840
Embedded Memory (M512 blocks) — 530
Embedded Memory (M4K blocks) — 768
Embedded Memory (M-RAM blocks) — 4
Embedded 18x18 Multipliers — 504
DSP Blocks — 48
User I/O Pins — 742
User I/O Banks — 12
Kemasan — 1020-ball FC-FBGA (33x33 mm)
Process Node — 90 nm CMOS, all-layer copper
Core Voltage (VCCINT) — 1.2 V
Device Revision — 4
Suhu Hubungan Operasi — -40C to +100C (industrial)
Configuration Scheme — Fast Passive Parallel x8, Passive Serial, JTAG

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