EP2S130F1020C3 vs EP2S130F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020C3 sa pamamagitan ng Intel at EP2S130F1020I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1020C3 | EP2S130F1020I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix II | — |
| Family | Stratix II | Stratix II |
| Logic Elements / Cells | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/Os | 742 | — |
| Embedded Memory (TriMatrix) | [DATA_NEEDED: total Mbits] | — |
| DSP / Multiplier Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) | — |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Packhaging / Kaso | 1020-BBGA (FC-FBGA), 33x33 mm | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FC-FBGA) |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' speed grade) | — |
| Speed Grade | C3 (commercial, -3 speed) | I (industrial performance) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Packhaging | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Device Revision | — | 4 |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |