EP2SGX30DF780I7N vs EP2SGX30DF780I5N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I7N disebabkan oleh Intel dan EP2SGX30DF780I5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX30DF780I7N EP2SGX30DF780I5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix II GX —
Family Stratix II GX (Enhanced Configuration / EPC) Stratix II GX
Logic Elements 33,880 LEs —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 1,369,728 bits —
Total RAM Blocks M512/M4K/M-RAM TriMatrix —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Maximum User I/O 586 user I/O pins —
Multi-Gigabit Transceivers (MGTs) Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps —
MGT Protocols Supported PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE —
Kemasan 780-ball FineLine BGA —
Core Voltage 1.2 V (typical) 1.2 V
Process Technology 90 nm 90 nm CMOS
Suhu Operasi -40C to +100C (Industrial) -40C to +85C (Industrial)
Speed Grade 7 (fastest commercial speed grade) I5
Configuration Mode Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: RoHS compliance] —
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Logic Cells — 33,880 (33,380 logic elements)
Logic Array Blocks (LABs) — 33,880
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

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