EP2SGX30DF780I7N vs EP2SGX30DF780I5N 比較

詳細並排比較 EP2SGX30DF780I7N 由 Intel 與 EP2SGX30DF780I5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX30DF780I7N EP2SGX30DF780I5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Series Stratix II GX —
Family Stratix II GX (Enhanced Configuration / EPC) Stratix II GX
Logic Elements 33,880 LEs —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 1,369,728 bits —
Total RAM Blocks M512/M4K/M-RAM TriMatrix —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Maximum User I/O 586 user I/O pins —
Multi-Gigabit Transceivers (MGTs) Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps —
MGT Protocols Supported PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE —
封裝 780-ball FineLine BGA —
Core Voltage 1.2 V (typical) 1.2 V
Process Technology 90 nm 90 nm CMOS
工作溫度 -40C to +100C (Industrial) -40C to +85C (Industrial)
Speed Grade 7 (fastest commercial speed grade) I5
Configuration Mode Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel —
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS compliance] —
MSL 等級 [DATA_NEEDED: moisture sensitivity level] —
Logic Cells — 33,880 (33,380 logic elements)
Logic Array Blocks (LABs) — 33,880
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

資料表與資源

瀏覽所有產品 建立 BOM 索取報價