EP2SGX30DF780I7N vs EP2SGX30DF780I5N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780I7N sa pamamagitan ng Intel at EP2SGX30DF780I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780I7N EP2SGX30DF780I5N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Series Stratix II GX —
Family Stratix II GX (Enhanced Configuration / EPC) Stratix II GX
Logic Elements 33,880 LEs —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 1,369,728 bits —
Total RAM Blocks M512/M4K/M-RAM TriMatrix —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Maximum User I/O 586 user I/O pins —
Multi-Gigabit Transceivers (MGTs) Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps —
MGT Protocols Supported PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE —
Packhaging 780-ball FineLine BGA —
Core Voltage 1.2 V (typical) 1.2 V
Process Technology 90 nm 90 nm CMOS
Temperature na Operasyon -40C to +100C (Industrial) -40C to +85C (Industrial)
Speed Grade 7 (fastest commercial speed grade) I5
Configuration Mode Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS compliance] —
Level ng MSL [DATA_NEEDED: moisture sensitivity level] —
Logic Cells — 33,880 (33,380 logic elements)
Logic Array Blocks (LABs) — 33,880
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

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